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    MOBILE TERMINAL AND CONTROL METHOD THEREOF
    3.
    发明申请
    MOBILE TERMINAL AND CONTROL METHOD THEREOF 审中-公开
    移动终端及其控制方法

    公开(公告)号：US20160006864A1

    公开(公告)日：2016-01-07

    申请号：US14771610

    申请日：2014-03-07

    Applicant: LG ELECTRONICS INC.

    Inventor： Hyuntaek PARK ,  Jinah KANG ,  Bongseok CHOI

    IPC: H04M1/725 ,  G06F3/0484 ,  G06F3/0488 ,  G06F3/0481

    CPC classification number: H04M1/72583 ,  G06F3/04817 ,  G06F3/04842 ,  G06F3/0488 ,  G06F16/954 ,  H04M1/7253 ,  H04N21/4126 ,  H04N21/41407 ,  H04N21/42224 ,  H04N21/43615 ,  H04N21/4622 ,  H04N21/47202 ,  H04N21/4782 ,  H04N21/4786 ,  H04N21/4788 ,  H04N21/4828 ,  H04N21/632 ,  H04N21/64322 ,  H04N21/8586

    Abstract: The present disclosure relates to a mobile terminal capable of performing bidirectional communication with an image display device, and a control method thereof. A mobile terminal according to one exemplary embodiment includes a wireless communication unit that is configured to perform bidirectional communication with an image display device and perform pairing with the image display device, a display unit that is configured to display a content thereon, and a controller that is configured to execute an application in response to a preset touch input being sensed on the content, and transmit a uniform resource locator (URL) corresponding to the content to the image display device, such that the content can be output on the image display device, when a preset icon is selected from icons displayed on an execution screen of the application.

    Abstract translation: 本公开涉及能够与图像显示装置进行双向通信的移动终端及其控制方法。 根据一个示例性实施例的移动终端包括被配置为执行与图像显示装置的双向通信并且与图像显示装置执行配对的无线通信单元，被配置为在其上显示内容的显示单元和控制器， 被配置为响应于在内容上感测到的预设触摸输入来执行应用，并且将与内容相对应的统一资源定位符（URL）发送到图像显示装置，使得可以在图像显示装置上输出内容 当从应用程序的执行画面上显示的图标中选择预设图标时。

    DISPLAY DEVICE COMPRISING SEMICONDUCTOR LIGHT EMITTING ELEMENT
    4.
    发明公开
    DISPLAY DEVICE COMPRISING SEMICONDUCTOR LIGHT EMITTING ELEMENT 审中-公开

    公开(公告)号：US20230215845A1

    公开(公告)日：2023-07-06

    申请号：US18009470

    申请日：2020-06-12

    Applicant: LG ELECTRONICS INC.

    Inventor： Taesu OH ,  Joonkwon MOON ,  Sungjin PARK ,  Bongseok CHOI

    IPC: H01L25/075

    CPC classification number: H01L25/0753

    Abstract: An embodiment relates to a display device comprising a semiconductor light-emitting device. A display device comprising a semiconductor light-emitting device, according to an embodiment, can comprise: a main pixel group including a plurality of main pixels; and a shared redundancy pixel including a plurality of shared light-emitting devices arranged between and on the periphery of the plurality of main pixels. The main pixel group can comprise the plurality of main pixels, each of which includes a first semiconductor light-emitting device, a second semiconductor light-emitting device, and a third semiconductor light-emitting device. The shared redundancy pixel can comprise: first group shared light-emitting devices arranged between the plurality of main pixels; and second shared light-emitting devices arranged on the periphery of the plurality of main pixels.

    DISPLAY APPARATUS
    5.
    发明申请
    DISPLAY APPARATUS 有权

    公开(公告)号：US20220375894A1

    公开(公告)日：2022-11-24

    申请号：US17742239

    申请日：2022-05-11

    Applicant: LG ELECTRONICS INC.

    Inventor： Taesu OH ,  Joonkwon MOON ,  Sungjin PARK ,  Bongseok CHOI

    IPC: H01L23/00 ,  H01L25/16

    Abstract: A display device includes a substrate including a plurality of pixels, a plurality of protrusions on the substrate, an adhesive layer on the substrate, and a plurality of semiconductor light emitting devices on the adhesive layer. The semiconductor light emitting devices can be disposed in a pixel among the plurality of pixels, and the plurality of protrusions can be disposed around the plurality of semiconductor light emitting devices in the pixel.

    SEMICONDUCTOR LIGHT-EMITTING DEVICE PACKAGE AND DISPLAY DEVICE COMPRISING SAME
    6.
    发明公开
    SEMICONDUCTOR LIGHT-EMITTING DEVICE PACKAGE AND DISPLAY DEVICE COMPRISING SAME 审中-公开

    公开(公告)号：US20240038933A1

    公开(公告)日：2024-02-01

    申请号：US18010085

    申请日：2020-06-15

    Applicant: LG ELECTRONICS INC.

    Inventor： Bongseok CHOI ,  Sungjin PARK ,  Joonkwon MOON ,  Taesu OH

    IPC: H01L33/38 ,  H01L25/075 ,  H01L33/40 ,  H01L33/54 ,  H01L33/62

    CPC classification number: H01L33/38 ,  H01L25/0753 ,  H01L33/405 ,  H01L33/54 ,  H01L33/62 ,  H01L2933/0016 ,  H01L2933/0066 ,  H01L2933/005

    Abstract: The embodiment relates to a semiconductor light emitting device package and a display device including the same. Semiconductor light emitting device package according to an embodiment can comprises a light emitting structure 155 including a first conductivity type semiconductor layer 155a, an active layer 155b, and a second conductivity type semiconductor layer 155c; a first electrode 151 and a second electrode 152 electrically connected to the first conductivity type semiconductor layer 155a and the second conductivity type semiconductor layer 155c of the light emitting structure 155, respectively; an interlayer insulating layer disposed on the side of the light emitting structure 155 and an adhesive layer 158 disposed on the light emitting structure 155.
    The first electrode 151 can include a first reflective electrode 151a and a first pad electrode 151b, the second electrode 152 also can include a second reflective electrode 152a and a second pad electrode 152b, and a cross-sectional shape of the first reflective electrode 151a and the second reflective electrode 152a can comprise a cup shape.

    DISPLAY DEVICE USING MICRO LED AND MANUFACTURING METHOD THEREFOR
    8.
    发明申请
    DISPLAY DEVICE USING MICRO LED AND MANUFACTURING METHOD THEREFOR 有权

    公开(公告)号：US20220230997A1

    公开(公告)日：2022-07-21

    申请号：US17616553

    申请日：2019-06-12

    Applicant: LG ELECTRONICS INC.

    Inventor： Bongseok CHOI

    IPC: H01L25/075 ,  H01L33/00 ,  H01L33/62

    Abstract: A method for manufacturing a display device can include growing a plurality of light emitting (LEDs) on a growing substrate; forming a member having a thermal flow characteristic on at least one side surface of each of the plurality of LEDs; separating each of the plurality of LEDs from the growing substrate; forming a plurality of assembly grooves in a wiring substrate for defining pixel regions; assembling the plurality of LEDs at locations respectively corresponding to the plurality of assembly grooves; and applying heat to the wiring substrate to perform a reflow process for adjusting a position of at least one of the plurality of LEDs.

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