Abstract:
A memory circuit is described that includes an array of memory cells including a plurality of blocks. The circuit includes a controller including logic to execute program sequences for selected blocks in the plurality of blocks. The program sequences include patterns of program/verify cycles. The circuit includes logic to assign different patterns of program/verify cycles to different blocks in the plurality of blocks. The circuit includes logic to change a particular pattern assigned to a particular block in the plurality of blocks. The circuit includes logic to maintain statistics for blocks in the plurality of blocks, about performance of cells in the blocks in response to the patterns of program/verify cycles assigned to the blocks. The controller includes logic to apply a stress sequence to one of the selected blocks, the stress sequence including stress pulses applied to memory cells in the one of the selected blocks.
Abstract:
A phase change memory (PCM), a writing method thereof and a reading method thereof are provided. The PCM has a plurality of memory cells. The writing method comprises the following steps. At least one stress pulse is applied for aging at least one of the memory cells. A starting pulse is applied to all of the memory cells of the PCM for decreasing a resistance of each memory cell. A detection pulse is applied to all of the memory cells of the PCM for detecting the resistance of each memory cell. A set pulse is applied to the aged memory cells. A reset pulse is applied to the non-aged memory cells.
Abstract:
A method for healing phase-change memory device includes steps as follows: At least one memory cell comprising a phase-change material with a shifted current-resistance characteristic function (shifted I-R function) is firstly provided. A healing stress is then applied to the phase-change material to transform the shifted I-R function into an initial current-resistance characteristic function (initial I-R function), wherein the shifted I-R function is a translation function of the initial I-R function.
Abstract:
An integrated circuit phase change memory can be pre-coded by inducing a first resistance state in some cells and the memory, and a second resistance state and some other cells in the memory to represent a data set. The integrated circuit phase change memory is mounted on a substrate after coding the data set. After mounting the integrated circuit phase change memory, the data set is read by sensing the first and second resistance states, and changing cells in the first resistance state to a third resistance state and changing cells in the second resistance state to a fourth resistance state. The first and second resistance states maintain a sensing margin after solder bonding or other thermal cycling process. The third and fourth resistance states are characterized by the ability to cause a transition using higher speed and lower power, suitable for a mission function of a circuit.
Abstract:
A phase change memory (PCM), a writing method thereof and a reading method thereof are provided. The PCM has a plurality of memory cells. The writing method comprises the following steps. At least one stress pulse is applied for aging at least one of the memory cells. A starting pulse is applied to all of the memory cells of the PCM for decreasing a resistance of each memory cell. A detection pulse is applied to all of the memory cells of the PCM for detecting the resistance of each memory cell. A set pulse is applied to the aged memory cells. A reset pulse is applied to the non-aged memory cells.
Abstract:
An operating method, an operating system and a resistance random access memory (ReRAM) are provided. The operating method includes the following steps. A write voltage and a write current are set at a first predetermined voltage value and a first predetermined current value respectively. The write voltage and the write current are applied to a memory cell of the ReRAM for writing. Whether the write current reaches a second predetermined current value is verified, if a read current of the memory cell is not within a predetermined current range. The write current is increased, if the write current does not reach the second predetermined current value. Whether the write voltage reaches a second predetermined voltage value is verified, if the write current reaches the second predetermined current value. The write voltage is increased, if the write voltage does not reach the second predetermined voltage value.
Abstract:
A device includes first and second pluralities of memory cells with memory elements and first and second capping materials on the first and second pluralities of memory cells. First and second capping materials can comprise lower and higher density silicon nitrides. The memory elements can include a programmable resistance memory material, and the capping materials can contact the memory elements. The first and second pluralities of memory cells can have a common cell structure. The first memory cells in the can comprise a top and bottom electrodes with a memory material therebetween and the first capping material contacting the memory material. Control circuits can apply different write algorithms to the first and second pluralities of memory cells. The first and second sets of memory cells can have different operational memory characteristics by forming the first and second capping layers using different capping materials but with the same cell structure.
Abstract:
A first memory cell including a phase change material. The first memory cell is programmable to store one data value of a plurality of data values. The plurality of data values are represented by a plurality of non-overlapping ranges of resistance of the first memory cell. At least one testing pulse is applied to the first memory cell to establish a cell resistance of the first memory cell in an intermediate range of resistance, the intermediate range of resistance in between first and second adjacent ranges in the plurality of non-overlapping ranges of resistance representing the plurality of data values. After applying the at least one testing pulse to the first memory cell, it is determined whether to apply at least one healing pulse to repair the first memory cell, depending on relative values of (i) the cell resistance in the intermediate range of resistance and (ii) a reference resistance in the intermediate range of resistance.
Abstract:
A first memory cell including a phase change material. The first memory cell is programmable to store one data value of a plurality of data values. The plurality of data values are represented by a plurality of non-overlapping ranges of resistance of the first memory cell. At least one testing pulse is applied to the first memory cell to establish a cell resistance of the first memory cell in an intermediate range of resistance, the intermediate range of resistance in between first and second adjacent ranges in the plurality of non-overlapping ranges of resistance representing the plurality of data values. After applying the at least one testing pulse to the first memory cell, it is determined whether to apply at least one healing pulse to repair the first memory cell, depending on relative values of (i) the cell resistance in the intermediate range of resistance and (ii) a reference resistance in the intermediate range of resistance.
Abstract:
A cell sensing circuit for a phase changing memory and methods thereof are provided. A specific one of the proposed methods includes: providing a sensing circuit having a sense amplifier, and two identical stable currents respectively received by a reference cell and a target cell; establishing a cell voltage on a cell side and a reference voltage on a reference side respectively via the two identical stable currents; and using the sense amplifier to determine a logic state of the target cell based on a voltage difference between the reference voltage and the cell voltage.