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    Positive tone bi-layer imprint lithography method
    2.
    发明申请
    Positive tone bi-layer imprint lithography method 有权
    正音双层压印光刻法

    公开(公告)号：US20040188381A1

    公开(公告)日：2004-09-30

    申请号：US10396615

    申请日：2003-03-25

    Applicant: Molecular Imprints, Inc.

    Inventor： Sidlgata V. Sreenivasan

    IPC: B44C001/22

    CPC classification number: B81C1/0046 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  H01L21/76802

    Abstract: The present invention provides a method to pattern a substrate which features creating a multi-layered structure by forming, on the substrate, a patterned layer having protrusions and recessions. Formed upon the patterned layer is a conformal layer, with the multi-layered structure having a crown surface facing away from the substrate. Portions of the multi-layered structure are removed to expose regions of the substrate in superimposition with the protrusions, while forming a hard mask in areas of the crown surface in superimposition with the recessions.

    Abstract translation: 本发明提供一种通过在衬底上形成具有突起和凹陷的图案化层来形成特征为产生多层结构的衬底的方法。 形成在图案层上的是保形层，多层结构具有背离衬底的表冠表面。 去除多层结构的部分以暴露与突起叠加的衬底的区域，同时在与凹部重叠的冠表面的区域中形成硬掩模。

    Magnification correction employing out-of-plane distortion of a substrate
    4.
    发明申请
    Magnification correction employing out-of-plane distortion of a substrate 有权
    使用基板的平面外失真的放大率校正

    公开(公告)号：US20040146792A1

    公开(公告)日：2004-07-29

    申请号：US10735110

    申请日：2003-12-12

    Applicant: MOLECULAR IMPRINTS, INC.

    Inventor： Pawan K. Nimmakayala ,  Sidlgata V. Sreenivasan ,  Byung-Jin Choi ,  Anshuman Cherala

    IPC: B29C053/02 ,  B29C059/02 ,  G03C005/00 ,  G03F009/00

    CPC classification number: B82Y10/00 ,  B29C59/02 ,  B82Y40/00 ,  G03F7/0002 ,  G03F9/00

    Abstract: The present invention is directed to a method of controlling dimensional relations between an original pattern present in a mold and a recorded pattern formed in a layer of a substrate. In this manner, the size of the recorded patterned may appear to be magnified and/or reduced, when compared to the original pattern. To that end, the method comprises defining a region on the layer in which to produce the recorded pattern. The substrate is bent to produce a contoured surface in the region. Dimensional variations in the original pattern are produced by bending the mold, defining a varied pattern. The contoured surface and the mold are provided to have similar radii of curvatures. The varied pattern is then recorded in the layer.

    Abstract translation: 本发明涉及一种控制存在于模具中的原始图案与形成在基底层中的记录图案之间的尺寸关系的方法。 以这种方式，当与原始图案相比时，记录的图案的尺寸可以看起来被放大和/或缩小。 为此，该方法包括定义在其上产生记录图案的层上的区域。 该基底被弯曲以在该区域中产生轮廓表面。 通过弯曲模具产生原始图案的尺寸变化，限定了不同的图案。 轮廓表面和模具被提供以具有相似的曲率半径。 然后将不同的图案记录在图层中。

    System for determining characteristics of substrates employing fluid geometries
    6.
    发明申请
    System for determining characteristics of substrates employing fluid geometries 有权
    用于确定采用流体几何形状的基板特性的系统

    公开(公告)号：US20040223883A1

    公开(公告)日：2004-11-11

    申请号：US10863800

    申请日：2004-06-08

    Applicant: MOLECULAR IMPRINTS, INC.

    Inventor： Byung J. Choi ,  Sidlgata V. Sreenivasan

    IPC: G01N021/00

    CPC classification number: G03F7/0002 ,  B82Y10/00 ,  B82Y40/00

    Abstract: The present invention provides a system for determining characteristics of substrates, such as the presence of contaminants, shape, as well as the spatial relationships between spaced-apart substrates. The spatial relationships include distance and angular orientation between first and second spaced apart substrates.

    Abstract translation: 本发明提供一种用于确定衬底特性的系统，例如污染物的存在，形状以及间隔开的衬底之间的空间关系。 空间关系包括第一和第二间隔开的基底之间的距离和角度取向。

    Method for modulating shapes of substrates
    7.
    发明申请
    Method for modulating shapes of substrates 有权
    调制基板形状的方法

    公开(公告)号：US20040112861A1

    公开(公告)日：2004-06-17

    申请号：US10316963

    申请日：2002-12-11

    Applicant: MOLECULAR IMPRINTS, INC.

    Inventor： Byung J. Choi ,  Ronald D. Voisin ,  Sidlgata V. Sreenivasan ,  Michael P.C. Watts ,  C. Grant Willson ,  Norman E. Schumaker

    IPC: C23F001/00

    CPC classification number: G03F7/707 ,  G03F7/70875

    Abstract: The present invention is directed to a method for modulating shapes of a substrate, having first and second opposed surfaces. This is achieved by creating a pressure differential between differing regions of the first opposed surface to attenuate structural distortions in the second opposed surface that results from external forces bearing on the substrate.

    Abstract translation: 本发明涉及一种用于调制具有第一和第二相对表面的基底的形状的方法。 这是通过在第一相对表面的不同区域之间产生压差来减少第二相对表面中由轴承在基底上的外力产生的结构变形来实现的。

    Method and system for determining characteristics of substrates employing fluid geometries
    8.
    发明申请
    Method and system for determining characteristics of substrates employing fluid geometries 有权
    用于确定采用流体几何形状的基板特性的方法和系统

    公开(公告)号：US20040112153A1

    公开(公告)日：2004-06-17

    申请号：US10318365

    申请日：2002-12-12

    Applicant: MOLECULAR IMPRINTS, INC.

    Inventor： Byung J. Choi ,  Sidlgata V. Sreenivasan

    IPC: G01N019/00

    CPC classification number: G03F7/0002 ,  B82Y10/00 ,  B82Y40/00

    Abstract: The present invention provides a technique for determining characteristics of substrates, such as the presence of contaminants, shape, as well as the spatial relationships between spaced-apart substrates. The spatial relationships include distance and angular orientation, between first and second spaced apart substrates. The technique includes forming a volume of fluid on the second substrate, with the volume of fluid having an area associated therewith. The volume of fluid is compressed between the first and second substrates to effectuate a change in properties of the area, defining changed properties. The changed properties are sensed, and the characteristics of the first and second substrates are determined as a function of the changed properties.

    Abstract translation: 本发明提供了一种用于确定衬底的特性的技术，例如污染物的存在，形状以及间隔开的衬底之间的空间关系。 空间关系包括第一和第二间隔开的基底之间的距离和角度取向。 该技术包括在第二基板上形成一定体积的流体，其中流体的体积具有与其相关的区域。 流体的体积在第一和第二基底之间被压缩，以实现该区域的性质的变化，从而限定改变的特性。 检测到改变的特性，并且确定第一和第二基板的特性作为改变的特性的函数。

    Chucking system for modulating shapes of substrates
    9.
    发明申请
    Chucking system for modulating shapes of substrates 有权
    用于调制基板形状的卡盘系统

    公开(公告)号：US20040090611A1

    公开(公告)日：2004-05-13

    申请号：US10293224

    申请日：2002-11-13

    Applicant: MOLECULAR IMPRINTS, INC.

    Inventor： Byung J. Choi ,  Ronald D. Voisin ,  Sidlgata V. Sreenivasan ,  Michael P.C. Watts ,  Daniel Babbs ,  Mario J. Meissl ,  Hillman Bailey ,  Norman E. Schumaker

    IPC: G03B027/62

    CPC classification number: G03F7/70875 ,  B29C33/20 ,  B29C43/003 ,  B29C43/021 ,  B29C43/36 ,  B29C43/58 ,  B29C2043/025 ,  B29C2043/3233 ,  B29C2043/3488 ,  B29C2043/5841 ,  B29D11/00365 ,  G03B27/62 ,  G03F7/707

    Abstract: The present invention is directed to a chucking system to modulate substrates so as to properly shape and position the same with respect to a wafer upon which a pattern is to be formed with the substrate. The chucking system includes a chuck body having first and second opposed sides. A side surface extends therebetween. The first side includes first and second spaced-apart recesses defining first and second spaced-apart support regions. The first support region cinctures the second support region and the first and second recesses. The second support region cinctures the second recess, with a portion of the body in superimposition with the second recess being transparent to radiation having a predetermined wavelength. The second side and the side surface define exterior surfaces. The body includes throughways placing the first and second recesses in fluid communication with one of the exterior surfaces.

    Abstract translation: 本发明涉及一种夹持系统，用于调制基板，以便相对于其上将与基底形成图案的晶片适当地成形和定位基板。 夹持系统包括具有第一和第二相对侧的卡盘体。 侧面在其间延伸。 第一侧包括限定第一和第二间隔开的支撑区域的第一和第二间隔开的凹部。 第一支撑区域使第二支撑区域和第一和第二凹槽成像。 第二支撑区域使第二凹部成像，其中身体的与第二凹部重叠的部分对于具有预定波长的辐射是透明的。 第二面和侧面限定外表面。 主体包括使第一和第二凹槽与外表面之一流体连通的通道。

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