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    Hot melt adhesive composition comprising hydrogenated block copolymers
    1.
    发明授权
    Hot melt adhesive composition comprising hydrogenated block copolymers 失效
    包含氢化嵌段共聚物的热熔粘合剂组合物

    公开(公告)号：US5900465A

    公开(公告)日：1999-05-04

    申请号：US767529

    申请日：1996-12-16

    申请人： Makoto Nishikawa ,  Hideo Takamatsu ,  Mizuho Maeda ,  Hiromichi Nakata ,  Yoshio Hirayama

    发明人： Makoto Nishikawa ,  Hideo Takamatsu ,  Mizuho Maeda ,  Hiromichi Nakata ,  Yoshio Hirayama

    IPC分类号： C09J153/00 ,  C08L9/00 ,  C08L47/00 ,  C08L53/00

    CPC分类号： C09J153/00

    摘要： An adhesive composition suitable for a hot melt adhesive or hot melt pressure-sensitive adhesive, which comprises a block copolymer (a) and a tackifier (b), wherein said block copolymer (a) has at least one polymer block A being a hydrogenated butadiene polymer block having a 1,2-bond content of 20 mol % or less and at least one polymer block B substantially having an olefin polymer structure different from the polymer block A and having a glass transition temperature of -20.degree. C. or less and a heat of crystalline fusion of 8 cal/g or lower, and containing the polymer block A before hydrogenation in an amount of 3 to 80 wt. %.

    摘要翻译： 一种适用于热熔粘合剂或热熔压敏粘合剂的粘合剂组合物，其包含嵌段共聚物（a）和增粘剂（b），其中所述嵌段共聚物（a）具有至少一个聚合物嵌段A为氢化丁二烯 具有20摩尔％以下的1,2-键含量的聚合物嵌段和至少一个聚合物嵌段B，其基本上具有不同于聚合物嵌段A的烯烃聚合物结构，并且玻璃化转变温度为-20℃以下， 8cal / g或更低的结晶熔化热，并且在氢化之前含有3-80wt。％的聚合物嵌段A。 ％。

    Thermoplastic polymer composition
    2.
    发明授权
    Thermoplastic polymer composition 失效
    热塑性聚合物组成

    公开(公告)号：US5571865A

    公开(公告)日：1996-11-05

    申请号：US440123

    申请日：1995-05-12

    申请人： Makoto Nishikawa ,  Mizuho Maeda ,  Hiromichi Nakata ,  Hideo Takamatsu ,  Yoshio Hirayama

    发明人： Makoto Nishikawa ,  Mizuho Maeda ,  Hiromichi Nakata ,  Hideo Takamatsu ,  Yoshio Hirayama

    IPC分类号： C08L23/12 ,  C08L23/16 ,  C08L53/02 ,  C08F297/04 ,  C08L53/00

    CPC分类号： C08L23/12 ,  C08L23/16 ,  C08L53/02

    摘要： A thermoplastic polymer composition which comprises100 parts by weight of polypropylene (1);5 to 100 parts by weight of a hydrogenated block copolymer (2) which has at least one block A, at least one block B and at least one block C and which has a number average molecular weight of not higher than 700,000 wherein the block A consists essentially of a butadiene polymer having a number average molecular weight of 2500 to 200,000 and a vinyl bond content of not higher than 20%, the block B consists essentially of a polymer of isoprene and butadiene at a ratio by weight of 30:70 to 100:0 and has a number average molecular weight of 30,000 to 300,000 and a vinyl bond content of not higher than 20%, and the block C consists essentially of a polymer of isoprene and butadiene at a ratio by weight of 0:100 to 100:0 and has a number average molecular weight of not higher than 200,000 and a vinyl bond content of not less than 40%; and0 to 100 parts by weight of an ethylene/propylene rubber wherein the ratio of the melt viscosity of hydrogenated block copolymer (2) to the melt viscosity of the polypropylene (1) as determined at 200.degree. C. at a shear rate of 1220 second.sup.-1, is in the range of 0.5:1 to 10:1.

    摘要翻译： 一种热塑性聚合物组合物，其包含100重量份的聚丙烯（1）; 5至100重量份的氢化嵌段共聚物（2），其具有至少一个嵌段A，至少一个嵌段B和至少一个嵌段C，其数均分子量不高于700,000，其中嵌段A 基本上由数均分子量为2500〜200,000，乙烯基键含量为20％以下的丁二烯聚合物组成，嵌段B​​主要由异戊二烯和丁二烯的聚合物组成，重量比为30:70〜 100：0，数均分子量为30,000〜300,000，乙烯基键含量为20％以下，嵌段C主要由异戊二烯和丁二烯的聚合物组成，重量比为0：100〜100 ：0，数均分子量不大于20万，乙烯基键含量不小于40％; 和0至100重量份的乙烯/丙烯橡胶，其中氢化嵌段共聚物（2）的熔体粘度与聚丙烯（1）的熔体粘度的比例在200℃下以1220的剪切速率测定 秒-1，在0.5：1到10：1的范围内。

    Method of producing a porous product
    4.
    发明授权
    Method of producing a porous product 有权
    多孔产品的制造方法

    公开(公告)号：US06391233B1

    公开(公告)日：2002-05-21

    申请号：US09597296

    申请日：2000-06-20

    申请人： Kunihiko Otani ,  Mizuho Maeda ,  Hideo Takamatsu ,  Kazuhisa Takagi ,  Masashi Nemoto

    发明人： Kunihiko Otani ,  Mizuho Maeda ,  Hideo Takamatsu ,  Kazuhisa Takagi ,  Masashi Nemoto

    IPC分类号： B29C6720

    CPC分类号： B29C67/202

    摘要： A novel method of producing a porous product is provided, including the steps of: preparing a molded product by subjecting a molding material comprising a polymer component and a pore-forming agent dispersed in the polymer component, the pore-forming agent assuming a solid state at a room temperature, to molding at a temperature which causes the pore-forming agent to melt; and soaking the molded product with a solvent which dissolves the pore-forming agent but fails to dissolve the polymer component, to form pores.

    摘要翻译： 提供一种生产多孔产品的新方法，包括以下步骤：通过使分散在聚合物组分中的聚合物组分和成孔剂的成型材料，使固体状态的成孔剂 在室温下在使成孔剂熔化的温度下成型; 并用溶解成孔剂的溶剂浸渍成型体，但不能溶解聚合物成分，形成孔。

    Process for producing hydrogenated block copolymer, hydrogenated block copolymer obtained by the process, and composition thereof
    6.
    发明授权
    Process for producing hydrogenated block copolymer, hydrogenated block copolymer obtained by the process, and composition thereof 有权
    制备氢化嵌段共聚物的方法，通过该方法获得的氢化嵌段共聚物及其组合物

    公开(公告)号：US09296853B2

    公开(公告)日：2016-03-29

    申请号：US13375612

    申请日：2010-06-03

    申请人： Takaaki Nishikawa ,  Yosuke Jogo ,  Nobuhiro Moriguchi ,  Mizuho Maeda

    发明人： Takaaki Nishikawa ,  Yosuke Jogo ,  Nobuhiro Moriguchi ,  Mizuho Maeda

    IPC分类号： C08F8/00 ,  C08F297/04 ,  C08L53/02

    CPC分类号： C08F297/046 ,  C08F8/04 ,  C08F2800/20 ,  C08K5/01 ,  C08L53/025 ,  C08F297/044 ,  C08L91/00

    摘要： The present invention relates to a method for producing a hydrogenated block copolymer, including the steps of: (a) forming a block copolymer by allowing a living polymer having a specific structure to react with a tetra- or more functional silane coupling agent; (b) hydrogenating the block copolymer to form a hydrogenated block copolymer; (c) isolating the resultant hydrogenated block copolymer; and (d) deactivating a functional group in the silane coupling agent and/or an unreacted functional group present in a coupling agent residue in the block copolymer or the hydrogenated block copolymer prior to the step (c), in which the number of functional groups derived from the coupling agent in the hydrogenated block copolymer recovered in the step (c) is 1.5 or less per block copolymer molecule; a hydrogenated block copolymer obtained by the method; and a composition containing the hydrogenated block copolymer.

    摘要翻译： 本发明涉及一种氢化嵌段共聚物的制备方法，包括以下步骤：（a）通过使具有特定结构的活性聚合物与四官能的硅烷偶联剂反应形成嵌段共聚物; （b）使嵌段共聚物氢化以形成氢化嵌段共聚物; （c）分离得到的氢化嵌段共聚物; 和（d）在步骤（c）之前，使嵌段共聚物或氢化嵌段共聚物中存在于偶联剂残基中的硅烷偶联剂和/或未反应官能团中的官能团失活，其中官能团的数目 衍生自步骤（c）中回收的氢化嵌段共聚物中的偶联剂的每嵌段共聚物分子为1.5以下; 通过该方法获得的氢化嵌段共聚物; 和含有氢化嵌段共聚物的组合物。

    Epoxy resin composition
    7.
    发明授权
    Epoxy resin composition 有权
    环氧树脂组合物

    公开(公告)号：US07652104B2

    公开(公告)日：2010-01-26

    申请号：US10544762

    申请日：2003-12-25

    申请人： Kei Hirata ,  Koji Kitayama ,  Mizuho Maeda

    发明人： Kei Hirata ,  Koji Kitayama ,  Mizuho Maeda

    IPC分类号： C08C19/06

    CPC分类号： C08G59/027 ,  C08L15/00

    摘要： An epoxy resin composition includes (A) an epoxy resin, (B) a curing agent, and (C) an epoxidized polyisoprene (c-1) that contains an epoxy group at 0.15 to 2 meq/g in the molecule and has a number-average molecular weight of 15000 to 200000 or an epoxidized polybutadiene (c-2) that contains an epoxy group at 0.15 to 2 meq/g in the molecule and has a number-average molecular weight of 20000 to 200000. The epoxy resin composition has high heat resistance and reduced internal stress, and can be suitably used in applications such as electronic part materials represented by semiconductor encapsulating materials and adhesives.

    摘要翻译： 环氧树脂组合物包含（A）环氧树脂，（B）固化剂和（C）在分子中含有0.15〜2meq / g的环氧基的环氧化聚异戊二烯（c-1），并且具有数 - 平均分子量为15000〜200000，或分子内含有0.15〜2meq / g的环氧基并且数均分子量为20000〜200000的环氧化聚丁二烯（c-2）。环氧树脂组合物 高耐热性和内应力降低，可以适用于半导体封装材料和粘合剂等的电子部件材料。

    Rubber composition, crosslinkable rubber compositions, and crosslinked articles
    8.
    发明申请
    Rubber composition, crosslinkable rubber compositions, and crosslinked articles 审中-公开
    橡胶组合物，可交联橡胶组合物和交联物品

    公开(公告)号：US20060189720A1

    公开(公告)日：2006-08-24

    申请号：US10544769

    申请日：2004-02-09

    申请人： Koji Kitayama ,  Kei Hirata ,  Tsutomu Yamada ,  Hiroshi Kanbara ,  Mizuho Maeda

    发明人： Koji Kitayama ,  Kei Hirata ,  Tsutomu Yamada ,  Hiroshi Kanbara ,  Mizuho Maeda

    IPC分类号： C08L63/00 ,  C08L19/00 ,  B32B27/38

    CPC分类号： C08L9/00 ,  C08C19/06 ,  C08K3/36 ,  C08L15/00 ,  C08L21/00 ,  C08L2666/08

    摘要： A rubber composition includes (1) a diene rubber, (2) a silica and (3) an epoxidized liquid diene rubber having a number-average molecular weight of 10000 to 100000, wherein based on 100 parts by mass of the diene rubber (1), the rubber composition comprises 0.1 to 150 parts by mass of the silica (2) and 0.1 to 30 parts by mass of the epoxidized liquid diene rubber (3). A crosslinkable rubber composition includes the above rubber composition and crosslinking agent. A crosslinked article is prepared by crosslinking the above crosslinkable rubber composition. The rubber compositions have improved silica dispersibility in the case of mixing a silica with a diene rubber, excellent processability, and excellent mechanical properties after crosslinking.

    摘要翻译： 橡胶组合物包括（1）二烯橡胶，（2）二氧化硅和（3）数均分子量为10000〜100000的环氧化液态二烯系橡胶，其中，基于100质量份的二烯橡胶 ），橡胶组合物包含0.1〜150质量份的二氧化硅（2）和0.1〜30质量份的环氧化液态二烯系橡胶（3）。 可交联橡胶组合物包括上述橡胶组合物和交联剂。 通过交联上述可交联橡胶组合物制备交联物品。 在将二氧化硅与二烯橡胶混合的情况下，橡胶组合物具有改善的二氧化硅分散性，加工性优异，交联后的机械性能优异。

    Epoxy resin composition
    9.
    发明申请
    Epoxy resin composition 有权
    环氧树脂组合物

    公开(公告)号：US20060142507A1

    公开(公告)日：2006-06-29

    申请号：US10544762

    申请日：2003-12-25

    申请人： Kei Hirata ,  Koji Kitayama ,  Mizuho Maeda

    发明人： Kei Hirata ,  Koji Kitayama ,  Mizuho Maeda

    IPC分类号： C08L63/00

    CPC分类号： C08G59/027 ,  C08L15/00

    摘要： An epoxy resin composition includes (A) an epoxy resin, (B) a curing agent, and (C) an epoxidized polyisoprene (c-1) that contains an epoxy group at 0.15 to 2 meq/g in the molecule and has a number-average molecular weight of 15000 to 200000 or an epoxidized polybutadiene (c-2) that contains an epoxy group at 0.15 to 2 meq/g in the molecule and has a number-average molecular weight of 20000 to 200000. The epoxy resin composition has high heat resistance and reduced internal stress, and can be suitably used in applications such as electronic part materials represented by semiconductor encapsulating materials and adhesives.

    摘要翻译： 环氧树脂组合物包含（A）环氧树脂，（B）固化剂和（C）在分子中含有0.15〜2meq / g的环氧基的环氧化聚异戊二烯（c-1），并且具有数 - 平均分子量为15000〜200000，或分子内含有0.15〜2meq / g的环氧基并且数均分子量为20000〜200000的环氧化聚丁二烯（c-2）。环氧树脂组合物 高耐热性和内应力降低，可以适用于半导体封装材料和粘合剂等的电子部件材料。