公开(公告)号：US11876026B2

公开(公告)日：2024-01-16

申请号：US17592161

申请日：2022-02-03

Applicant: Medtronic, Inc.

Inventor： Chunho Kim ,  Mark E. Henschel

IPC: H01L23/15 ,  H01L21/48 ,  H01L21/56 ,  H01L23/08 ,  H01L23/485 ,  H01L23/538 ,  H01L23/00

CPC classification number: H01L23/15 ,  H01L21/486 ,  H01L21/56 ,  H01L23/08 ,  H01L23/485 ,  H01L23/5383 ,  H01L24/14 ,  H01L2924/1205 ,  H01L2924/1207 ,  H01L2924/13026 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14

Abstract: Various embodiments of an integrated circuit package and a method of forming such package are disclosed. The package includes a substrate having a glass core layer, where the glass core layer includes a first major surface, a second major surface, and a cavity disposed between the first major surface and the second major surface of the glass core layer. The package also includes a die disposed in the cavity of the glass core layer, an encapsulant disposed in the cavity between the die and a sidewall of the cavity, a first patterned conductive layer disposed adjacent the first major surface of the glass core layer, and a second patterned conductive layer disposed adjacent the second major surface of the glass core layer. The die is electrically connected to at least one of the first and second patterned conductive layers.

公开(公告)号：US11633611B2

公开(公告)日：2023-04-25

申请号：US17125250

申请日：2020-12-17

Applicant: Medtronic, Inc.

Inventor： Andrew J. Ries ,  Chunho Kim ,  Robert A. Munoz ,  Christopher T. Kinsey ,  Jeffrey Voss ,  Kris A. Peterson ,  Mark E. Henschel

IPC: A61N1/375

Abstract: Various embodiments of a feedthrough header assembly and a device including such assembly are disclosed. The assembly includes a header having an inner surface and an outer surface; a dielectric substrate having a first major surface and a second major surface, where the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header; and a patterned conductive layer disposed on the first major surface of the dielectric substrate, where the patterned conductive layer includes a first conductive portion and a second conductive portion electrically isolated from the first conductive portion. The assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header. The feedthrough pin extends beyond the outer surface of the header.

公开(公告)号：US11756741B2

公开(公告)日：2023-09-12

申请号：US17367831

申请日：2021-07-06

Applicant: Medtronic, Inc.

Inventor： Mark R. Boone ,  Joachim Hossick-Schott ,  Mark Henschel ,  Chunho Kim

IPC: H01G9/08 ,  H01G9/15 ,  H01G9/048 ,  H01G9/042 ,  A61N1/05

CPC classification number: H01G9/08 ,  H01G9/048 ,  H01G9/15 ,  A61N1/05 ,  H01G9/0425

Abstract: Various embodiments of an electrical component and a method of forming such component are disclosed. The electrical component includes a substrate having a first major surface, a second major surface, and a cavity disposed in the substrate. The cavity extends between the first major surface and the second major surface. The electrical component also includes an anode electrode that includes a conductive foil layer disposed on the second major surface of the substrate and over the cavity. Tantalum material is disposed within the cavity and includes tantalum particles. A dielectric layer is disposed on the tantalum particles, and an electrolyte cathode layer is disposed on the dielectric layer. The electrical component also includes a cathode electrode disposed over the cavity.

公开(公告)号：US20220157676A1

公开(公告)日：2022-05-19

申请号：US17592161

申请日：2022-02-03

Applicant: Medtronic, Inc.

Inventor： Chunho Kim ,  Mark E. Henschel

IPC: H01L23/15 ,  H01L21/48 ,  H01L21/56 ,  H01L23/08 ,  H01L23/485 ,  H01L23/538 ,  H01L23/00

Abstract: Various embodiments of an integrated circuit package and a method of forming such package are disclosed. The package includes a substrate having a glass core layer, where the glass core layer includes a first major surface, a second major surface, and a cavity disposed between the first major surface and the second major surface of the glass core layer. The package also includes a die disposed in the cavity of the glass core layer, an encapsulant disposed in the cavity between the die and a sidewall of the cavity, a first patterned conductive layer disposed adjacent the first major surface of the glass core layer, and a second patterned conductive layer disposed adjacent the second major surface of the glass core layer. The die is electrically connected to at least one of the first and second patterned conductive layers.

公开(公告)号：US20210154772A1

公开(公告)日：2021-05-27

申请号：US17086946

申请日：2020-11-02

Applicant: Medtronic, Inc.

Inventor： Xiangnan He ,  David A. Ruben ,  Mark E. Henschel ,  Chunho Kim ,  Yongqian Wang ,  Rodney D. Toles

IPC: B23K26/38 ,  B23K26/06 ,  B23K26/082 ,  B23K26/70 ,  B23K26/362

Abstract: A system may include an emitting device and a controller. The emitting device may be adapted to emit a first laser beam and a second laser beam. The controller may include one or more processors and may be operably coupled to the emitting device to control emission of the first and second laser beams. The controller may be adapted to remove a portion of a workpiece to form an exposed surface of the workpiece with the first laser beam using the emitting device and to remove a portion of the exposed surface with the second laser beam using the emitting device.

公开(公告)号：US20240145322A1

公开(公告)日：2024-05-02

申请号：US18408812

申请日：2024-01-10

Applicant: MEDTRONIC, INC.

Inventor： Chunho Kim ,  Mark E. Henschel

IPC: H01L23/15 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/08 ,  H01L23/485 ,  H01L23/538

CPC classification number: H01L23/15 ,  H01L21/486 ,  H01L21/56 ,  H01L23/08 ,  H01L23/485 ,  H01L23/5383 ,  H01L24/14 ,  H01L2924/1205 ,  H01L2924/1207 ,  H01L2924/13026 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14

Abstract: Various embodiments of an integrated circuit package and a method of forming such package are disclosed. The package includes a substrate having a glass core layer, where the glass core layer includes a first major surface, a second major surface, and a cavity disposed between the first major surface and the second major surface of the glass core layer. The package also includes a die disposed in the cavity of the glass core layer, an encapsulant disposed in the cavity between the die and a sidewall of the cavity, a first patterned conductive layer disposed adjacent the first major surface of the glass core layer, and a second patterned conductive layer disposed adjacent the second major surface of the glass core layer. The die is electrically connected to at least one of the first and second patterned conductive layers.

公开(公告)号：US11883673B2

公开(公告)日：2024-01-30

申请号：US17071463

申请日：2020-10-15

Applicant: Medtronic, Inc.

Inventor： Andrew J. Ries ,  Chunho Kim ,  Mark E. Henschel ,  Robert A. Munoz ,  Christopher T. Kinsey ,  Jeffrey S. Voss

IPC: A61N1/375

CPC classification number: A61N1/3754 ,  A61N1/37512

Abstract: In some examples, an implantable medical device includes a battery, an electronics module electrically connected to the battery, and an elongated housing comprising a side wall positioned between the battery and an end cap, wherein the electronics module is positioned within the elongated housing between the battery and the end cap. The implantable medical device also includes an electrical contact assembly comprising a first spring contact and a second spring contact. The electrical contact assembly of the implantable medical device is positioned within the elongated housing between the electronics module and the battery or the end cap.

公开(公告)号：US11270920B2

公开(公告)日：2022-03-08

申请号：US16536716

申请日：2019-08-09

Applicant: Medtronic, Inc.

Inventor： Chunho Kim ,  Mark E. Henschel

IPC: H01L23/15 ,  H01L21/48 ,  H01L21/56 ,  H01L23/08 ,  H01L23/485 ,  H01L23/538 ,  H01L23/00

Abstract: Various embodiments of an integrated circuit package and a method of forming such package are disclosed. The package includes a substrate having a glass core layer, where the glass core layer includes a first major surface, a second major surface, and a cavity disposed between the first major surface and the second major surface of the glass core layer. The package also includes a die disposed in the cavity of the glass core layer, an encapsulant disposed in the cavity between the die and a sidewall of the cavity, a first patterned conductive layer disposed adjacent the first major surface of the glass core layer, and a second patterned conductive layer disposed adjacent the second major surface of the glass core layer. The die is electrically connected to at least one of the first and second patterned conductive layers.

公开(公告)号：US11031345B2

公开(公告)日：2021-06-08

申请号：US16536633

申请日：2019-08-09

Applicant: Medtronic, Inc.

Inventor： Chunho Kim ,  Mark R. Boone ,  Randolph E. Crutchfield

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/58 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: Various embodiments of an integrated circuit package and a method of forming such package are disclosed. The package includes a substrate having a core layer disposed between a first dielectric layer and a second dielectric layer, a die disposed in a cavity of the core layer, and an encapsulant disposed in the cavity between the die and a sidewall of the cavity. The package further includes a first patterned conductive layer disposed within the first dielectric layer, a device disposed on an outer surface of the first dielectric layer such that the first patterned conductive layer is between the device and the core layer, a second patterned conductive layer disposed within the second dielectric layer, and a conductive pad disposed on an outer surface of the second dielectric layer such that the second patterned conductive layer is between the conductive pad and the core layer.

公开(公告)号：US10201094B2

公开(公告)日：2019-02-05

申请号：US14561248

申请日：2014-12-05

Applicant: Medtronic, Inc.

Inventor： Chunho Kim ,  Songhua Shi ,  Mark S. Ricotta ,  Scott B. Sleeper ,  Yongqian Wang

IPC: H05K3/28 ,  B29C45/14

Abstract: During a process to encapsulate electronic components and attachment interfaces thereof on a first side of a substrate of a hybrid assembly, a fluid is supplied to a trench of an encapsulation system in which the hybrid assembly is loaded, and a balancing pressure is delivered by the fluid within the trench, during the encapsulation process, to support the hybrid assembly from an opposing second side of the substrate. A regulator of a fluid supply of the system may maintain the balancing pressure, for example, being controlled by a controller of the system that is configured to estimate a pressure within a molding cavity of the system.