中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

8 records (took 0.01 seconds)

    Integrated circuit packaging for implantable medical devices
    1.
    发明授权
    Integrated circuit packaging for implantable medical devices 有权
    用于可植入医疗器械的集成电路封装

    公开(公告)号：US09496241B2

    公开(公告)日：2016-11-15

    申请号：US14473156

    申请日：2014-08-29

    Applicant: Medtronic, Inc.

    Inventor： Mohsen Askarinya ,  Mark R Boone ,  Andreas A Fenner ,  Lejun Wang ,  Kenneth Heames

    IPC: H05K1/18 ,  H01L25/00 ,  H01F27/28 ,  H01L23/64 ,  H01L25/16 ,  A61N1/375 ,  A61N1/39

    CPC classification number: H01L25/00 ,  A61N1/3758 ,  A61N1/3968 ,  H01F27/2804 ,  H01F2027/2819 ,  H01L23/647 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A hybrid integrated circuit in a wafer level package for an implantable medical device includes one or more passive component windings formed, at least in part, along one or more routing layers of the package. The windings may be primary and secondary windings of a transformer, wherein all or part of a magnetic core thereof is embedded in a component layer of the wafer level package. If the core includes a part bonded to a surface of the package, that part of the core may be E-shaped with legs extending into the routing layers, and, in some cases, through the routing layers. Routing layers may be formed on both sides of the component layer to accommodate the transformer windings, in some instances.

    Abstract translation: 用于可植入医疗器件的晶片级封装中的混合集成电路包括至少部分地沿着封装的一个或多个布线层形成的一个或多个无源元件绕组。 绕组可以是变压器的初级和次级绕组，其中全部或部分磁芯嵌入在晶片级封装的组件层中。 如果芯包括结合到包装表面的部分，那么芯部的该部分可以是E形的，其中腿部延伸到路线层中，并且在一些情况下，可以通过路由层。 在某些情况下，路由层可以形成在组件层的两侧以容纳变压器绕组。

    INTEGRATED CIRCUIT PACKAGING FOR IMPLANTABLE MEDICAL DEVICES
    2.
    发明申请
    INTEGRATED CIRCUIT PACKAGING FOR IMPLANTABLE MEDICAL DEVICES 有权
    用于可植入医疗器械的集成电路包装

    公开(公告)号：US20140368266A1

    公开(公告)日：2014-12-18

    申请号：US14473156

    申请日：2014-08-29

    Applicant: Medtronic, Inc.

    Inventor： Mohsen Askarinya ,  Mark R Boone ,  Andreas A Fenner ,  Lejun Wang ,  Kenneth Heames

    IPC: H01L25/00 ,  A61N1/39

    CPC classification number: H01L25/00 ,  A61N1/3758 ,  A61N1/3968 ,  H01F27/2804 ,  H01F2027/2819 ,  H01L23/647 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A hybrid integrated circuit in a wafer level package for an implantable medical device includes one or more passive component windings formed, at least in part, along one or more routing layers of the package. The windings may be primary and secondary windings of a transformer, wherein all or part of a magnetic core thereof is embedded in a component layer of the wafer level package. If the core includes a part bonded to a surface of the package, that part of the core may be E-shaped with legs extending into the routing layers, and, in some cases, through the routing layers. Routing layers may be formed on both sides of the component layer to accommodate the transformer windings, in some instances.

    Abstract translation: 用于可植入医疗器件的晶片级封装中的混合集成电路包括至少部分地沿着封装的一个或多个布线层形成的一个或多个无源元件绕组。 绕组可以是变压器的初级和次级绕组，其中全部或部分磁芯嵌入在晶片级封装的组件层中。 如果芯包括结合到包装表面的部分，那么芯部的该部分可以是E形的，其中腿部延伸到路线层中，并且在一些情况下，可以通过路由层。 在某些情况下，路由层可以形成在组件层的两侧以容纳变压器绕组。

    Implantable medical device having a multi-axis magnetic sensor
    6.
    发明授权
    Implantable medical device having a multi-axis magnetic sensor 有权
    具有多轴磁性传感器的植入式医疗装置

    公开(公告)号：US08750961B1

    公开(公告)日：2014-06-10

    申请号：US13788310

    申请日：2013-03-07

    Applicant: Medtronic, Inc.

    Inventor： Andrew J. Ries ,  Mark E. Henschel ,  Lawrence C. McClure ,  Mark S. Ricotta ,  Lejun Wang

    IPC: A61B5/055 ,  A61B5/05 ,  A61N1/08

    CPC classification number: A61N1/3718 ,  A61B5/055 ,  A61N1/086

    Abstract: The present invention provides a packaging technique and apparatus that incorporates a flexible substrate package with a three-axis magnetic sensor for three-axis sensing in an implantable medical device. The apparatus includes three single-axis magnetic sensor integrated circuits (ICs) that are mounted to a substrate and encapsulated with a polymer mold compound. The substrate is excised around each of the sensor ICs to form panels that are folded to align the three single-axis sensors in the x, y and z axis.

    Abstract translation: 本发明提供一种封装技术和装置，其包括柔性衬底封装与用于可植入医疗装置中的三轴感测的三轴磁传感器。 该装置包括三个单轴磁传感器集成电路（IC），其安装到基板上并用聚合物模具化合物封装。 在每个传感器IC周围切除衬底，以形成折叠以将x，y和z轴上的三个单轴传感器对准的面板。

    IMPLANTABLE MEDICAL DEVICE INCLUDING A MOLDED PLANAR TRANSFORMER
    7.
    发明申请
    IMPLANTABLE MEDICAL DEVICE INCLUDING A MOLDED PLANAR TRANSFORMER 有权
    可塑性医疗设备，包括模制的平面变压器

    公开(公告)号：US20140277223A1

    公开(公告)日：2014-09-18

    申请号：US13798698

    申请日：2013-03-13

    Applicant: MEDTRONIC, INC.

    Inventor： Mark R. Boone ,  Mohsen Askarinya ,  Mark S. Ricotta ,  Lejun Wang

    IPC: A61N1/39 ,  H01F41/00

    CPC classification number: H01F41/005 ,  A61N1/3981 ,  B23P17/04 ,  H01F7/06 ,  H01F27/022 ,  H01F27/24 ,  H01F27/266 ,  H01F2027/2819 ,  Y10T29/49073 ,  Y10T29/49075

    Abstract: The present disclosure provides methods and techniques associated with a planar transformer for an apparatus. The planar transformers include a substrate carrying electronic components, an upper core bonded on a first exterior surface of the substrate, and a lower core bonded on a second exterior surface opposed to the first side of the substrate. The electronic components include primary windings and secondary windings associated with the transformer. In some embodiments, the transformer includes encapsulant material that is dispensed over and between the components of the transformer to seal air gaps.

    Abstract translation: 本公开提供了与用于装置的平面变压器相关联的方法和技术。 平面变压器包括承载电子部件的基板，接合在基板的第一外部表面上的上部芯部和与基板的第一面相对的第二外部表面上的下部芯部。 电子部件包括与变压器相关联的初级绕组和次级绕组。 在一些实施例中，变压器包括在变压器的部件之间和之间分配以密封空气间隙的密封剂材料。

Patent Agency Ranking