SURFACE TEXTURING USING ENERGY PULSES

    公开(公告)号:US20230120034A1

    公开(公告)日:2023-04-20

    申请号:US18067438

    申请日:2022-12-16

    Abstract: A system includes an energy source, a focusing system, and a controller. The energy source is configured to output energy pulses to the focusing system. A chamber surrounds at least a portion of a metallic substrate and contain a liquid in contact with a surface of the metallic substrate. The controller is configured to cause the energy source to output energy pulses and cause the focusing system to focus a focal volume of the energy pulses at or near the surface of the metallic substrate that is in contact with the liquid to create micro-scale or smaller surface texturing on the metallic substrate.

    Surface texturing using energy pulses

    公开(公告)号:US11548092B2

    公开(公告)日:2023-01-10

    申请号:US16353119

    申请日:2019-03-14

    Abstract: A system includes an energy source, a focusing system, and a controller. The energy source is configured to output energy pulses to the focusing system. A chamber surrounds at least a portion of a metallic substrate and contains a liquid in contact with a surface of the metallic substrate. The controller is configured to cause the energy source to output energy pulses and cause the focusing system to focus a focal volume of the energy pulses at or near the surface of the metallic substrate that is in contact with the liquid to create micro-scale or smaller surface texturing on the metallic substrate.

    LASER CUTTING SYSTEM
    5.
    发明申请

    公开(公告)号:US20210154772A1

    公开(公告)日:2021-05-27

    申请号:US17086946

    申请日:2020-11-02

    Abstract: A system may include an emitting device and a controller. The emitting device may be adapted to emit a first laser beam and a second laser beam. The controller may include one or more processors and may be operably coupled to the emitting device to control emission of the first and second laser beams. The controller may be adapted to remove a portion of a workpiece to form an exposed surface of the workpiece with the first laser beam using the emitting device and to remove a portion of the exposed surface with the second laser beam using the emitting device.

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