公开(公告)号：US12284783B2

公开(公告)日：2025-04-22

申请号：US17534645

申请日：2021-11-24

Applicant: Mellanox Technologies Ltd.

Inventor： Oren Weltsch ,  Rom Becker ,  Shay Zaretsky ,  Ayal Shabtay ,  Beeri Halachmi ,  Yuval Blayer ,  Kfir Katz ,  Yuval Dagan ,  Bar Noyman

IPC: H05K7/20 ,  G06F1/20

Abstract: A device may include: a frame having an interior; an electronic component; a heat conducting body in thermal contact with the electronic component; a conduit containing a liquid coolant, the conduit being coupled to the heat conducting body to deliver the liquid coolant to and from the heat conducting body; and a pump positioned within the interior of the frame, the pump being removably insertable into the interior of the frame and being removably couplable to the conduit to circulate the liquid coolant through the conduit.

公开(公告)号：US10320113B2

公开(公告)日：2019-06-11

申请号：US15786222

申请日：2017-10-17

Applicant: MELLANOX TECHNOLOGIES, LTD.

Inventor： Nimer Khazen ,  Yaniv Kazav ,  Ayal Shabtay ,  Michal Shlomai ,  Tom David ,  Kfir Katz ,  Oren Weltsch ,  Beeri Halachmi ,  Aziz Mazbar

IPC: H05K7/20 ,  H01R13/518 ,  H01R13/6582 ,  G02B6/44 ,  G02B6/42 ,  H01R13/6592

Abstract: Apparatuses and associated methods of manufacturing are described that provide a cage receptacle assembly configured to receive a cable connector. The cage receptacle assembly includes a cage body defining a first end and a second end. The cage body includes a top cage member attached to a bottom cage member via two side portions of the top cage member, and the bottom cage member defines an opening. The cage receptacle assembly defines a heat dissipation unit disposed within the opening of the bottom cage member, and the heat dissipation unit includes one or more heat dissipation elements allowing heat to be transferred from the cable connector to an external environment of the cage receptacle assembly.

公开(公告)号：US20230273072A1

公开(公告)日：2023-08-31

申请号：US17729328

申请日：2022-04-26

Applicant: Mellanox Technologies, Ltd.

Inventor： Shai Cohen ,  Amihai Moshe Kopel ,  Beeri Halachmi ,  Alexander Kaminsky

IPC: G01K3/06 ,  G01K1/02 ,  G01K7/00 ,  G01K3/00

CPC classification number: G01K3/06 ,  G01K1/026 ,  G01K7/00 ,  G01K3/005

Abstract: A system includes a memory device and a processing device, operatively coupled to the memory device, to perform operations including receiving, from a thermal sensor group including thermal sensors, hotspot temperature measurements with respect to a hotspot. Each temperature measurement is received from a respective thermal sensor. The operations further include determining, from the temperature measurements, a generalized hotspot temperature measurement for the thermal sensor group.

公开(公告)号：US20250126743A1

公开(公告)日：2025-04-17

申请号：US18487086

申请日：2023-10-15

Applicant: MELLANOX TECHNOLOGIES, LTD.

Inventor： Beeri Halachmi ,  Nir Einati ,  Vadim Pasternak

IPC: H05K7/20 ,  F04D27/00

Abstract: An apparatus includes an interface and thermal management circuitry (TMC). The interface is configured to receive multiple measurements of multiple temperatures measured in multiple locations of an electronic system, respectively. The TMC is configured to: (a) convert the multiple measurements into multiple pulse width modulation (PWM) parameters, (b) calculate, based on at least the multiple PWM parameters, one or more PWM signals, and (c) control the multiple temperatures by applying the one or more PWM signals to one or more cooling devices.

公开(公告)号：US12253423B2

公开(公告)日：2025-03-18

申请号：US17729328

申请日：2022-04-26

Applicant: Mellanox Technologies, Ltd.

Inventor： Shai Cohen ,  Amihai Moshe Kopel ,  Beeri Halachmi ,  Alexander Kaminsky

IPC: G01K3/06 ,  G01K1/02 ,  G01K3/00 ,  G01K7/00

Abstract: A system includes a memory device and a processing device, operatively coupled to the memory device, to perform operations including receiving, from a thermal sensor group including thermal sensors, hotspot temperature measurements with respect to a hotspot. Each temperature measurement is received from a respective thermal sensor. The operations further include determining, from the temperature measurements, a generalized hotspot temperature measurement for the thermal sensor group.

公开(公告)号：US20230164948A1

公开(公告)日：2023-05-25

申请号：US17534645

申请日：2021-11-24

Applicant: Mellanox Technologies Ltd.

Inventor： Oren WELTSCH ,  Rom Becker ,  Shay Zaretsky ,  Ayal Shabtay ,  Beeri Halachmi ,  Yuval Blayer ,  Kfir Katz ,  Yuval Dagan ,  Bar NOYMAN

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20272 ,  H05K7/20263 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20781

Abstract: A device may include: a frame having an interior; an electronic component; a heat conducting body in thermal contact with the electronic component; a conduit containing a liquid coolant, the conduit being coupled to the heat conducting body to deliver the liquid coolant to and from the heat conducting body; and a pump positioned within the interior of the frame, the pump being removably insertable into the interior of the frame and being removably couplable to the conduit to circulate the liquid coolant through the conduit.

公开(公告)号：US11282765B2

公开(公告)日：2022-03-22

申请号：US16815546

申请日：2020-03-11

Applicant: Mellanox Technologies, Ltd.

Inventor： Ilan Langut ,  Beeri Halachmi

IPC: H01L23/00 ,  H01L23/367

Abstract: A stiffener ring for an ASIC package has a non-uniform cross-section.