公开(公告)号：US20130292853A1

公开(公告)日：2013-11-07

申请号：US13933607

申请日：2013-07-02

Applicant: Micron Technology, Inc.

Inventor： Seng Kim Dalson Ye ,  Chin Hui Chong ,  Choon Kuan Lee ,  Wang Lai Lee ,  Roslan Bin Said

IPC: H01L25/00

CPC classification number: H01L23/3128 ,  H01L21/561 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L25/00 ,  H01L25/105 ,  H01L25/117 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/16055 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

Abstract: Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices are described herein. In one embodiment, a set of stacked microelectronic devices includes (a) a first microelectronic die having a first side and a second side opposite the first side, (b) a first substrate attached to the first side of the first microelectronic die and electrically coupled to the first microelectronic die, (c) a second substrate attached to the second side of the first microelectronic die, (d) a plurality of electrical couplers attached to the second substrate, (e) a third substrate coupled to the electrical couplers, and (f) a second microelectronic die attached to the third substrate. The electrical couplers are positioned such that at least some of the electrical couplers are inboard the first microelectronic die.

公开(公告)号：US20150137364A1

公开(公告)日：2015-05-21

申请号：US14470831

申请日：2014-08-27

Applicant: Micron Technology, Inc.

Inventor： Seng Kim Dalson Ye ,  Chin Hui Chong ,  Choon Kuan Lee ,  Wang Lai Lee ,  Roslan Bin Said

IPC: H01L23/31 ,  H01L25/11 ,  H01L23/00

CPC classification number: H01L23/3128 ,  H01L21/561 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L25/00 ,  H01L25/105 ,  H01L25/117 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/16055 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

Abstract: Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices are described herein. In one embodiment, a set of stacked microelectronic devices includes (a) a first microelectronic die having a first side and a second side opposite the first side, (b) a first substrate attached to the first side of the first microelectronic die and electrically coupled to the first microelectronic die, (c) a second substrate attached to the second side of the first microelectronic die, (d) a plurality of electrical couplers attached to the second substrate, (e) a third substrate coupled to the electrical couplers, and (f) a second microelectronic die attached to the third substrate. The electrical couplers are positioned such that at least some of the electrical couplers are inboard the first microelectronic die.

公开(公告)号：US08823159B2

公开(公告)日：2014-09-02

申请号：US13933607

申请日：2013-07-02

Applicant: Micron Technology, Inc.

Inventor： Seng Kim Dalson Ye ,  Chin Hui Chong ,  Choon Kuan Lee ,  Wang Lai Lee ,  Roslan Bin Said

IPC: H01L23/02

CPC classification number: H01L23/3128 ,  H01L21/561 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L25/00 ,  H01L25/105 ,  H01L25/117 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/16055 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

Abstract: Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices are described herein. In one embodiment, a set of stacked microelectronic devices includes (a) a first microelectronic die having a first side and a second side opposite the first side, (b) a first substrate attached to the first side of the first microelectronic die and electrically coupled to the first microelectronic die, (c) a second substrate attached to the second side of the first microelectronic die, (d) a plurality of electrical couplers attached to the second substrate, (e) a third substrate coupled to the electrical couplers, and (f) a second microelectronic die attached to the third substrate. The electrical couplers are positioned such that at least some of the electrical couplers are inboard the first microelectronic die.

Abstract translation: 本文描述了微电子器件，堆叠的微电子器件以及用于制造微电子器件的方法。 在一个实施例中，一组堆叠的微电子器件包括（a）具有第一侧和与第一侧相对的第二侧的第一微电子管芯，（b）附接到第一微电子管芯的第一侧的第一衬底， （c）附接到第一微电子管芯的第二侧的第二衬底，（d）附接到第二衬底的多个电耦合器，（e）耦合到电耦合器的第三衬底，以及 （f）附接到第三基板的第二微电子管芯。 电耦合器被定位成使得至少一些电耦合器在第一微电子管芯内。

公开(公告)号：US09640458B2

公开(公告)日：2017-05-02

申请号：US14470831

申请日：2014-08-27

Applicant: Micron Technology, Inc.

Inventor： Seng Kim Dalson Ye ,  Chin Hui Chong ,  Choon Kuan Lee ,  Wang Lai Lee ,  Roslan Bin Said

IPC: H01L23/31 ,  H01L25/065 ,  H01L25/07 ,  H01L23/12 ,  H01L21/56 ,  H01L23/498 ,  H01L23/00 ,  H01L25/10 ,  H01L25/00 ,  H01L25/11

CPC classification number: H01L23/3128 ,  H01L21/561 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L25/00 ,  H01L25/105 ,  H01L25/117 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/16055 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

Abstract: Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices are described herein. In one embodiment, a set of stacked microelectronic devices includes (a) a first microelectronic die having a first side and a second side opposite the first side, (b) a first substrate attached to the first side of the first microelectronic die and electrically coupled to the first microelectronic die, (c) a second substrate attached to the second side of the first microelectronic die, (d) a plurality of electrical couplers attached to the second substrate, (e) a third substrate coupled to the electrical couplers, and (f) a second microelectronic die attached to the third substrate. The electrical couplers are positioned such that at least some of the electrical couplers are inboard the first microelectronic die.

公开(公告)号：US11239128B2

公开(公告)日：2022-02-01

申请号：US16543430

申请日：2019-08-16

Applicant: Micron Technology, Inc.

Inventor： Seng Kim Dalson Ye ,  Chin Hui Chong ,  Choon Kuan Lee ,  Wang Lai Lee ,  Roslan Bin Said

IPC: H01L23/31 ,  H01L23/498 ,  H01L25/00 ,  H01L21/56 ,  H01L23/00 ,  H01L25/10 ,  H01L25/11 ,  H01L21/58 ,  H01L21/60 ,  H01L21/98

Abstract: Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices are described herein. In one embodiment, a set of stacked microelectronic devices includes (a) a first microelectronic die having a first side and a second side opposite the first side, (b) a first substrate attached to the first side of the first microelectronic die and electrically coupled to the first microelectronic die, (c) a second substrate attached to the second side of the first microelectronic die, (d) a plurality of electrical couplers attached to the second substrate, (e) a third substrate coupled to the electrical couplers, and (f) a second microelectronic die attached to the third substrate. The electrical couplers are positioned such that at least some of the electrical couplers are inboard the first microelectronic die.

公开(公告)号：US10431513B2

公开(公告)日：2019-10-01

申请号：US15583826

申请日：2017-05-01

Applicant: Micron Technology, Inc.

Inventor： Seng Kim Dalson Ye ,  Chin Hui Chong ,  Choon Kuan Lee ,  Wang Lai Lee ,  Roslan Bin Said

IPC: H01L25/10 ,  H01L25/11 ,  H01L23/31 ,  H01L23/498 ,  H01L21/56 ,  H01L25/00 ,  H01L21/58 ,  H01L21/60 ,  H01L23/00

Abstract: Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices are described herein. In one embodiment, a set of stacked microelectronic devices includes (a) a first microelectronic die having a first side and a second side opposite the first side, (b) a first substrate attached to the first side of the first microelectronic die and electrically coupled to the first microelectronic die, (c) a second substrate attached to the second side of the first microelectronic die, (d) a plurality of electrical couplers attached to the second substrate, (e) a third substrate coupled to the electrical couplers, and (f) a second microelectronic die attached to the third substrate. The electrical couplers are positioned such that at least some of the electrical couplers are inboard the first microelectronic die.

公开(公告)号：US20170301598A1

公开(公告)日：2017-10-19

申请号：US15583826

申请日：2017-05-01

Applicant: Micron Technology, Inc.

Inventor： Seng Kim Dalson Ye ,  Chin Hui Chong ,  Choon Kuan Lee ,  Wang Lai Lee ,  Roslan Bin Said

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L25/00 ,  H01L25/10 ,  H01L25/11 ,  H01L23/498

CPC classification number: H01L23/3128 ,  H01L21/561 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L25/00 ,  H01L25/105 ,  H01L25/117 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/16055 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01052 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

Abstract: Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices are described herein. In one embodiment, a set of stacked microelectronic devices includes (a) a first microelectronic die having a first side and a second side opposite the first side, (b) a first substrate attached to the first side of the first microelectronic die and electrically coupled to the first microelectronic die, (c) a second substrate attached to the second side of the first microelectronic die, (d) a plurality of electrical couplers attached to the second substrate, (e) a third substrate coupled to the electrical couplers, and (f) a second microelectronic die attached to the third substrate. The electrical couplers are positioned such that at least some of the electrical couplers are inboard the first microelectronic die.