Method for manufacturing a high voltage MOSFET device with reduced on-resistance
    1.
    发明授权
    Method for manufacturing a high voltage MOSFET device with reduced on-resistance 有权
    制造具有降低的导通电阻的高压MOSFET器件的方法

    公开(公告)号:US06492679B1

    公开(公告)日:2002-12-10

    申请号:US09920655

    申请日:2001-08-03

    IPC分类号: H01L2976

    摘要: A high voltage MOSFET device (100) has a well region (113) with two areas. The first area (110) has a high dopant concentration and the second area (112) has a low dopant concentration. Inside the well region a region of a secondary conductivity type (108) is formed. The second area (110) is typically underlying a gate region (105). The lower doping concentration in that area helps to increase the breakdown voltage when the semiconductor device is blocking voltage and helps to decrease the on-resistance when the semiconductor device is in the “on” state. The MOSFET device further has a p-top layer (108) which is disposed on the top surface of the well region and then driven into the well region by annealing the MOSFET device at a high temperature in an inert atmosphere.

    摘要翻译: 高电压MOSFET器件(100)具有带有两个区域的阱区(113)。 第一区域(110)具有高掺杂剂浓度,第二区域(112)具有低掺杂剂浓度。 在阱区内形成二次导电型(108)的区域。 第二区域(110)通常位于栅极区域(105)下方。 当半导体器件处于“导通”状态时,该半导体器件阻挡电压并有助于降低导通电阻,该区域中较低的掺杂浓度有助于提高击穿电压。 MOSFET器件还具有p顶层(108),其设置在阱区的顶表面上,然后通过在惰性气氛中的高温退火MOSFET器件而被驱动进入阱区。

    High voltage metal oxide device with enhanced well region
    3.
    发明授权
    High voltage metal oxide device with enhanced well region 有权
    具有增强井区的高压金属氧化物装置

    公开(公告)号:US06448625B1

    公开(公告)日:2002-09-10

    申请号:US09808966

    申请日:2001-03-16

    IPC分类号: H01L2358

    摘要: A high voltage MOS device (100) is disclosed. The MOS device comprises an n-well region (113) with two areas. The first area (110) has a high dopant concentration and the second area (112) has a low dopant concentration. Inside the well region a region of a secondary conductivity type (108) is formed. The second area (110) is typically underlying a gate (105). The lower doping concentration in that area helps to increase the breakdown voltage when the device is blocking voltage and helps to decrease on-resistance when the device is in the “on” state.

    摘要翻译: 公开了一种高压MOS器件(100)。 MOS器件包括具有两个区域的n阱区域(113)。 第一区域(110)具有高掺杂剂浓度,第二区域(112)具有低掺杂剂浓度。 在阱区内部形成二次导电型(108)的区域。 第二区域(110)通常位于门(105)下方。 当器件处于“导通”状态时,该器件阻塞电压时,该区域中较低的掺杂浓度有助于提高击穿电压,有助于降低导通电阻。

    LDMOS transistor with enhanced termination region for high breakdown voltage with low on-resistance
    4.
    发明授权
    LDMOS transistor with enhanced termination region for high breakdown voltage with low on-resistance 有权
    LDMOS晶体管具有增强的端接区域,具有高导通电阻的高击穿电压

    公开(公告)号:US06919598B2

    公开(公告)日:2005-07-19

    申请号:US10384144

    申请日:2003-03-10

    摘要: A structure for making a LDMOS transistor (100) includes an interdigitated source finger (26) and a drain finger (21) on a substrate (15). Termination regions (35, 37) are formed at the tips of the source finger and drain finger. A drain (45) of a second conductivity type is formed in the substrate of a first conductivity type. A field reduction region (7) of a second conductivity type is formed in the drain and is wrapped around the termination regions for controlling the depletion at the tip and providing higher voltage breakdown of the transistor.

    摘要翻译: 用于制造LDMOS晶体管(100)的结构在衬底(15)上包括交叉指状的源极指(26)和漏极指(21)。 终端区域(35,37)形成在源极指和漏极指的尖端处。 在第一导电类型的衬底中形成第二导电类型的漏极(45)。 在漏极中形成第二导电类型的场致还区域(7),并且围绕终端区域缠绕以控制尖端的耗尽并提供晶体管的较高的电压击穿。

    LDMOS transistor with enhanced termination region for high breakdown voltage with on-resistance
    6.
    发明授权
    LDMOS transistor with enhanced termination region for high breakdown voltage with on-resistance 有权
    LDMOS晶体管具有增强的端接区域,具有导通电阻的高击穿电压

    公开(公告)号:US07208385B2

    公开(公告)日:2007-04-24

    申请号:US11102173

    申请日:2005-04-11

    IPC分类号: H01L21/336 H01L21/425

    摘要: A structure for making a LDMOS transistor (100) includes an interdigitated source finger (26) and a drain finger (21) on a substrate (15). Termination regions (35, 37) are formed at the tips of the source finger and drain finger. A drain (45) of a second conductivity type is formed in the substrate of a first conductivity type. A field reduction region (7) of a second conductivity type is formed in the drain and is wrapped around the termination regions for controlling the depletion at the tip and providing higher voltage breakdown of the transistor.

    摘要翻译: 用于制造LDMOS晶体管(100)的结构在衬底(15)上包括交叉指状的源极指(26)和漏极指(21)。 终端区域(35,37)形成在源极指和漏极指的尖端处。 在第一导电类型的衬底中形成第二导电类型的漏极(45)。 在漏极中形成第二导电类型的场致还区域(7),并且围绕终端区域缠绕以控制尖端的耗尽并提供晶体管的较高的电压击穿。

    LDMOS transistor with enhanced termination region for high breakdown voltage with on-resistance
    7.
    发明申请
    LDMOS transistor with enhanced termination region for high breakdown voltage with on-resistance 有权
    LDMOS晶体管具有增强的端接区域,具有导通电阻的高击穿电压

    公开(公告)号:US20050179108A1

    公开(公告)日:2005-08-18

    申请号:US11102173

    申请日:2005-04-11

    摘要: A structure for making a LDMOS transistor (100) includes an interdigitated source finger (26) and a drain finger (21) on a substrate (15). Termination regions (35, 37) are formed at the tips of the source finger and drain finger. A drain (45) of a second conductivity type is formed in the substrate of a first conductivity type. A field reduction region (7) of a second conductivity type is formed in the drain and is wrapped around the termination regions for controlling the depletion at the tip and providing higher voltage breakdown of the transistor.

    摘要翻译: 用于制造LDMOS晶体管(100)的结构在衬底(15)上包括交叉指状的源极指(26)和漏极指(21)。 终端区域(35,37)形成在源极指和漏极指的尖端处。 在第一导电类型的衬底中形成第二导电类型的漏极(45)。 在漏极中形成第二导电类型的场致还区域(7),并且围绕终端区域缠绕以控制尖端的耗尽并提供晶体管的较高的电压击穿。

    Method of forming a semiconductor device and structure therefor
    8.
    发明授权
    Method of forming a semiconductor device and structure therefor 有权
    形成半导体器件的方法及其结构

    公开(公告)号:US06589845B1

    公开(公告)日:2003-07-08

    申请号:US10195166

    申请日:2002-07-16

    IPC分类号: H01L21336

    摘要: A method of forming a semiconductor device (10, 40, 45, 50) forms a plurality of P and N stripes (16,17) within a first region (12) that is formed with an opposite conductivity to a substrate (11). The plurality of P and N stripes assist in providing a low on-resistance. A portion (15) of the first region underlies the P and N stripes and protects the semiconductor device from high voltages applied to the drain. A base layer (41) and a cap layer (48) further reduce the on-resistance of the semiconductor device.

    摘要翻译: 形成半导体器件(10,40,45,50)的方法在与衬底(11)相反的导电性形成的第一区域(12)内形成多个P和N条纹(16,17)。 多个P和N条纹有助于提供低导通电阻。 第一区域的一部分(15)位于P和N条纹之下,并保护半导体器件免受施加到漏极的高电压。 基底层(41)和盖层(48)进一步降低半导体器件的导通电阻。

    Merged semiconductor device and method
    9.
    发明授权
    Merged semiconductor device and method 有权
    合并半导体器件及方法

    公开(公告)号:US06492687B2

    公开(公告)日:2002-12-10

    申请号:US09849898

    申请日:2001-05-07

    IPC分类号: H01L2976

    摘要: A semiconductor device (20) is formed on a substrate (21) that has first and second well regions (25, 26) formed at a surface (18) of the substrate. A control electrode (34) extends over the surface to activate a first channel (42) with a control signal (V14) for routing a current (IN) from a first node (13) of the semiconductor device to an edge (43) of the first well region. The control signal further activates a second channel (46) for routing the current from an edge (45) of the second well region to a second node (15) of the semiconductor device.

    摘要翻译: 半导体器件(20)形成在具有形成在衬底的表面(18)处的第一和第二阱区(25,26)的衬底上。 控制电极(34)在表面上延伸以利用控制信号(V14)激活第一通道(42),用于将电流(IN)从半导体器件的第一节点(13)引导到半导体器件的边缘(43) 第一个井区。 控制信号进一步激活用于将电流从第二阱区域的边缘(45)引导到半导体器件的第二节点(15)的第二通道(46)。

    NMOSFET with negative voltage capability formed in P-type substrate and method of making the same
    10.
    发明授权
    NMOSFET with negative voltage capability formed in P-type substrate and method of making the same 有权
    在P型衬底中形成具有负电压能力的NMOSFET及其制造方法

    公开(公告)号:US06555877B2

    公开(公告)日:2003-04-29

    申请号:US09939552

    申请日:2001-08-27

    IPC分类号: H01L2701

    摘要: A semiconductor device (10,50) is disclosed which can accommodate a negative voltage on its source using a P-type substrate (12) which is connected to ground potential. A first embodiment illustrates a device which can handle high voltage applications as well as a negative voltage applied to the source. A drain contact region (29) is recessed by a dimension (X) from a first insulated region (18). The dimension (X) provides for an optimum distance for high voltage applications while avoiding lateral surface punch-through. A second embodiment illustrates a gate structure (52) having a shape which surrounds a drain contact region (62) and accommodates a high voltage application while also eliminating the lateral surface punch-through. The drain contact region (62) is formed in a P-type region (20) centered inside the gate structure (52).

    摘要翻译: 公开了一种半导体器件(10,50),其可以使用连接到地电势的P型衬底(12)来容纳其源极上的负电压。 第一实施例示出了可以处理高电压应用以及施加到源极的负电压的装置。 漏极接触区域(29)从第一绝缘区域(18)凹入尺寸(X)。 尺寸(X)为高电压应用提供了最佳距离,同时避免了侧面穿孔。 第二实施例示出了具有围绕漏极接触区域(62)并且适应高电压施加的形状的栅极结构(52),同时还消除了侧面穿孔。 漏极接触区域(62)形成在以栅极结构(52)为中心的P型区域(20)中。