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公开(公告)号：US20150042417A1
公开(公告)日：2015-02-12
申请号：US14445431
申请日：2014-07-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Syuichi ONODERA , Syuji YAMATO , Tadaji TAKEMURA
CPC classification number: H03H9/6433 , H03H9/0009 , H03H9/0057 , H03H9/605 , H03H9/6479 , H03H9/6483 , H03H9/725
Abstract: A high-frequency module includes a multilayer substrate, a filter substrate, a cover layer, a connection electrode, and inductors. The filter substrate includes a first principal surface on which an IDT electrode included in a filter unit is disposed, and the first principal surface faces a mounting surface of the multilayer substrate. The cover layer is spaced apart from and opposite to the first principal surface of the filter substrate. The connection electrode connects the multilayer substrate and the filter substrate. One of the inductors is connected between the filter unit and a first external connection terminal. Another one of the inductors is connected between the filter unit and the ground. The inductors are disposed inside the multilayer substrate. The inductors are inductively coupled to each other.
Abstract translation: 高频模块包括多层基板，滤波器基板，覆盖层，连接电极和电感器。 过滤器基板包括第一主表面，其上布置有包括在过滤器单元中的IDT电极，并且第一主表面面对多层基板的安装表面。 覆盖层与过滤器基底的第一主表面间隔开并与其相对。 连接电极连接多层基板和过滤基板。 电感器之一连接在滤波器单元和第一外部连接端子之间。 电感器中的另一个连接在过滤器单元和地面之间。 电感器设置在多层基板内。 电感器彼此感应耦合。
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公开(公告)号：US20190230781A1
公开(公告)日：2019-07-25
申请号：US16374194
申请日：2019-04-03
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Syuichi ONODERA
Abstract: A high-frequency module (1) includes a substrate (10), a first electronic component (13) and a second electronic component (14) that are provided on the substrate (10), an insulating layer (15) that covers a part of a side surface of the first electronic component (13) and a side surface and a top surface of the second electronic component (14), and a heat-dissipating layer (16) that covers at least a top surface of the first electronic component (13) and a portion of the side surface of the first electronic component (13) excluding the portion of the side surface of the first electronic component (13) in contact with the insulating layer (15).
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公开(公告)号：US20240022275A1
公开(公告)日：2024-01-18
申请号：US18475222
申请日：2023-09-27
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kiyoshi AIKAWA , Takanori UEJIMA , Hiromichi KITAJIMA , Takashi YAMADA , Yoshihiro DAIMON , Syuichi ONODERA , Yuudai TANOUE , Norihiro SHIMADA
CPC classification number: H04B1/38 , H01Q1/2283 , H03H9/25 , H03H7/38
Abstract: A radio-frequency module includes a module substrate having major surfaces opposite to each other; a module substrate having major surfaces opposite to each other, the major surface being disposed facing the major surface; a first electronic component disposed on the major surface; a second electronic component that includes a first electrode joined to the major surface and a second electrode joined to the major surface and that is disposed between the major surfaces; and a third electronic component disposed on the major surface; and an external connection terminal disposed on the major surface. The second electronic component is at least one of a chip inductor, a chip capacitor, and a chip resistor. The second electronic component is coupled via the first electrode to the first electronic component and is coupled via the second electrode to the third electronic component or external connection terminal.
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公开(公告)号：US20210391880A1
公开(公告)日：2021-12-16
申请号：US17321518
申请日：2021-05-17
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Syuichi ONODERA
Abstract: A radio-frequency module includes a module substrate having a first major surface and a second major surface, a receive filter, a low-noise amplifier, an antenna switch, a first matching circuit disposed on the input side of the receive filter, a second matching circuit disposed on the output side of the receive filter, and a control circuit. The receive filter and the first and second matching circuits are arranged at the first major surface. The low-noise amplifier, the antenna switch, and the control circuit are arranged at the second major surface. When the module substrate is viewed in plan view, the receive filter is positioned between the first and second matching circuits, the control circuit is positioned between the antenna switch and the low-noise amplifier, and respective footprints of the second matching circuit and the low-noise amplifier coincide with each other.
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公开(公告)号：US20210391883A1
公开(公告)日：2021-12-16
申请号：US17346334
申请日：2021-06-14
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Syuichi ONODERA
IPC: H04B1/16
Abstract: A radio-frequency module includes a module substrate having a first major surface and a second major surface, a first receive filter configured to pass a receive signal in a first communication band, a second receive filter configured to pass a receive signal in a second communication band, an antenna switch configured to control connection between the first receive filter and an antenna connection terminal and also control connection between the second receive filter and the antenna connection terminal, and a matching circuit coupled between the antenna connection terminal and the first receive filter. The matching circuit includes matching switches and at least one of an inductor and a capacitor. The first receive filter and the second receive filter are disposed at the first major surface. The antenna switch and the matching switches are included in a single semiconductor integrated circuit disposed at the second major surface.
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Patent Agency Ranking
公开(公告)号：US20180287582A1
公开(公告)日：2018-10-04
申请号：US15997779
申请日：2018-06-05
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Naoya MATSUMOTO , Syuichi ONODERA , Kouichi UENO , Shinya MIZOGUCHI , Masahide TAKEBE
Abstract: A high-frequency module that performs filtering of signals transmitted and received through an antenna includes an antenna terminal, a transmission terminal, a reception terminal, a reception filter connected between the antenna terminal and the reception terminal, a transmission filter connected between the antenna terminal and the transmission terminal, a first element connected between the antenna terminal and the transmission filter, and a second element connected in series between the transmission terminal and the transmission filter. The first element and the second element are capacitively coupled to each other.
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公开(公告)号：US20250112666A1
公开(公告)日：2025-04-03
申请号：US18977963
申请日：2024-12-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Akira OGASAWARA , Syuichi ONODERA
Abstract: A radio frequency circuit includes a filter with a pass band including at least a part of a band (A) for TDD; a filter with a pass band including at least a part of the band (A); and a switch circuit that has (i) a first mode in which the filter is connected between an antenna connection terminal and a radio frequency input terminal, (ii) a second mode in which the filter is connected between the antenna connection terminal and a radio frequency output terminal, and (iii) a third mode in which the filters are connected in series between the antenna connection terminal and the radio frequency input terminal or between the antenna connection terminal and the radio frequency output terminal.
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公开(公告)号：US20220123728A1
公开(公告)日：2022-04-21
申请号：US17646312
申请日：2021-12-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Syuichi ONODERA
Abstract: Reduced in size is a radio frequency component provided on a main surface of a mounting substrate on which an external connection electrode is disposed. A radio frequency module includes a mounting substrate, a first radio frequency component, and an external connection electrode. The mounting substrate has a first main surface and a second main surface opposed to each other. The first radio frequency component has a signal terminal and a ground terminal. The first radio frequency component is provided on the second main surface. The external connection electrode is provided on the second main surface. The first radio frequency component has a third main surface and a fourth main surface opposed to each other. The signal terminal is provided on the third main surface. The ground terminal is provided on the fourth main surface.
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公开(公告)号：US20170111078A1
公开(公告)日：2017-04-20
申请号：US15390880
申请日：2016-12-27
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Syuichi ONODERA , Koichi UENO , Naoya MATSUMOTO
CPC classification number: H04B1/44 , H03H2/005 , H03H7/09 , H03H9/0566 , H03H9/46 , H03H9/64 , H03H9/6483 , H03H9/725 , H03H11/16 , H04B1/525 , H04M1/0202 , H04M1/0277
Abstract: An inductor that adjust characteristics of a transmit filter circuit is disposed so that the inductor and at least one of common paths, a matching circuit, a receive filter circuit, and receive paths connected to an output terminal of the transmit filter circuit define a propagation path due to magnetic-field coupling and/or electric-field coupling. This configuration does not require the addition of a circuit device to define the propagation path. It is thus possible to improve attenuation characteristics for an RF signal outside the frequency band of a transmitting signal and to improve isolation characteristics between a transmit filter circuit and a receive filter circuit without increasing the size of a radio-frequency module.
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公开(公告)号：US20140057080A1
公开(公告)日：2014-02-27
申请号：US14068053
申请日：2013-10-31
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kunio IWAKOSHI , Syuichi ONODERA , Takao OKANO , Yoshihito OTSUBO
IPC: H05K3/00
CPC classification number: H05K3/0091 , H01L21/4853 , H01L23/15 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L2924/0002 , H05K1/111 , H05K3/1216 , H05K3/246 , H05K3/38 , H05K3/4007 , H05K3/4629 , H05K2203/0278 , H05K2203/0545 , H05K2203/1476 , Y10T428/24488 , H01L2924/00
Abstract: In an electronic component, a peripheral portion of an external terminal electrode is thicker than a center portion thereof, and at least a portion of the peripheral portion is buried in a component main body. A surface of the external terminal electrode and a principal surface of the component main body are located on the same plane. An electrically insulating coating layer is arranged along the principal surface of the component main body so as to cover at least a portion of the peripheral portion of the external terminal electrode. An end portion of the coating layer is in contact with a thickest portion of the peripheral portion of the external terminal electrode in the principal surface of the component main body. The coating layer and the surface of the external terminal electrode are located on the same plane.
Abstract translation: 在电子部件中，外部端子电极的周边部比其中央部厚，并且周边部的至少一部分埋设在部件主体中。 外部端子电极的表面和部件主体的主表面位于同一平面上。 沿着部件主体的主表面布置电绝缘涂层，以覆盖外部端子电极的周边部分的至少一部分。 涂层的端部与组件主体的主表面中的外部端子电极的周边部分的最厚部分接触。 涂层和外部端子电极的表面位于同一平面上。
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