公开(公告)号：US20210324889A1

公开(公告)日：2021-10-21

申请号：US17271765

申请日：2019-10-23

Applicant: NHK Spring Co., Ltd.

Inventor： Masaru Takimoto ,  Toshihiko Hanamachi ,  Junichi Nakayama

IPC: F16B5/06

Abstract: A joined body includes: a main body section including a wall section forming a passage along which a medium for accelerating heat exchange flows; and a cover configured to cover a surface of the main body section, the cover including: a covering section provided on a side facing the main body section and configured to cover the surface; a groove section provided on the side facing the main body section and configured to accommodate an end portion of the wall section; and a stirred joint section provided on a side opposite to a side where the covering section and the groove section are provided, the stirred joint section being at least partly frictionally stirred by a depth reaching a bottom of the groove section from a surface on a side opposite to the side facing the main body section and bonded to the end portion of the wall section.

公开(公告)号：US11477858B2

公开(公告)日：2022-10-18

申请号：US16653094

申请日：2019-10-15

Applicant: NHK SPRING CO., LTD.

Inventor： Toshihiko Hanamachi ,  Kenji Sekiya ,  Daisuke Hashimoto ,  Satoshi Hirano ,  Masaru Takimoto ,  Go Takahara ,  Yoshihito Araki ,  Arata Tatsumi ,  Takashi Kawasaki ,  Yuki Toyama ,  Satoshi Anzai

IPC: H05B3/10 ,  H05B3/18 ,  H05B3/48 ,  H05B3/74 ,  H05B3/03

Abstract: A small diameter sheath heater with improved reliability is provided. The sheath heater according to one embodiment of the present invention includes a metal sheath, a heating wire having a band shape, the heating wire arranged with a gap within the metal sheath so as to rotate with respect to an axis direction of the metal sheath, an insulating material arranged in the gap, and connection terminals arranged at one end of the metal sheath, the connection terminals electrically connected with both ends of the heating wire respectively.

公开(公告)号：US20220026151A1

公开(公告)日：2022-01-27

申请号：US17312110

申请日：2019-12-03

Applicant: NHK Spring Co., Ltd.

Inventor： Yoshihito Araki ,  Shuhei Morota ,  Toshihiko Hanamachi ,  Hibiki Yokoyama

IPC: F28D1/02 ,  F28D1/053 ,  F28F1/04 ,  F28F1/02 ,  F28F9/02

Abstract: A plate includes: a main body; a flow channel provided in the main body and configured to flow inert gas therein; a cover configured to cover a surface of the main body where the flow channel is formed; a buried member buried in an opening of the flow channel, the buried member including a buried portion fixed to the flow channel and made of dense ceramic, and a flow portion held by the buried portion and configured to let the inert gas flow from an inside to an outside of the main body, at least a part of the flow portion being made of porous ceramic; and a plurality of through holes provided in the flow portion. A ratio of a diameter of an outer circumference of the buried portion to a diameter of a smallest circle among circles including all of the through holes is 1.2 or higher.

公开(公告)号：US20210292911A1

公开(公告)日：2021-09-23

申请号：US17259609

申请日：2019-07-17

Applicant: NHK Spring Co., Ltd. ,  IZUMI TECHNO INC.

Inventor： Toshihiko Hanamachi ,  Shuhei Morota ,  Go Takahara ,  Masaru Takimoto ,  Hibiki Yokoyama ,  Hiroshi Mitsuda ,  Yoshihito Araki ,  Kengo Ajisawa

IPC: C23C28/04

Abstract: A member for a plasma processing device includes: an aluminum base material; and an oxide film formed on the aluminum base material and having a porous structure, the oxide film including a first oxide film formed on a surface of the aluminum base material, a second oxide film formed on the first oxide film, and a third oxide film formed on the second oxide film, wherein the first oxide film is harder than the second oxide film and the third oxide film, and a hole formed in each of the first oxide film, the second oxide film and the third oxide film is sealed.

公开(公告)号：US09551071B2

公开(公告)日：2017-01-24

申请号：US14845865

申请日：2015-09-04

Applicant: NHK SPRING CO., LTD.

Inventor： Toshihiko Hanamachi ,  Daisuke Hashimoto ,  Yasuaki Ishioka

IPC: C23C16/458 ,  H01L21/67 ,  H01L21/687 ,  C23C16/46 ,  B05C21/00

CPC classification number: C23C16/4586 ,  B05C21/00 ,  C23C16/463 ,  H01L21/67109 ,  H01L21/68785 ,  H01L21/68792

Abstract: A substrate support device includes a plate portion including a heater plate that includes a heating element provided in the heater plate, and also including a first cooling plate provided on a bottom surface of the heater plate and having a first flow path, and a second cooling plate provided on a top surface of the heater plate and having a second flow path; and a shaft portion supporting the plate portion and including a line connected to the heating element to supply an electric current to the heating element, and a tube supplying a coolant to the first cooling plate and the second cooling plate, the line and the tube being provided inside the shaft portion.

Abstract translation: 基板支撑装置包括板部，该板部包括加热板，该加热板包括设置在加热板中的加热元件，并且还包括设置在加热板的底面上并具有第一流路的第一冷却板， 设置在加热器板的顶表面上并具有第二流路; 以及轴部，其支撑所述板部，并且包括连接到所述加热元件的线以向所述加热元件供应电流;以及管向所述第一冷却板和所述第二冷却板供应冷却剂的管，所述管和管为 设置在轴部内。

公开(公告)号：US20220009022A1

公开(公告)日：2022-01-13

申请号：US17413680

申请日：2019-12-13

Applicant: NHK Spring Co., Ltd.

Inventor： Toshihiko Hanamachi ,  Daisuke Fujino ,  Masaru Takimoto ,  Yoshihito Araki ,  Masahiro Fujii

IPC: B23K20/02 ,  B23K20/00 ,  B23K20/233

Abstract: A joining method of joins a main body and a cover, the main body being a flat plate and made of aluminum or an aluminum alloy and including a passage through which a medium for promoting heat exchange is circulated, and the cover being a flat plate and made of aluminum or an aluminum alloy and configured to cover the passage of the main body. The method includes: a covering step of covering the main body with the cover; and a diffusion bonding step of joining the main body and the cover by diffusion bonding under a condition in which a joining temperature is 500° C. or higher and 640° C. or lower, and a joining surface pressure is 0.7 MPa or higher. Each of a joining surface of the main body and a joining surface of the cover has a flatness of 0.2 or less.

公开(公告)号：US12211710B2

公开(公告)日：2025-01-28

申请号：US17219316

申请日：2021-03-31

Applicant: NHK SPRING CO., LTD.

Inventor： Toshihiko Hanamachi ,  Arata Tatsumi ,  Kenji Sekiya ,  Naoya Aikawa ,  Masaya Takanashi

IPC: H01J37/32 ,  C23C16/458 ,  C23C16/46 ,  H01J37/34 ,  H01L21/67 ,  H01L21/687 ,  H05B3/28

Abstract: Disclosed is a stage including a first supporting plate, a second supporting plate under the first supporting plate, a shaft under the second supporting plate and overlapping with the first supporting plate and the second supporting plate, and at least one sheath heater passing through the second supporting plate. The at least one sheath heater is arranged so as to extend on a first surface and a second surface which are parallel to an upper surface of the second supporting plate and which are different in distance from the first supporting plate from each other.

公开(公告)号：US11201040B2

公开(公告)日：2021-12-14

申请号：US16553988

申请日：2019-08-28

Applicant: NHK SPRING CO., LTD.

Inventor： Go Takahara ,  Toshihiko Hanamachi ,  Arata Tatsumi

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/687 ,  C23C16/458 ,  C23C14/50 ,  C23C14/54

Abstract: A substrate supporting unit is provided. The substrate supporting unit possesses a shaft, a first heater, and a stage. The first heater is located in the shaft and is configured to heat an upper portion of the shaft. The stage is located over the shaft and includes a first plate, a second plate over the first plate, and a second heater between the first plate and the second plate.

公开(公告)号：US10290529B2

公开(公告)日：2019-05-14

申请号：US15948473

申请日：2018-04-09

Applicant: NHK SPRING CO., LTD.

Inventor： Toshihiko Hanamachi ,  Naoya Aikawa

IPC: H01L21/683 ,  H01L21/3065 ,  H01L21/02 ,  H05B3/18 ,  H05B3/74 ,  H01L21/67 ,  H05B3/28

Abstract: A heater unit having high in-plane temperature uniformity is provided. A heater unit includes a first heater part, a second heater part controlled independently of the first heater part, a base arranged with a groove in a region between the first heater part and the second heater part, and a cover part arranged at an opening end of the groove and providing a closed space with the groove. In addition, an insulating layer covering the first heater part and the second heater part, and an electrostatic chuck attached to the base via the insulating layer may be further included. In addition, the closed space provided by the cover part and the groove may be a vacuum.

公开(公告)号：US10276410B2

公开(公告)日：2019-04-30

申请号：US13667512

申请日：2012-11-02

Applicant: NHK SPRING CO., LTD.

Inventor： Toshihiro Tachikawa ,  Junichi Miyahara ,  Kazuhiro Yonekura ,  Toshihiko Hanamachi ,  Go Takahara ,  Jun Futakuchiya ,  Daisuke Hashimoto

IPC: H01L21/683 ,  H05B3/68 ,  H01L21/67 ,  H01L21/687

Abstract: A substrate support device formed of a metal and having a high withstand voltage and a high thermal resistance is provided. A substrate support device according to the present invention includes a plate section formed of a metal; a shaft section connected to the plate section and formed of a metal; a heating element provided in the plate section; and an insulating film formed on a first surface of the plate section, the first surface opposite to the shaft section, by ceramic thermal spraying. The substrate support device may further include an insulating film formed on a second surface of the plate section which intersects the first surface of the plate section approximately perpendicularly.