公开(公告)号：US10050411B2

公开(公告)日：2018-08-14

申请号：US14920134

申请日：2015-10-22

Applicant: NICHIA CORPORATION

Inventor： Akinori Yoneda ,  Shinya Sonobe ,  Hiroaki Yuto

IPC: H01S5/022 ,  C23C14/18 ,  C23C14/34 ,  C25D7/12 ,  C25D3/38 ,  C25D5/02

Abstract: The method includes the steps of: preparing a single crystal SiC including an upper surface 10a and a lower surface 10b and provided with a micropipe 11 penetrating from the upper surface 10a to the lower surface 10b; forming a first seed layer 21 made of a metal material on the upper surface 10a of the single crystal SiC; and forming a first plated layer 31 on the first seed layer 21 so as to close an upper end of the micropipe 11, using an electroplating method.

公开(公告)号：US11646544B2

公开(公告)日：2023-05-09

申请号：US17388728

申请日：2021-07-29

Applicant: NICHIA CORPORATION

Inventor： Tomonori Miyoshi ,  Hiroaki Yuto ,  Teruhiko Noguchi

IPC: H01S5/00 ,  H01S5/068 ,  H01S5/042 ,  H01S5/02257 ,  H01S5/024 ,  H01S5/02216 ,  H01S5/02325

CPC classification number: H01S5/0087 ,  H01S5/02257 ,  H01S5/042 ,  H01S5/06825 ,  H01S5/0071 ,  H01S5/02216 ,  H01S5/02325 ,  H01S5/02469

Abstract: A method of manufacturing an optical member includes: providing a conversion member and a holding member connected to the conversion member; removing a portion of the conversion member and a portion of the holding member to obtain a first surface of the conversion member and a second surface of the holding member; and heat-treating the first surface of the conversion member and the second surface of the holding member.

公开(公告)号：US09496680B2

公开(公告)日：2016-11-15

申请号：US15057770

申请日：2016-03-01

Applicant: NICHIA CORPORATION

Inventor： Hiroki Sakata ,  Hiroaki Yuto ,  Eiichiro Okahisa ,  Kazuma Kozuru

IPC: H01L21/00 ,  H01S5/024 ,  H01S5/022 ,  H01S5/323

CPC classification number: H01S5/02469 ,  H01L2224/48091 ,  H01L2924/12044 ,  H01S5/02212 ,  H01S5/02236 ,  H01S5/02256 ,  H01S5/02276 ,  H01S5/02476 ,  H01S5/32341 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor laser device can include an insulating single crystal SiC having a first surface, a second surface, and micropipes having openings in the first surface and the second surface. A conductive base can be provided on a side of the first surface of the single crystal SiC, and a semiconductor laser element can be provided on a side of the second surface of the single crystal SiC. An insulating member can be formed in the micropipes.

Abstract translation: 半导体激光器件可以包括具有第一表面，第二表面和在第一表面和第二表面中具有开口的微管的绝缘单晶SiC。 可以在单晶SiC的第一表面的一侧设置导电性基材，并且可以在单晶SiC的第二面的一侧设置半导体激光元件。 可以在微管中形成绝缘构件。

公开(公告)号：US10720752B2

公开(公告)日：2020-07-21

申请号：US16031683

申请日：2018-07-10

Applicant: NICHIA CORPORATION

Inventor： Akinori Yoneda ,  Shinya Sonobe ,  Hiroaki Yuto

IPC: H01S5/022 ,  C25D3/38 ,  C25D7/12 ,  C25D5/02 ,  C23C14/34 ,  C23C14/18

Abstract: The method includes the steps of: preparing a single crystal SiC including an upper surface 10a and a lower surface 10b and provided with a micropipe 11 penetrating from the upper surface 10a to the lower surface 10b; forming a first seed layer 21 made of a metal material on the upper surface 10a of the single crystal SiC; and forming a first plated layer 31 on the first seed layer 21 so as to close an upper end of the micropipe 11, using an electroplating method.

公开(公告)号：US09318871B2

公开(公告)日：2016-04-19

申请号：US14261520

申请日：2014-04-25

Applicant: NICHIA CORPORATION

Inventor： Hiroki Sakata ,  Hiroaki Yuto ,  Eiichiro Okahisa ,  Kazuma Kozuru

IPC: H01S3/04 ,  H01S5/024 ,  H01S5/022 ,  H01S5/323

CPC classification number: H01S5/02469 ,  H01L2224/48091 ,  H01L2924/12044 ,  H01S5/02212 ,  H01S5/02236 ,  H01S5/02256 ,  H01S5/02276 ,  H01S5/02476 ,  H01S5/32341 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor laser device can include an insulating single crystal SiC having a first surface, a second surface, and micropipes having openings in the first surface and the second surface. A conductive base can be provided on a side of the first surface of the single crystal SiC, and a semiconductor laser element can be provided on a side of the second surface of the single crystal SiC. An insulating member can be formed in the micropipes.

公开(公告)号：US11939667B2

公开(公告)日：2024-03-26

申请号：US17230763

申请日：2021-04-14

Applicant: NICHIA CORPORATION

Inventor： Naoki Eboshi ,  Hiroaki Yuto ,  Hiroki Sakata ,  Toshiaki Yamashita ,  Akinori Hara

IPC: C23C14/14 ,  C23C14/58 ,  C23C16/01 ,  F21V7/26 ,  F21V9/32 ,  H01S5/0225 ,  F21Y115/10 ,  F21Y115/30

CPC classification number: C23C14/5873 ,  C23C14/14 ,  C23C14/588 ,  C23C16/01 ,  F21V7/26 ,  F21V9/32 ,  H01S5/0225 ,  F21Y2115/10 ,  F21Y2115/30

Abstract: A method for manufacturing a wavelength conversion member, includes: providing a wavelength conversion layer having a phosphor-containing portion and a light reflecting portion surrounding the phosphor-containing portion, and the wavelength conversion layer having an upper surface, a bottom surface and at least one side surface; forming a light-blocking film on the upper surface of the wavelength conversion layer; and removing a part of the light-blocking film by laser processing to expose at least a part of the phosphor-containing portion from the light-blocking film.

公开(公告)号：US11084128B2

公开(公告)日：2021-08-10

申请号：US15648780

申请日：2017-07-13

Applicant: NICHIA CORPORATION

Inventor： Naoki Eboshi ,  Hiroaki Yuto

IPC: B23K26/364 ,  B23K26/00 ,  B23K26/08 ,  B23K26/359 ,  F21K9/64 ,  F21K9/90 ,  B23K101/36 ,  F21Y115/30 ,  B23K26/402 ,  B23K26/0622 ,  B23K103/00

Abstract: A wavelength conversion member manufacturing method includes providing a wavelength conversion member having an upper surface, and forming, in the wavelength conversion member, at least one depressed portion having an inclined surface inclined with respect to the upper surface by irradiating the wavelength conversion member with a pulsed laser beam from above. The forming of the at least one depressed portion includes performing a set of scanning more than once at different processing depths in regions overlapping each other in a top view, the set of scanning includes performing scanning with the pulsed laser beam along a first direction more than once at irradiation positions shifted in a second direction perpendicular to the first direction in the top view, and the performing of the scanning includes applying the pulsed laser beam at a fixed processing depth.

公开(公告)号：US10415794B2

公开(公告)日：2019-09-17

申请号：US15473524

申请日：2017-03-29

Applicant: NICHIA CORPORATION

Inventor： Seiji Kiyota ,  Hiroaki Yuto ,  Kei Adachi

IPC: F21V21/26 ,  F21V9/30 ,  F21V5/02 ,  F21V5/04 ,  F21V11/00 ,  F21V31/00 ,  H01S5/00 ,  F21S41/14 ,  F21S43/20 ,  F21S41/16 ,  F21Y115/30 ,  H01S5/022 ,  H01S5/323 ,  F21K9/64

Abstract: A light emitting device includes: a base member; a laser element disposed on or above a mounting surface of the base member; a fluorescent member including a first main surface and a second main surface respectively positioned on opposite sides of the fluorescent member, the second main surface being fixed to the mounting surface of the base member; a first optical member configured to change a traveling direction of laser light emitted by the laser element to be directed toward the first main surface of the fluorescent member; and a lid connected to the base member and enclosing the laser element, the fluorescent member, and the first optical member in a space beneath the lid, the lid being configured to transmit light from the fluorescent member.

公开(公告)号：US12059749B2

公开(公告)日：2024-08-13

申请号：US17364657

申请日：2021-06-30

Applicant: NICHIA CORPORATION

Inventor： Naoki Eboshi ,  Hiroaki Yuto

IPC: B23K26/364 ,  B23K26/00 ,  B23K26/0622 ,  B23K26/08 ,  B23K26/359 ,  B23K26/402 ,  F21K9/64 ,  F21K9/90 ,  B23K101/36 ,  B23K103/00 ,  F21Y115/30

CPC classification number: B23K26/364 ,  B23K26/0006 ,  B23K26/0624 ,  B23K26/083 ,  B23K26/359 ,  B23K26/402 ,  F21K9/64 ,  F21K9/90 ,  B23K2101/36 ,  B23K2103/52 ,  F21Y2115/30

Abstract: A wavelength conversion member manufacturing method includes: providing the wavelength conversion member having an upper surface, the wavelength conversion member including a phosphor portion, and a light-transmissive portion configured to transmit fluorescence from the phosphor portion; and forming, in the wavelength conversion member, at least one depressed portion each having an inclined surface inclined with respect to the upper surface by irradiating the wavelength conversion member with a pulsed laser beam from above more than once to form a plurality of continuous machining marks at different processing depths.

公开(公告)号：US11984697B2

公开(公告)日：2024-05-14

申请号：US18181150

申请日：2023-03-09

Applicant: NICHIA CORPORATION

Inventor： Tomonori Miyoshi ,  Hiroaki Yuto

IPC: H01S5/00 ,  H01S5/02257 ,  H01S5/042 ,  H01S5/068 ,  H01S5/02216 ,  H01S5/02325 ,  H01S5/024

CPC classification number: H01S5/0087 ,  H01S5/02257 ,  H01S5/042 ,  H01S5/06825 ,  H01S5/0071 ,  H01S5/02216 ,  H01S5/02325 ,  H01S5/02469

Abstract: An optical member includes: a conversion member including a fluorescent material; a light reflecting ceramic holding the conversion member, the conversion member and the light reflecting ceramic having a continuous surface; a light-transmissive film on the continuous surface; and a wiring on the light-transmissive film.