公开(公告)号：US20200212271A1

公开(公告)日：2020-07-02

申请号：US16634585

申请日：2018-07-18

Applicant: Osram OLED GmbH

Inventor： Klaus Reingruber ,  Andreas Reith ,  Tobias Gebuhr

IPC: H01L33/54 ,  H01L33/50

Abstract: A method for producing optoelectronic semiconductor components may include applying optoelectronic semiconductor chips for generating radiation to a carrier, producing a potting around the semiconductor chips with a potting top side facing away from the carrier such that the semiconductor chips remain free of a reflective potting material. The potting has trenches between the semiconductor chips, and the trenches are arranged at a distance from the semiconductor chips; the trenches do not touch the semiconductor chips. The method may further include filling the trenches with a supporting material to form at least one supporting body and leaving the potting alongside the trenches free of the supporting material.

公开(公告)号：US11670745B2

公开(公告)日：2023-06-06

申请号：US16634585

申请日：2018-07-18

Applicant: Osram OLED GmbH

Inventor： Klaus Reingruber ,  Andreas Reith ,  Tobias Gebuhr

IPC: H01L33/54 ,  H01L33/50

CPC classification number: H01L33/54 ,  H01L33/507 ,  H01L2933/005 ,  H01L2933/0041

Abstract: A method for producing optoelectronic semiconductor components may include applying optoelectronic semiconductor chips for generating radiation to a carrier, producing a potting around the semiconductor chips with a potting top side facing away from the carrier such that the semiconductor chips remain free of a reflective potting material. The potting has trenches between the semiconductor chips, and the trenches are arranged at a distance from the semiconductor chips; the trenches do not touch the semiconductor chips. The method may further include filling the trenches with a supporting material to form at least one supporting body and leaving the potting alongside the trenches free of the supporting material.

公开(公告)号：US11715820B2

公开(公告)日：2023-08-01

申请号：US16966331

申请日：2019-03-12

Applicant: OSRAM OLED GmbH

Inventor： Klaus Reingruber ,  Michael Zitzlsperger ,  Matthias Goldbach

IPC: H01L33/60 ,  H01L33/54 ,  H01L33/44 ,  H01L33/46 ,  H01L33/48 ,  H01S5/02216 ,  H01S5/0234 ,  H01S5/30 ,  H01L33/50

CPC classification number: H01L33/60 ,  H01L33/54 ,  H01S5/0234 ,  H01S5/02216 ,  H01L33/50 ,  H01L2933/005 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01S5/3013

Abstract: In at least one embodiment, the optoelectronic component comprises an optoelectronic semiconductor chip with an emission side and a rear side opposite the emission side. Furthermore, the component comprises a housing body with a top side and an underside opposite the top side, and a metal layer on the top side of the housing body. During proper operation, the semiconductor chip emits primary electromagnetic radiation via the emission side. The semiconductor chip is embedded in the housing body and laterally surrounded by the housing body. The emission side is on the rear side and the top side is downstream of the underside along a main emission direction of the semiconductor chip. The metal layer is at least partially reflecting or absorbing radiation generated by the optoelectronic component.

公开(公告)号：US10680147B2

公开(公告)日：2020-06-09

申请号：US16193308

申请日：2018-11-16

Applicant: OSRAM OLED GmbH

Inventor： Peter Nagel ,  Klaus Reingruber

IPC: H01L33/58 ,  H01L33/62 ,  H01L33/56 ,  H01L33/50 ,  H01L33/52

Abstract: A method of producing a lighting device includes a radiation-emitting optoelectronic component, including: arranging the component on a carrier, applying a first layer on the carrier, wherein the first layer surrounds the component at least laterally in the form of a circumferential frame, and subsequently applying a second layer on the first layer laterally next to the frame, wherein the second layer includes a greater hardness than the first layer.