公开(公告)号：US11881544B2

公开(公告)日：2024-01-23

申请号：US17960794

申请日：2022-10-05

Applicant: OSRAM OLED GmbH

Inventor： Markus Pindl ,  Thomas Schwarz ,  Frank Singer ,  Sandra Sobczyk

IPC: H01L33/54 ,  H01L33/00 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/50 ,  H01L33/48 ,  H01L33/56 ,  H01L21/56

CPC classification number: H01L33/54 ,  H01L31/0203 ,  H01L31/02322 ,  H01L31/186 ,  H01L33/0095 ,  H01L33/502 ,  H01L21/568 ,  H01L33/486 ,  H01L33/505 ,  H01L33/56 ,  H01L2224/18 ,  H01L2224/24 ,  H01L2224/2518 ,  H01L2224/82 ,  H01L2933/005 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, including the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.

公开(公告)号：US10964861B2

公开(公告)日：2021-03-30

申请号：US16866890

申请日：2020-05-05

Applicant: OSRAM OLED GmbH

Inventor： Markus Pindl ,  Thomas Schwarz ,  Frank Singer ,  Sandra Sobczyk

IPC: H01L33/54 ,  H01L33/00 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/50 ,  H01L33/48 ,  H01L33/56 ,  H01L21/56

Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, comprising the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.

公开(公告)号：US11508884B2

公开(公告)日：2022-11-22

申请号：US17181458

申请日：2021-02-22

Applicant: OSRAM OLED GmbH

Inventor： Markus Pindl ,  Thomas Schwarz ,  Frank Singer ,  Sandra Sobczyk

IPC: H01L33/54 ,  H01L33/00 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/50 ,  H01L33/48 ,  H01L33/56 ,  H01L21/56

Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, including the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.

公开(公告)号：US10686104B2

公开(公告)日：2020-06-16

申请号：US16240584

申请日：2019-01-04

Applicant: OSRAM OLED GMBH

Inventor： Markus Pindl ,  Thomas Schwarz ,  Frank Singer ,  Sandra Sobczyk

IPC: H01L33/54 ,  H01L33/00 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/50 ,  H01L33/48 ,  H01L33/56 ,  H01L21/56

Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, comprising the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.