公开(公告)号：US20180166611A1

公开(公告)日：2018-06-14

申请号：US15577837

申请日：2016-05-27

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Tilman Ruegheimer ,  Juergen Dachs

IPC: H01L33/48 ,  H01S5/022 ,  H01S5/02

CPC classification number: H01L33/486 ,  H01L21/4817 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01S5/0206 ,  H01S5/0216 ,  H01S5/02216 ,  H01S5/02272 ,  H01L2924/00014

Abstract: A method of producing a housing cover includes providing a cover blank having a mounting surface formed on an underside; connecting the underside of the cover blank to a silicon slice; creating at least one opening in the silicon slice to expose at least part of the mounting surface; arranging a base metallization on the exposed part of the mounting surface; and removing the silicon slice.

公开(公告)号：US09608401B2

公开(公告)日：2017-03-28

申请号：US14653698

申请日：2013-12-17

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Roland Enzmann ,  Markus Horn ,  Markus Graul ,  Thomas Veit ,  Juergen Dachs ,  Stefan Listl ,  Markus Arzberger

IPC: H01S5/02 ,  H01S5/323 ,  H01S5/022

CPC classification number: H01S5/0201 ,  H01S5/0202 ,  H01S5/0206 ,  H01S5/02236 ,  H01S5/0226 ,  H01S5/02268 ,  H01S5/02272 ,  H01S5/323 ,  H01S5/32333

Abstract: Method for producing semiconductor laser elements (1) comprises A) providing a carrier composite (20) having a plurality of carriers (2) for the semiconductor laser elements (1), B) providing a laser bar (30) having a plurality of semiconductor laser diodes (3) which comprise a common growth substrate (31) and a semiconductor layer sequence (32) grown thereon, C) generating predetermined breaking points (35) on a substrate underside (34) of the growth substrate (31), said substrate underside facing away from the semiconductor layer sequence (32), D) attaching the laser bar (30) to a carrier upper side (23) of the carrier composite (20), wherein the attachment is performed at an elevated temperature and is followed by cooling, and E) singulating into the semiconductor laser elements (1), wherein steps B) to E) are performed in the indicated sequence.

公开(公告)号：US10177285B2

公开(公告)日：2019-01-08

申请号：US15577837

申请日：2016-05-27

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Tilman Ruegheimer ,  Juergen Dachs

IPC: H01L33/48 ,  H01S3/02 ,  H01L21/48 ,  H01S5/02 ,  H01S5/022

Abstract: A method of producing a housing cover includes providing a cover blank having a mounting surface formed on an underside; connecting the underside of the cover blank to a silicon slice; creating at least one opening in the silicon slice to expose at least part of the mounting surface; arranging a base metallization on the exposed part of the mounting surface; and removing the silicon slice.