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    Method of producing an optoelectronic component
    1.
    发明授权
    Method of producing an optoelectronic component 有权

    公开(公告)号：US10454240B2

    公开(公告)日：2019-10-22

    申请号：US15761585

    申请日：2016-09-15

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Christoph Walter ,  Roland Enzmann ,  Markus Horn ,  Jan Seidenfaden

    IPC: H01S5/022 ,  H01L33/00 ,  H01L33/62 ,  H01L33/64 ,  H01S5/024

    Abstract: A method of producing an optoelectronic component includes providing a carrier including a top side; creating at the top side of the carrier a region that is recessed with respect to a mounting region of the top side to form a step between the mounting region and the recessed region; arranging at the top side of the carrier a metallization extending over the mounting region and the recessed region; creating a separating track in the metallization, wherein the metallization is completely severed at least in sections in the mounting region and is at least not completely severed in the recessed region; and arranging an optoelectronic semiconductor chip above the mounting region of the top side, wherein the optoelectronic semiconductor chip is aligned at the separating track.

    LASER DIODE WITH COOLING ALONG EVEN THE SIDE SURFACES
    5.
    发明申请
    LASER DIODE WITH COOLING ALONG EVEN THE SIDE SURFACES 有权
    激光二极管，即使在侧面表面也有冷却

    公开(公告)号：US20160204575A1

    公开(公告)日：2016-07-14

    申请号：US14910813

    申请日：2014-08-14

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： Markus Horn ,  Bernhard Stojetz

    IPC: H01S5/024 ,  H01S5/022

    CPC classification number: H01S5/02469 ,  H01S5/0222 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/024 ,  H01S5/02476 ,  H01S5/4018 ,  H01S5/4031

    Abstract: A laser component includes a laser chip having a top side, an underside, a first side surface and a second side surface, which are oriented parallel to a resonator of the laser chip, wherein an underside of the laser chip is arranged in a manner bearing on a carrier, a top side of the laser chip is arranged in a manner bearing on a further carrier, the laser chip is hermetically tightly encapsulated between the carrier and the further carrier, a second electrical contact pad of the laser chip, said second electrical contact pad being formed on the top side of the laser chip, electrically conductively connects to a second electrical mating contact pad formed on the further carrier, and the first side surface of the laser chip thermally conductively connects to a heat sink.

    Abstract translation: 激光组件包括具有平行于激光芯片的谐振器的顶侧，下侧，第一侧表面和第二侧表面的激光芯片，其中激光芯片的下侧以轴承方式布置 在载体上，激光芯片的顶侧以与另一个载体相关的方式布置，激光芯片气密地封装在载体和另外的载体之间，激光芯片的第二电接触焊盘，所述第二电极 接触垫形成在激光芯片的顶侧上，导电地连接到形成在另一个载体上的第二电配合接触焊盘，并且激光芯片的第一侧表面热传导地连接到散热器。

    LASER COMPONENT AND METHOD OF PRODUCING A LASER COMPONENT
    6.
    发明申请
    LASER COMPONENT AND METHOD OF PRODUCING A LASER COMPONENT 审中-公开
    激光组件和激光组件的制造方法

    公开(公告)号：US20160204573A1

    公开(公告)日：2016-07-14

    申请号：US14912210

    申请日：2014-08-14

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： Jens Mueller ,  Markus Horn

    IPC: H01S5/022 ,  H01S5/028 ,  H01S5/40 ,  H01S5/024 ,  H01S5/22

    Abstract: A laser component includes an edge-emitting first laser chip with an upper side, a lower side, an end side and a side surface, wherein an emission region is arranged on the end side, the side surface is oriented perpendicularly to the upper side and to the end side, a first metallization is arranged on the upper side, a step by which a part adjacent to the upper side of the side surface is set back, is formed on the side surface, a passivation layer is arranged in the set-back part of the side surface, the laser chip is arranged on a carrier, the side surface faces toward a surface of the carrier, and a first solder contact arranged on the surface of the carrier electrically conductively connects to the first metallization.

    Abstract translation: 激光组件包括具有上侧，下侧，端侧和侧表面的边缘发射第一激光器芯片，其中发射区域设置在端侧，侧表面垂直于上侧定向， 在侧面上形成第一金属化层，在侧面上形成有与侧面上侧相邻的部分被退回的台阶，钝化层配置在上侧， 侧面的背面部分，激光芯片布置在载体上，侧表面朝向载体的表面，并且布置在载体表面上的第一焊料接触电导体连接到第一金属化。

    OPTOELECTRONIC COMPONENT HAVING A HOUSING WITH A PLURALITY OF OPENINGS
    9.
    发明申请
    OPTOELECTRONIC COMPONENT HAVING A HOUSING WITH A PLURALITY OF OPENINGS 审中-公开
    具有大量开口的房屋的光电元件

    公开(公告)号：US20160126704A1

    公开(公告)日：2016-05-05

    申请号：US14892242

    申请日：2014-05-27

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： Markus Horn ,  Karsten Auen

    IPC: H01S5/40 ,  H01S5/022 ,  F21S4/28 ,  F21K99/00

    Abstract: An optoelectronic component includes a carrier with at least two radiation sources that generate electromagnetic radiation, including a housing consisting of a material non-transmissive to the electromagnetic radiation from the radiation sources, wherein at least two openings are provided in the housing, each opening is closed with a plate, the plate consists of a material transmissive to the electromagnetic radiation from the respective radiation source, and a radiation source is respectively assigned to an opening.

    Abstract translation: 光电子部件包括具有产生电磁辐射的至少两个辐射源的载体，包括由与辐射源的电磁辐射不透射的材料组成的壳体，其中至少两个开口设置在壳体中，每个开口是 用板封闭，该板由对各个辐射源的电磁辐射透射的材料组成，辐射源分别分配给一个开口。

    Laser component and method of producing a laser component
    10.
    发明授权
    Laser component and method of producing a laser component 有权

    公开(公告)号：US10686295B2

    公开(公告)日：2020-06-16

    申请号：US14912210

    申请日：2014-08-14

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Jens Mueller ,  Markus Horn

    IPC: H01S5/22 ,  H01S5/028 ,  H01S5/022 ,  H01S5/042 ,  H01S5/40 ,  H01S5/024

    Abstract: A laser component includes an edge-emitting first laser chip with an upper side, a lower side, an end side and a side surface, wherein an emission region is arranged on the end side, the side surface is oriented perpendicularly to the upper side and to the end side, a first metallization is arranged on the upper side, a step by which a part adjacent to the upper side of the side surface is set back, is formed on the side surface, a passivation layer is arranged in the set-back part of the side surface, the laser chip is arranged on a carrier, the side surface faces toward a surface of the carrier, and a first solder contact arranged on the surface of the carrier electrically conductively connects to the first metallization.

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