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公开(公告)号：US10996482B2
公开(公告)日：2021-05-04
申请号：US15693531
申请日：2017-09-01
发明人： Roland Enzmann , Hubert Halbritter , Markus Arzberger , Andreas Ploessl , Roland Schulz , Georg Rossbach , Bernd Boehm , Frank Singer , Matthias Sabathil
摘要： An optically effective element includes a carrier, a first optically effective structure arranged on a top side of the carrier, and a cover arranged above the first optically effective structure. A method of producing an optically effective element includes providing a carrier, forming a first optically effective structure on a top side of the carrier, and arranging a cover above the top side of the carrier and the first optically effective structure.
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2.发明授权公开(公告)号：US11061174B2
公开(公告)日：2021-07-13
申请号：US16086133
申请日：2017-03-16
摘要： A diffractive optical element includes a carrier and a plurality of nano- or micro-scale rods arranged above a top side of the carrier, wherein the rods are arranged parallel to one another in a regular grid arrangement. A method of producing a diffractive optical element includes providing a carrier and epitaxially growing a plurality of mutually parallel nano- or micro-scale rods in a regular gird arrangement above a top side of the carrier.
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公开(公告)号：US10454240B2
公开(公告)日：2019-10-22
申请号：US15761585
申请日：2016-09-15
发明人： Christoph Walter , Roland Enzmann , Markus Horn , Jan Seidenfaden
摘要： A method of producing an optoelectronic component includes providing a carrier including a top side; creating at the top side of the carrier a region that is recessed with respect to a mounting region of the top side to form a step between the mounting region and the recessed region; arranging at the top side of the carrier a metallization extending over the mounting region and the recessed region; creating a separating track in the metallization, wherein the metallization is completely severed at least in sections in the mounting region and is at least not completely severed in the recessed region; and arranging an optoelectronic semiconductor chip above the mounting region of the top side, wherein the optoelectronic semiconductor chip is aligned at the separating track.
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公开(公告)号：US10431954B2
公开(公告)日：2019-10-01
申请号：US15654136
申请日：2017-07-19
发明人： Jan Seidenfaden , Jan Marfeld , Hubert Schmid , Soenke Tautz , Roland Enzmann
摘要： A laser component includes a housing, a laser chip arranged in the housing, and a conversion element for radiation conversion arranged in the housing wherein the conversion element is irradiatable with laser radiation of the laser chip. A method of producing such a laser component includes providing component parts of the laser component including a laser chip, a conversion element for radiation conversion and housing parts, and assembling the component parts of the laser component such that a housing is provided within which the laser chip and the conversion element are arranged, wherein the conversion element is irradiatable with laser radiation of the laser chip.
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公开(公告)号：US11355897B2
公开(公告)日：2022-06-07
申请号：US16092422
申请日：2017-04-12
IPC分类号： H01S5/02255 , H01S5/0231 , H01S5/02234
摘要： In an embodiment a light-emitting component includes a housing and an edge emitting semiconductor laser arranged in the housing, wherein the semiconductor laser is configured to emit light at a side face in an angle range, wherein the housing includes an emission opening for emitting the light, wherein the semiconductor laser is arranged in a first layer having a first material, wherein a second layer is arranged on the first layer, the second layer having a second material, wherein the first layer and the second layer are transmissive to the light, wherein the second layer is arranged between the first layer and the emission opening, wherein the emission opening lies at least partly outside the angle range of the semiconductor laser, and wherein a part of the light is directed directly onto an interface between the first and second layers.
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公开(公告)号：US10991853B2
公开(公告)日：2021-04-27
申请号：US16061358
申请日：2016-12-14
发明人： Christoph Walter , Roland Enzmann , Markus Horn , Jan Seidenfaden
摘要： A carrier for an optoelectronic component includes a main body, wherein the main body includes a first electrically conductive heating layer arrangement, a first solder layer for soldering an optoelectronic component to the main body is arranged on a first side of the main body, the first electrically conductive heating layer arrangement is electrically insulated from the first solder layer and thermally connected to the first solder layer, and the first heating layer arrangement has an exposed portion on which molten solder of the first solder layer can flow to reduce an electrical resistance of the first heating layer arrangement.
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公开(公告)号：US20190131766A1
公开(公告)日：2019-05-02
申请号：US16095426
申请日：2017-04-26
发明人： Roland Enzmann , Markus Keidler , Josip Maric , Peter Jander
摘要： A laser module includes a housing with a cavity and a window opening, a side-emitting semiconductor laser diode, arranged in the cavity that emits light radiation in the form of a laser beam, an optical deflection structure that deflects the laser beam, emitted by the semiconductor laser diode, in a direction of the window opening, and an optical output coupling structure arranged in the region of the window opening to output couple the laser beam in a defined direction and/or with a defined emission profile, wherein the optical deflection structure and the optical output coupling structure are configured in one piece in the form of a shared optical component.
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公开(公告)号：US20180351324A1
公开(公告)日：2018-12-06
申请号：US15761585
申请日：2016-09-15
发明人： Christoph Walter , Roland Enzmann , Markus Horn , Jan Seidenfaden
CPC分类号： H01S5/02272 , H01L33/0079 , H01L33/0095 , H01L33/62 , H01L33/641 , H01L33/642 , H01L2933/0066 , H01L2933/0075 , H01S5/02268 , H01S5/02461
摘要： A method of producing an optoelectronic component includes providing a carrier including a top side; creating at the top side of the carrier a region that is recessed with respect to a mounting region of the top side to form a step between the mounting region and the recessed region; arranging at the top side of the carrier a metallization extending over the mounting region and the recessed region; creating a separating track in the metallization, wherein the metallization is completely severed at least in sections in the mounting region and is at least not completely severed in the recessed region; and arranging an optoelectronic semiconductor chip above the mounting region of the top side, wherein the optoelectronic semiconductor chip is aligned at the separating track.
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公开(公告)号：US10033158B1
公开(公告)日：2018-07-24
申请号：US15845983
申请日：2017-12-18
摘要： A semiconductor laser, a laser assembly and a method of making a semiconductor laser are disclosed. In an embodiment the surface-emitting semiconductor laser includes a carrier having a carrier main side mechanically carrying a semiconductor laser; a first Bragg mirror and a second Bragg mirror so that the second Bragg mirror is further away from the carrier than the first Bragg mirror; a semiconductor layer sequence between the first and the second Bragg mirrors having at least one active zone for generating laser radiation; a metal mirror arranged directly on a side of the first Bragg mirror facing the carrier for reflecting laser radiation generated during operation of the semiconductor laser; a bonding agent layer located between the carrier and the semiconductor layer sequence; a resonator oriented perpendicular to the carrier main side; and an electrically insulating passivation layer located in the metal mirror.
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公开(公告)号：US20180090908A1
公开(公告)日：2018-03-29
申请号：US15565188
申请日：2016-04-29
发明人： Roland Enzmann , Markus Arzberger
CPC分类号： H01S5/02256 , H01L2224/48091 , H01S5/0206 , H01S5/02236 , H01S5/0224 , H01S5/02268 , H01S5/02272 , H01S5/02469 , H01S5/06825 , H01L2924/00014
摘要： An arrangement having a substrate and a semiconductor laser and a method for manufacturing such an arrangement are disclosed. In an embodiment, the arrangement includes a substrate and a semiconductor laser, wherein the substrate has a top, side areas and a bottom, wherein at least one first recess is provided at the top, wherein the semiconductor laser is arranged on the top of the substrate such that a region of the side area of the semiconductor laser via which the electromagnetic radiation is emitted is arranged above the first recess.
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