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公开(公告)号：US20170104459A1
公开(公告)日：2017-04-13
申请号：US14880631
申请日：2015-10-12
Applicant: QUALCOMM Incorporated
Inventor： Victor Korol , Mina Iskander
CPC classification number: H03F1/565 , H01F17/0013 , H01F27/288 , H01F27/32 , H01F27/36 , H01F2017/008 , H03F3/193 , H03F3/211 , H03F2200/451 , H03F2203/21106 , H03H7/38
Abstract: Exemplary embodiments of the present disclosure are related to inductor shielding. A device may include an inductor and a plurality of conductive strips extending across the inductor. At least a first conductive strip of the plurality of conductive strips is physically isolated from at least a second conductive strip of the plurality of conductive strips in a region of overlay of the first and second conductive strips.
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Patent Agency Ranking
公开(公告)号：US20210410274A1
公开(公告)日：2021-12-30
申请号：US17100121
申请日：2020-11-20
Applicant: QUALCOMM Incorporated
Inventor： Jeahyeong Han , Suhyung Hwang , Mina Iskander , Rajneesh Kumar , Darryl Sheldon Jessie
Abstract: Systems for shielding bent signal lines provide ways to couple different antenna arrays for radio frequency (RF) integrated circuits (ICs) (RFICs) associated therewith where the antenna arrays are oriented in different directions. Because the antenna arrays are oriented in different directions, the antenna structures containing the antennas may be arranged in different planes, and signal lines extending therebetween may include a bend. To prevent electromagnetic interference (EMI) or electromagnetic crosstalk (EMC) from negatively impacting signals on the signal lines, the signal lines may be shielded. The shields may further include vias connecting the mesh ground planes and positioned exteriorly of the signal lines. The density of the vias may be varied to provide a desired rigidity in planes containing the antenna arrays while providing a desired flexibility at a desired bending location in the signal lines to help bending process accuracy.
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公开(公告)号：US11696390B2
公开(公告)日：2023-07-04
申请号：US17100121
申请日：2020-11-20
Applicant: QUALCOMM Incorporated
Inventor： Jeahyeong Han , Suhyung Hwang , Mina Iskander , Rajneesh Kumar , Darryl Sheldon Jessie
CPC classification number: H05K1/0219 , H01Q1/2283 , H01Q1/48 , H01Q1/526 , H01Q21/061 , H05K1/0225 , H05K1/0227 , H05K1/0278 , H01Q21/29 , H01Q23/00 , H05K1/181 , H05K2201/09609 , H05K2201/09681 , H05K2201/10098
Abstract: Systems for shielding bent signal lines provide ways to couple different antenna arrays for radio frequency (RF) integrated circuits (ICs) (RFICs) associated therewith where the antenna arrays are oriented in different directions. Because the antenna arrays are oriented in different directions, the antenna structures containing the antennas may be arranged in different planes, and signal lines extending therebetween may include a bend. To prevent electromagnetic interference (EMI) or electromagnetic crosstalk (EMC) from negatively impacting signals on the signal lines, the signal lines may be shielded. The shields may further include vias connecting the mesh ground planes and positioned exteriorly of the signal lines. The density of the vias may be varied to provide a desired rigidity in planes containing the antenna arrays while providing a desired flexibility at a desired bending location in the signal lines to help bending process accuracy.
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公开(公告)号：US11322855B2
公开(公告)日：2022-05-03
申请号：US16748707
申请日：2020-01-21
Applicant: QUALCOMM Incorporated
Inventor： Darryl Sheldon Jessie , Mina Iskander , Avantika Sodhi
Abstract: A transmission line network is provided that includes a slow-wave transmission line to couple a first terminal to a first antenna. The transmission line network also includes a conventional transmission line to couple a second terminal to a second antenna.
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5.发明申请公开(公告)号：US20180323765A1
公开(公告)日：2018-11-08
申请号：US15585810
申请日：2017-05-03
Applicant: QUALCOMM Incorporated
Inventor： Miena Armanious , Lan Nan , Mina Iskander
CPC classification number: H03H7/0115 , H01F2017/0026 , H01P1/2007 , H01P1/20381 , H01P7/08 , H03H1/00 , H03H3/00 , H03H7/1741 , H03H2001/0021 , H03H2001/0085
Abstract: Aspects of the disclosure are directed to an inductor-capacitor (LC) resonator. In accordance with one aspect, the LC resonator architecture includes a lower metal plate, the lower metal plate is of an open configuration; an upper metal plate, the upper metal plate is stacked vertically above the lower metal plate and is vertically aligned to the lower metal plate; a first ultra thick metal (UTM) plate, the first UTM plate is stacked vertically above the upper metal plate and is vertically aligned to both the upper metal plate and the lower metal plate; and an electrical coupling to couple the first UTM plate to the upper metal plate, wherein a current on the first UTM plate flows through to the upper metal plate through the electrical coupling, the current flows in a direction on the first UTM plate and in the same direction on the upper metal plate.
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公开(公告)号：US10075138B2
公开(公告)日：2018-09-11
申请号：US14880631
申请日：2015-10-12
Applicant: QUALCOMM Incorporated
Inventor： Victor Korol , Mina Iskander
CPC classification number: H03F1/565 , H01F17/0013 , H01F27/288 , H01F27/32 , H01F27/36 , H01F2017/008 , H03F3/193 , H03F3/211 , H03F2200/451 , H03F2203/21106 , H03H7/38
Abstract: Exemplary embodiments of the present disclosure are related to inductor shielding. A device may include an inductor and a plurality of conductive strips extending across the inductor. At least a first conductive strip of the plurality of conductive strips is physically isolated from at least a second conductive strip of the plurality of conductive strips in a region of overlay of the first and second conductive strips.
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