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    MULTILAYER CERAMIC ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF AND BOARD FOR MOUNTING THE SAME
    1.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF AND BOARD FOR MOUNTING THE SAME 有权
    多层陶瓷电子元件及其制造方法及其安装板

    公开(公告)号：US20150041194A1

    公开(公告)日：2015-02-12

    申请号：US14060355

    申请日：2013-10-22

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jae Hyuk SHIM ,  Dae Bok OH ,  Jae Yeol CHOI ,  Myung Jun PARK ,  Young Sook LEE

    IPC: H01G4/30 ,  H01G2/06

    CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/232 ,  Y10T29/43

    Abstract: There is provided a multilayer ceramic electronic component including a ceramic body including a plurality of dielectric layers stacked in a thickness direction and satisfying T/W>1.0 when it is defined that a width thereof is W and a thickness thereof is T, a plurality of first and second internal electrodes disposed in the ceramic body so as to face each other, having the dielectric layer interposed therebetween, and alternately exposed through both end surfaces of the ceramic body, and first and second external electrodes including head parts formed on both end surfaces of the ceramic body and two band parts connected to the head parts and formed on portions of upper and lower main surfaces of the ceramic body so as to be spaced apart from each other in a width direction, and electrically connected to the first and second internal electrodes, respectively.

    Abstract translation: 提供了一种多层陶瓷电子部件，其包括陶瓷体，该陶瓷体的宽度为W，厚度为T时，其厚度方向上层叠有多个电介质层，并满足T / W> 1.0，多个 第一和第二内部电极设置在陶瓷体中，以彼此面对，具有介于其间的电介质层，并且通过陶瓷体的两个端面交替暴露;以及第一和第二外部电极，包括形成在两个端面上的头部 并且形成在所述陶瓷体的上下主表面的一部分上，以在宽度方向上彼此间隔开，并且电连接到所述陶瓷体的所述第一和第二内部 电极。

    MULTILAYER CERAMIC COMPONENT
    2.
    发明申请
    MULTILAYER CERAMIC COMPONENT 审中-公开
    多层陶瓷组件

    公开(公告)号：US20160268044A1

    公开(公告)日：2016-09-15

    申请号：US14862106

    申请日：2015-09-22

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hyun Hee GU ,  Myung Jun PARK ,  Byoung Jin CHUN ,  Young Sook LEE ,  Hye Jin JEONG ,  Hye Young CHOI ,  Chung Yeol LEE

    IPC: H01G4/12 ,  H01G4/012 ,  H01G4/236 ,  H01G4/30

    CPC classification number: H01G4/12 ,  H01G4/012 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30

    Abstract: A multilayer ceramic component is provided. The multilayer ceramic component includes a ceramic body including a plurality of ceramic laminates, each including a plurality of dielectric layers and a plurality of internal electrodes and having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, and a plurality of external electrodes including base electrode layers disposed on outer surfaces of the ceramic body and respectively connected to the internal electrodes of the ceramic laminates, and resin electrode layers disposed on the base electrode layers to expose at least portions of end portions of the base electrode layers, respectively.

    Abstract translation: 提供了多层陶瓷部件。 所述多层陶瓷部件包括陶瓷体，所述陶瓷体包括多个陶瓷层叠体，每个陶瓷层叠体包括多个电介质层和多个内部电极，并且具有在第一方向上彼此相对的第一和第二表面， 第二方向，以及在第三方向上彼此相对的第五和第六表面，以及多个外部电极，包括设置在陶瓷体的外表面上并分别连接到陶瓷层压体的内部电极的基极电极层，以及树脂电极 分别设置在基极电极层上以暴露基极电极层的端部的至少一部分的层。

    CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
    3.
    发明申请
    CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME 审中-公开
    芯片电子元件和板子

    公开(公告)号：US20160042857A1

    公开(公告)日：2016-02-11

    申请号：US14657845

    申请日：2015-03-13

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Byoung Jin CHUN ,  Woo Kyung SUNG ,  Hyun Hee GU ,  Young Sook LEE ,  Hye Jin JEONG ,  Jae Hwan HAN

    IPC: H01F27/28 ,  H01F1/20 ,  H01F27/255

    CPC classification number: H01F17/0013 ,  H01F17/04 ,  H01F27/292 ,  H01F2017/048

    Abstract: There are provided a chip electronic component including: a magnetic body including an insulating substrate and a conductive coil pattern which is disposed on at least one surface of the insulating substrate; and external electrodes disposed on both end portions of the magnetic body to be connected to end portions of the conductive coil pattern, wherein each of the external electrodes includes a first plating layer disposed on an end surface of the magnetic body to be connected to the conductive coil pattern and a conductive resin layer covering the first plating layer and extended to main surfaces of the magnetic body.

    Abstract translation: 提供了一种芯片电子部件，包括：包括绝缘基板的磁体和布置在绝缘基板的至少一个表面上的导电线圈图案; 以及外部电极，其设置在所述磁性体的两端部，以与所述导电线圈图案的端部连接，其中，所述外部电极中的每一个包括设置在所述磁性体的端面上的第一镀层，以与所述导体 线圈图案和覆盖第一镀层并延伸到磁性体主表面的导电树脂层。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT, METHOD OF MANUFACTURING THE SAME, AND CIRCUIT BOARD HAVING THE SAME
    4.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT, METHOD OF MANUFACTURING THE SAME, AND CIRCUIT BOARD HAVING THE SAME 有权
    多层陶瓷电子元件及其制造方法以及具有相同功能的电路板

    公开(公告)号：US20160211074A1

    公开(公告)日：2016-07-21

    申请号：US14794569

    申请日：2015-07-08

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hyun Hee GU ,  Myung Jun PARK ,  Hye Jin JEONG ,  Byoung Jin CHUN ,  Young Sook LEE ,  Hye Young CHOI ,  Chung Yeol LEE

    IPC: H01G2/06 ,  H01G4/12 ,  H05K1/11 ,  H01G4/248 ,  H05K1/18 ,  H01G4/012 ,  H01G4/30

    CPC classification number: H05K1/0306 ,  H01G2/065 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H05K1/181 ,  H05K3/0067 ,  H05K2201/10015

    Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and internal electrodes and having first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, base electrode layers disposed on the ceramic body and including main portions connected to the internal electrodes and extension portions extending from the main portions, and resin electrode layers disposed on the base electrode layers while leaving end portions of the extension portions exposed. A width of the extension portion is narrower than a width of the outer surface of the ceramic body on which the extension portion is disposed, measured in a direction parallel to a width direction of the extension portion.

    Abstract translation: 多层陶瓷电子部件包括陶瓷体，该陶瓷体包括电介质层和内部电极，并且具有沿第一方向彼此相对的第一和第二表面，在第二方向上彼此相对的第三和第四表面，以及在第二方向上彼此相对的第五和第六表面 第三方向，设置在陶瓷体上的基极电极层，包括连接到内部电极的主要部分和从主要部分延伸的延伸部分，以及设置在基底电极层上的树脂电极层，同时使延伸部分的端部露出。 延伸部分的宽度比沿着延伸部分的宽度方向平行的方向测量的陶瓷体的设置有延伸部分的外表面的宽度窄。

    MULTI-LAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    7.
    发明申请
    MULTI-LAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
    多层陶瓷电子元件及其制造方法

    公开(公告)号：US20130250480A1

    公开(公告)日：2013-09-26

    申请号：US13671419

    申请日：2012-11-07

    Applicant: SAMSUNG ELECTRO-MECHANICS

    Inventor： Chul Soon AHN ,  Jae Yeol CHOI ,  Jae Hyuk SHIM ,  Young Sook LEE ,  Hye Young CHOI ,  Eun Young NA

    IPC: H01G4/12

    CPC classification number: H01G4/129 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30

    Abstract: There is provided a multi-layer ceramic electronic component including: a ceramic sintered body in which a plurality of dielectric layers are laminated; first and second internal electrodes formed in the ceramic sintered body; first and second external electrodes formed on both ends of the ceramic sintered body while covering a circumference thereof, and electrically connected to the first and second internal electrodes; and a sealing part including a glass component and formed in a gap between an outer surface of the ceramic sintered body and ends of the first and second external electrodes.

    Abstract translation: 提供了一种多层陶瓷电子部件，其包括：层叠有多个电介质层的陶瓷烧结体; 形成在陶瓷烧结体中的第一和第二内部电极; 第一和第二外部电极，其形成在陶瓷烧结体的两端，同时覆盖其周围，并且电连接到第一和第二内部电极; 以及包括玻璃成分并形成在陶瓷烧结体的外表面与第一外部电极和第二外部电极的端部之间的间隙中的密封部。

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