公开(公告)号：US20230187830A1

公开(公告)日：2023-06-15

申请号：US17747659

申请日：2022-05-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yang Je Lee ,  Je Sang Park ,  Chang Gun Oh ,  Sang Ho Jeong ,  Hyun Kyung Park

IPC: H01Q9/04 ,  H05K1/11 ,  H05K1/02 ,  H01Q1/22

CPC classification number: H01Q9/0407 ,  H05K1/115 ,  H05K1/0243 ,  H01Q1/22

Abstract: An antenna substrate includes a body in which a plurality of insulating layers are stacked, a first antenna layer including a plurality of first pattern layers disposed on the plurality of insulating layers and a plurality of first conductive via layer penetrating through the plurality of insulating layers to connect the plurality of first pattern layers in a stacking direction of the plurality of insulating layers and having a bar shape, and a second antenna layer extending from at least one of an uppermost portion or a lowermost portion of the first antenna layer on the insulating layer of the body.

公开(公告)号：US12119565B2

公开(公告)日：2024-10-15

申请号：US17747659

申请日：2022-05-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yang Je Lee ,  Je Sang Park ,  Chang Gun Oh ,  Sang Ho Jeong ,  Hyun Kyung Park

IPC: H01Q9/04 ,  H01Q1/22 ,  H05K1/02 ,  H05K1/11

CPC classification number: H01Q9/0407 ,  H01Q1/22 ,  H05K1/0243 ,  H05K1/115

Abstract: An antenna substrate includes a body in which a plurality of insulating layers are stacked, a first antenna layer including a plurality of first pattern layers disposed on the plurality of insulating layers and a plurality of first conductive via layer penetrating through the plurality of insulating layers to connect the plurality of first pattern layers in a stacking direction of the plurality of insulating layers and having a bar shape, and a second antenna layer extending from at least one of an uppermost portion or a lowermost portion of the first antenna layer on the insulating layer of the body.

公开(公告)号：US20150351219A1

公开(公告)日：2015-12-03

申请号：US14811825

申请日：2015-07-28

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Chang Gun Oh ,  Tae Kyun Bae ,  Ho Sik Park

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/18 ,  H05K1/11

CPC classification number: H05K1/0206 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0298 ,  H05K1/113 ,  H05K1/115 ,  H05K3/0094 ,  H05K3/181 ,  H05K3/205 ,  H05K3/4608 ,  H05K3/4644 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09727 ,  H05K2201/10674 ,  H05K2203/1476 ,  Y10T29/49156 ,  H01L2924/00014

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: a base substrate having a via hole for signal transfer and a via hole for heat radiation formed therein and having circuit layers formed on both surfaces thereof, the circuit layers including connection pads; a signal via formed in an inner portion of the via hole for signal transfer by performing a plating process using a conductive metal; and a heat radiation via formed in an inner portion of the via hole for heat radiation by performing a plating process using a conductive metal, wherein the heat radiation via is formed to have a diameter larger than that of the signal via.

Abstract translation: 这里公开了一种印刷电路板及其制造方法。 印刷电路板包括：具有用于信号传送的通孔的基底基板和形成在其中的热辐射通孔，并且在其两个表面上形成电路层，电路层包括连接焊盘; 通过使用导电金属进行电镀处理而形成在用于信号传送的通孔的内部的信号通孔; 以及通过使用导电金属进行电镀处理而形成在用于散热的通孔的内部的散热通路，其中，所述散热通孔的直径大于所述信号通路的直径。

公开(公告)号：US20130062112A1

公开(公告)日：2013-03-14

申请号：US13672088

申请日：2012-11-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Suk Won LEE ,  Keung Jin Sohn ,  Chang Gun Oh

IPC: H01K3/10 ,  H05K1/11

CPC classification number: H05K3/007 ,  H05K3/0097 ,  H05K3/428 ,  H05K2203/0228 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/12569 ,  Y10T428/12583 ,  Y10T428/2839

Abstract: A method for fabricating a carrier substrate, a method for fabricating a printed circuit board using the carrier substrate and related printed circuit board. The method for fabricating the carrier substrate includes: providing an insulating base material with a copper foil layer formed on at least one surface thereof; stacking a metal layer having a length shorter than that of the copper foil layer on the copper foil layer; and forming an insulating layer on the metal layer.

Abstract translation: 一种制造载体基板的方法，使用该载体基板和相关印刷电路板制造印刷电路板的方法。 制造载体基板的方法包括：在绝缘基材的至少一个表面上形成铜箔层; 在铜箔层上堆叠长度短于铜箔层的金属层; 以及在所述金属层上形成绝缘层。

公开(公告)号：US11658417B2

公开(公告)日：2023-05-23

申请号：US17208139

申请日：2021-03-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yang Je Lee ,  Chang Gun Oh ,  Hyun Kyung Park ,  Je Sang Park ,  Sang Ho Jeong ,  Yong Duk Lee

IPC: H01Q9/04 ,  H01Q1/22 ,  H05K1/11

CPC classification number: H01Q9/0407 ,  H01Q1/22 ,  H05K1/113 ,  H05K2201/10098

Abstract: An antenna substrate includes: a body having a first surface and a second surface opposing each other and a side surface connecting the first surface and the second surface to each other; an antenna portion disposed on the first surface of the body; and a pad portion disposed in the body, exposed to the side surface of the body, and including a plurality of pad layers connected to each other in a first direction from the second surface of the body toward the first surface of the body. At least one of the plurality of pad layers has a greater width in a second direction than in a third direction perpendicular to the second direction when viewed in the first direction.

公开(公告)号：US11228107B2

公开(公告)日：2022-01-18

申请号：US16938023

申请日：2020-07-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yang Je Lee ,  Chang Gun Oh ,  Hyun Kyung Park ,  Jung Hoon Jang

IPC: H01Q9/04 ,  H01Q21/06 ,  H01Q1/22

Abstract: An antenna substrate includes a body including an insulating material, a plurality of wiring layers stacked with each other in a first vertical direction in the body, and a plurality of first antenna layers stacked with each other in a third horizontal direction in the body. Each of the plurality of first antenna layers includes a plurality of conductive structures, each having a length in a second horizontal direction greater than a length in the third horizontal direction perpendicular to the second horizontal direction, that are stacked in the first vertical direction.

公开(公告)号：US20140174793A1

公开(公告)日：2014-06-26

申请号：US14038509

申请日：2013-09-26

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chang Gun Oh ,  Ho Sik Park ,  Hwa Sub Oh

IPC: H05K1/02 ,  H05K3/40

CPC classification number: H05K1/0206 ,  H05K1/0207 ,  H05K1/0243 ,  H05K2201/096 ,  H05K2201/09854 ,  Y10T29/49165

Abstract: Disclosed herein are a printed circuit board and a method for manfuacturing the same, the printed circuit board including: a base substrate having circuit patterns; and heat radiating vias having a donut shape, formed in the base substrate, so that the heat radiation efficiency may be improved by increasing the area of the heat radiating via.

Abstract translation: 这里公开了一种印刷电路板及其制造方法，所述印刷电路板包括：具有电路图形的基底基板; 以及形成在基底基板中的具有环形形状的散热通孔，从而可以通过增加散热通路的面积来提高散热效率。