公开(公告)号：US12284758B2

公开(公告)日：2025-04-22

申请号：US18113828

申请日：2023-02-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Kyun Bae ,  Hwan Su Yoo ,  Suk Chang Hong

IPC: H05K1/18 ,  H05K1/11

Abstract: A printed circuit board includes: an insulating layer; first and second pads respectively disposed on an upper surface of the insulating layer; and a solder resist layer disposed on the upper surface of the insulating layer, and having first and second openings at least partially exposing the first and second pads, respectively, wherein the solder resist layer contacts a side surface of the first pad, and the solder resist layer is spaced apart from the second pad.

公开(公告)号：US20240074049A1

公开(公告)日：2024-02-29

申请号：US18113828

申请日：2023-02-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Kyun Bae ,  Hwan Su Yoo ,  Suk Chang Hong

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/111 ,  H05K1/181 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10674 ,  H05K2201/2081

Abstract: A printed circuit board includes: an insulating layer; first and second pads respectively disposed on an upper surface of the insulating layer; and a solder resist layer disposed on the upper surface of the insulating layer, and having first and second openings at least partially exposing the first and second pads, respectively, wherein the solder resist layer contacts a side surface of the first pad, and the solder resist layer is spaced apart from the second pad.

公开(公告)号：US20150351219A1

公开(公告)日：2015-12-03

申请号：US14811825

申请日：2015-07-28

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Chang Gun Oh ,  Tae Kyun Bae ,  Ho Sik Park

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/18 ,  H05K1/11

CPC classification number: H05K1/0206 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0298 ,  H05K1/113 ,  H05K1/115 ,  H05K3/0094 ,  H05K3/181 ,  H05K3/205 ,  H05K3/4608 ,  H05K3/4644 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09727 ,  H05K2201/10674 ,  H05K2203/1476 ,  Y10T29/49156 ,  H01L2924/00014

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: a base substrate having a via hole for signal transfer and a via hole for heat radiation formed therein and having circuit layers formed on both surfaces thereof, the circuit layers including connection pads; a signal via formed in an inner portion of the via hole for signal transfer by performing a plating process using a conductive metal; and a heat radiation via formed in an inner portion of the via hole for heat radiation by performing a plating process using a conductive metal, wherein the heat radiation via is formed to have a diameter larger than that of the signal via.

Abstract translation: 这里公开了一种印刷电路板及其制造方法。 印刷电路板包括：具有用于信号传送的通孔的基底基板和形成在其中的热辐射通孔，并且在其两个表面上形成电路层，电路层包括连接焊盘; 通过使用导电金属进行电镀处理而形成在用于信号传送的通孔的内部的信号通孔; 以及通过使用导电金属进行电镀处理而形成在用于散热的通孔的内部的散热通路，其中，所述散热通孔的直径大于所述信号通路的直径。

公开(公告)号：US09516740B2

公开(公告)日：2016-12-06

申请号：US14108517

申请日：2013-12-17

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Doo Hwan Lee ,  Tae Kyun Bae ,  Ho Shik Kang

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/46 ,  H01L23/00

CPC classification number: H05K1/0271 ,  H01L24/19 ,  H01L24/25 ,  H01L2224/04105 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/19 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/83005 ,  H01L2224/92244 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/4697 ,  H05K2201/068 ,  Y10T29/49139 ,  Y10T156/10

Abstract: The present invention can reduce warpage while minimizing unnecessary wiring of an electronic component embedded substrate by including an electronic component; a first wiring layer; and a second wiring layer, wherein at least one of the number of layers and wiring density of the first wiring layer is greater than at least one of the number of layers and wiring density of the second wiring layer and a first insulating portion is made of a material having a lower coefficient of thermal expansion than a second insulating portion.

Abstract translation: 通过包括电子部件，本发明可以减少电子部件嵌入式基板的不必要布线，同时减少翘曲; 第一布线层; 以及第二布线层，其中所述第一布线层的多个层数和布线密度中的至少一个大于所述第二布线层和所述第一绝缘部分的层数和布线密度中的至少一个， 具有比第二绝缘部分低的热膨胀系数的材料。