公开(公告)号：US20170012003A1

公开(公告)日：2017-01-12

申请号：US15275853

申请日：2016-09-26

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin O YOO

IPC: H01L23/552 ,  H01L25/065 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/315 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/19105 ,  H05K9/0024

Abstract: There are provided a semiconductor package and a method of manufacturing the same. The semiconductor package includes: a substrate having a ground electrode formed on one surface thereof; at least one electronic component mounted on one surface of the substrate; an insulation layer including an exposed part exposing the ground electrode and a cover part covering the electronic component; and a shielding layer electrically connected to the ground electrode and covering the insulation layer.

Abstract translation: 提供半导体封装及其制造方法。 半导体封装包括：在其一个表面上形成有接地电极的基板; 安装在所述基板的一个表面上的至少一个电子部件; 绝缘层，包括露出接地电极的露出部分和覆盖电子部件的覆盖部分; 以及屏蔽层，电连接到接地电极并覆盖绝缘层。

公开(公告)号：US20160255726A1

公开(公告)日：2016-09-01

申请号：US15151217

申请日：2016-05-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin O YOO

IPC: H05K1/18 ,  H05K3/34 ,  H05K1/02 ,  H01L23/31 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00 ,  H05K1/11 ,  H01L23/498

CPC classification number: H05K1/185 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/49838 ,  H01L24/00 ,  H01L24/11 ,  H01L24/81 ,  H01L24/96 ,  H01L25/00 ,  H01L25/50 ,  H01L2224/1146 ,  H01L2224/12105 ,  H01L2224/13005 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13186 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2924/01018 ,  H01L2924/19105 ,  H05K1/0296 ,  H05K1/11 ,  H05K3/3473 ,  H05K2203/1461

Abstract: A method of manufacturing a package may include forming a package module by disposing a plurality of components on an insulating plate filled with a viscous insulating liquid and curing the viscous insulating liquid, exposing at least portions of terminals of the plurality of components by polishing the insulating plate to have a predetermined thickness and then etching at least one portion of the insulating plate, forming a conductive stud on the at least exposed portions of the terminals and cutting the package module into predetermined unit packages, and examining reliability of a printed circuit board and bonding the unit package to the printed circuit board having confirmed reliability using the conductive stud.

公开(公告)号：US20160029479A1

公开(公告)日：2016-01-28

申请号：US14807502

申请日：2015-07-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin O YOO ,  Keun Hoi KOO

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/09 ,  H05K1/03

CPC classification number: H05K1/0259 ,  H05K2201/0326 ,  H05K2201/0738 ,  H05K2201/0746

Abstract: An electrostatic discharge (ESD) protection board may include an electrostatic discharge (ESD) protection board, including a substrate, a pattern layer including circuit patterns formed on the substrate, and a high-voltage conductive material formed on the circuit patterns, which are insulated from each other, and a portion of the substrate between the circuit patterns.

Abstract translation: 静电放电（ESD）保护板可以包括包括基板的静电放电（ESD）保护板，包括形成在基板上的电路图案的图案层和形成在电路图案上的高压导电材料，其被绝缘 彼此之间以及基板的一部分在电路图案之间。

公开(公告)号：US20230154678A1

公开(公告)日：2023-05-18

申请号：US17973038

申请日：2022-10-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Taek Jung LEE ,  Beom Seock OH ,  Ho Jun LEE ,  Kyung Mi BAE ,  Jin O YOO

IPC: H01G4/012 ,  H01G4/30 ,  H01G4/008 ,  H01G4/12

CPC classification number: H01G4/012 ,  H01G4/30 ,  H01G4/008 ,  H01G4/1227

Abstract: A multilayer ceramic capacitor includes: a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween; and a first external electrode and a second external electrode disposed externally on the body, the first external electrode being connected to the first internal electrode and the second external electrode being connected to the second internal electrode, wherein the first and second external electrodes are disposed on the body, and includes a first electrode layer including Ni and Cr, a second electrode layer disposed on the first electrode layer, and including Cu, and a plating layer disposed on the second electrode layer.

公开(公告)号：US20200304167A1

公开(公告)日：2020-09-24

申请号：US16508650

申请日：2019-07-11

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Wook KWON ,  Yun Tae LEE ,  Seong Jong CHEON ,  Sung Jae YOON ,  Jin O YOO

IPC: H04B1/50 ,  H04B1/00

Abstract: A front end module includes: a first filter and a second filter, the first filter and the second filter being configured to respectively support cellular communications in different frequency bands among a first frequency band and a second frequency band of a sub-6 GHz band; a third filter configured to support Wi-Fi communications in a third frequency band of a 5 GHz band, and having one end connected to an antenna terminal; and a switch configured to selectively connect one end of the first filter and one end of the second filter to the antenna terminal.

公开(公告)号：US20150189749A1

公开(公告)日：2015-07-02

申请号：US14327713

申请日：2014-07-10

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jin O YOO

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/00 ,  H05K1/18

CPC classification number: H05K1/185 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/81 ,  H01L24/96 ,  H01L25/00 ,  H01L25/50 ,  H01L2224/1146 ,  H01L2224/12105 ,  H01L2224/13005 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13186 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81205 ,  H01L2924/01018 ,  H01L2924/19105 ,  H05K1/0296 ,  H05K1/11 ,  H05K3/3473 ,  H05K2203/1461

Abstract: A method of manufacturing a package may include forming a package module by disposing a plurality of components on an insulating plate filled with a viscous insulating liquid and curing the viscous insulating liquid, exposing at least portions of terminals of the plurality of components by polishing the insulating plate to have a predetermined thickness and then etching at least one portion of the insulating plate, forming a conductive stud on the at least exposed portions of the terminals and cutting the package module into predetermined unit packages, and examining reliability of a printed circuit board and bonding the unit package to the printed circuit board having confirmed reliability using the conductive stud.

Abstract translation: 制造封装的方法可以包括通过在填充有粘性绝缘液体的绝缘板上设置多个部件并固化粘性绝缘液体来形成封装模块，通过抛光绝缘材料来暴露多个部件的端部的至少一部分 板以具有预定厚度，然后蚀刻绝缘板的至少一部分，在端子的至少暴露部分上形成导电柱，并将封装模块切割成预定单元封装，并且检查印刷电路板的可靠性和 使用导电柱将单元封装结合到具有确认可靠性的印刷电路板。