公开(公告)号：US20200380901A1

公开(公告)日：2020-12-03

申请号：US15929550

申请日：2020-05-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinbong RYU ,  Minki KIM ,  Hyemin KIM ,  Hwanyeol KIM ,  Hyungjun AHN ,  Sanghun LEE

IPC: G09G3/20

Abstract: An electronic device including at least one memory; a first display; a communication circuit; and at least one processor. The at least one processor is configured to while displaying multimedia content on the first display, receive capability data of an external electronic device for indicating that change of a posture of a second display of the external electronic device is available. The at least one processor is also configured to determine a posture of the second display corresponding to a display direction of the multimedia content. The at least one processor is further configured to transmit posture control information for indicating the determined posture to the external electronic device. Additionally, the at least one processor is configured to transmit streaming data of the multimedia content displayed on the first display to the external electronic device in order to display the multimedia content on the second display.

公开(公告)号：US20230317654A1

公开(公告)日：2023-10-05

申请号：US17980740

申请日：2022-11-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jihoon KIM ,  Minki KIM ,  Wonil LEE ,  Hyuekjae LEE

IPC: H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L25/00

CPC classification number: H01L24/08 ,  H01L25/0657 ,  H01L25/18 ,  H01L24/05 ,  H01L24/80 ,  H01L25/50 ,  H01L2224/05013 ,  H01L2224/05015 ,  H01L2224/05017 ,  H01L2224/05147 ,  H01L2224/08145 ,  H01L2224/80031 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2924/1431 ,  H01L2924/14511

Abstract: Disclosed are semiconductor devices and their fabrication methods. The semiconductor device comprises lower and upper structures. The lower structure includes a first semiconductor substrate, a first pad, and a first dielectric layer. The upper structure includes a second semiconductor substrate, a second pad, and a second dielectric layer. The upper and lower structures are bonded to each other to allow the first and second pads to come into contact each other and to allow the first and second dielectric layers to come into contact each other. A first interface between the first and second pads is at a level different from that of a second interface between the first and second dielectric layers. A first area of the first pad is greater than a second area of the second pad. A second thickness of the second pad is different from a first thickness of the first pad.

公开(公告)号：US20230141447A1

公开(公告)日：2023-05-11

申请号：US17896638

申请日：2022-08-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonil LEE ,  Minki KIM ,  Jihoon KIM ,  Gwangjae JEON

IPC: H01L23/00 ,  H01L25/065

CPC classification number: H01L24/05 ,  H01L24/08 ,  H01L24/03 ,  H01L24/80 ,  H01L24/97 ,  H01L24/94 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L24/16 ,  H01L2224/95001 ,  H01L2224/03616 ,  H01L2224/80204 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06544 ,  H01L2924/35121 ,  H01L2924/1434 ,  H01L2924/1431 ,  H01L2224/08121 ,  H01L2224/08145 ,  H01L2224/05018 ,  H01L2224/05073 ,  H01L2224/05541 ,  H01L2224/05555 ,  H01L2224/05015 ,  H01L2224/05557 ,  H01L2224/05578 ,  H01L2224/05687 ,  H01L2224/05647 ,  H01L2224/05166 ,  H01L2224/05187

Abstract: A semiconductor package is provided in which a first insulating layer includes a first recess spaced apart from a first pad in a first direction, and a second insulating layer includes a second recess spaced apart from a second pad in the first direction and overlapping at least a portion of the first recess in a second direction, perpendicular to the first direction, to provide an air gap together with the first recess. The semiconductor package further includes a first bonding surface defined by the first and second insulating layers contacting each other on one side of the air gap, adjacent to the first and second pads, and a second bonding surface defined by the first and second insulating layers contacting each other on another side of the air gap, opposite to the one side.

公开(公告)号：US20220191457A1

公开(公告)日：2022-06-16

申请号：US17550270

申请日：2021-12-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kwangmin BYEON ,  Seungbum LEE ,  Seungseok HONG ,  Minki KIM ,  Hyunsoo KIM ,  Donghyun YEOM

IPC: H04N13/167 ,  H04N13/293 ,  H04N13/383

Abstract: Various embodiments of the present disclosure provide an electronic device comprising: a communication module comprising communication circuitry, a memory, and a processor operatively connected to the communication module and the memory, wherein the processor is configured to: control the electronic device to establish a connection to a wearable display device through the communication module, receive gaze information from the wearable display device, determine a first application and a second application corresponding to the gaze information to be displayed on a screen, identify profiles of the determined first application and second application, and combine graphic data corresponding to the first application and graphic data corresponding to the second application and transmit the combined graphic data to the wearable display device, or transmit each of graphic data corresponding to the first application and graphic data corresponding to the second application to the wearable display device, based on the identified profiles.

公开(公告)号：US20250140723A1

公开(公告)日：2025-05-01

申请号：US18671443

申请日：2024-05-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jihoon KIM ,  Jinkyeong SEOL ,  Raeyoung KANG ,  Minki KIM ,  Hyeonkyu HA

IPC: H01L23/00 ,  H01L23/48 ,  H01L25/065 ,  H10B80/00

Abstract: A semiconductor package includes a plurality of semiconductor chips bonded to each other through direct bonding, the plurality of semiconductor chips including a first semiconductor chip and a second semiconductor chip. The first semiconductor chip including: a front insulating layer bonded to a back insulating layer of the second semiconductor chip; a front pad surrounded by the front insulating layer; a device layer on a back surface of the front insulating layer and including an interconnection structure electrically connected to the front pad; a conductive pattern between the interconnection structure and the front pad; and a support insulating layer between the device layer and the front insulating layer and surrounding the conductive pattern, wherein a gap is between a first side surface of the support insulating layer and a second side surface of the conductive pattern that faces the first side surface.

公开(公告)号：US20200252687A1

公开(公告)日：2020-08-06

申请号：US16778161

申请日：2020-01-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinbong RYU ,  Minki KIM ,  Jimin KIM ,  Hyungsuk KIM ,  Hyuntaek LEE ,  Donghyun YEOM

IPC: H04N21/4402 ,  H04N9/87 ,  H04N9/64 ,  H04N21/435

Abstract: An electronic device is provided. The electronic device includes communication circuitry configured to communicate with an external electronic device, a processor operatively connected with the communication circuitry, and a memory operatively connected with the processor. The memory may store instructions which, when executed, cause the processor to control the electronic device to: obtain environment information associated with a video playback environment of the external electronic device, decode a high dynamic range (HDR) video, perform color conversion of the decoded HDR video based on the environment information, encode the color-converted video into a standard dynamic range (SDR) format, and transmit the encoded video to the external electronic device via the communication circuitry.

公开(公告)号：US20190327834A1

公开(公告)日：2019-10-24

申请号：US16384257

申请日：2019-04-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minki KIM ,  Chulwoo PARK ,  Dongil SON

IPC: H05K1/14 ,  H01Q1/08 ,  H05K1/02 ,  H01Q1/24 ,  H01Q1/22

Abstract: An antenna device and an electronic device including the same are provided. The antenna device includes a housing that includes a first plate, a second plate facing a direction opposite to the first plate, and a side member surrounding a space between the first plate and the second plate, a display viewable through at least a portion of the first plate, an antenna assembly disposed within the housing wherein the antenna assembly includes a first printed circuit board, a second printed circuit board, at least one structure interconnecting the first printed circuit board and the second printed circuit board and including conductive paths, a plurality of conductive patterns, and a wireless communication circuit, a flexible printed circuit board, and a third printed circuit board.

公开(公告)号：US20220302722A1

公开(公告)日：2022-09-22

申请号：US17551793

申请日：2021-12-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungtae PARK ,  Minki KIM ,  Kicheol BAE ,  Yongjae SONG ,  Hyelim YUN ,  Woosung JANG

IPC: H02J7/00 ,  H01Q7/00 ,  H02J50/10 ,  H05K1/18 ,  H05K1/14 ,  H05K1/11 ,  H05K5/00

Abstract: An electronic device is provided. The electronic device includes a first circuit board, an antenna member disposed to face one surface of the first circuit board, an electronic module disposed between the first circuit board and the antenna member and including a plurality of contact protrusions disposed to face the antenna member, and a plurality of contact members disposed on the antenna member and configured to electrically contact one of the plurality of contact protrusions. As the antenna member generates an induced current in reaction to an external electrical signal or an external electromagnetic field, the electronic module may be configured to supply power using the induced current generated by the antenna member.

公开(公告)号：US20220201861A1

公开(公告)日：2022-06-23

申请号：US17693947

申请日：2022-03-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minki KIM ,  Chulwoo PARK ,  Dongil SON

IPC: H05K1/14 ,  H01Q1/08 ,  H01Q1/24 ,  H01Q1/22 ,  H05K1/02

Abstract: An antenna device and an electronic device including the same are provided. The antenna device includes a housing that includes a first plate, a second plate facing a direction opposite to the first plate, and a side member surrounding a space between the first plate and the second plate, a display viewable through at least a portion of the first plate, an antenna assembly disposed within the housing wherein the antenna assembly includes a first printed circuit board, a second printed circuit board, at least one structure interconnecting the first printed circuit board and the second printed circuit board and including conductive paths, a plurality of conductive patterns, and a wireless communication circuit, a flexible printed circuit board, and a third printed circuit board.

公开(公告)号：US20210098911A1

公开(公告)日：2021-04-01

申请号：US17061461

申请日：2020-10-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minki KIM ,  Byunghoon LEE ,  Min PARK ,  Sungtae PARK ,  Jungmin PARK ,  Yongjae SONG ,  Hongshin SHIN ,  Woosung Jang ,  Chulwoo PARK ,  Chihyun CHO

IPC: H01R12/62 ,  H05K1/14

Abstract: An electronic device includes a housing; a first circuit board, and a flexible circuit board. The first circuit board is disposed in an internal space of the housing and includes a plurality of first conductive terminals. The flexible circuit board includes a first connection portion including a plurality of second conductive terminals configured to connect to the plurality of first conductive terminals. The flexible circuit board also includes a connection portion extended from the first connection portion, and at least one conductive layer extended from the connection portion to at least a portion of the first connection portion. Additionally, the flexible circuit board includes at least one transmissive area in which light may be transmitted and the at least one conductive layer is at least partially omitted. At least some of the plurality of second conductive terminals are visible from the outside through the at least one transmissive area.