公开(公告)号：US11139184B2

公开(公告)日：2021-10-05

申请号：US16158950

申请日：2018-10-12

Applicant: SEMES CO., LTD.

Inventor： Ki Seung Lee ,  Soo Hyun Cho ,  Choongki Min

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/027 ,  F24C15/10

Abstract: The inventive concept provides an apparatus and a method for heat-treating a substrate. The method includes a first treatment operation of spacing a substrate apart from a support plate provided with a heater to a first height in a state in which a treatment space, in which the substrate is treated, is closed and heating the substrate, a second treatment operation of, after the first treatment operation, lowering the substrate such that the substrate is located at a second height and heating the substrate, a third treatment operation of, after the second treatment operation, lifting the substrate such that the substrate is spaced apart from the support plate to be located at a third height and heating the substrate, and a fourth treatment operation of, after the third treatment operation, lowering the substrate such that the substrate is located at a fourth height and heating the substrate.

公开(公告)号：US10541161B2

公开(公告)日：2020-01-21

申请号：US15627618

申请日：2017-06-20

Applicant: SEMES CO., LTD.

Inventor： Younghun Jung ,  Choongki Min ,  Soo Hyun Cho

IPC: H01L21/027 ,  H01L21/67 ,  B05D1/36

Abstract: Provided is a substrate treating apparatus. The substrate treating apparatus comprises: a support unit provided to support the substrate and rotate the substrate; a treatment liquid nozzle for supplying the treatment liquid onto the substrate supported by the support unit; a pre-wet liquid nozzle for supplying a pre-wet liquid onto a substrate supported by the support unit; and a controller for controlling the treatment liquid nozzle and the pre-wet liquid nozzle, wherein the controller controls the treatment liquid nozzle and the pre-wet liquid nozzle to perform a pre-wet step for supplying the pre-wet liquid to the substrate, and then a treatment liquid supply step for supplying the treatment liquid to the substrate and supplying the pre-wet liquid to the substrate during the supplying the treatment liquid to the substrate.

公开(公告)号：US11340533B2

公开(公告)日：2022-05-24

申请号：US17380308

申请日：2021-07-20

Applicant: SEMES CO., LTD.

Inventor： Min Jung Park ,  Jung Yul Lee ,  Choongki Min ,  Kyungjin Seo

IPC: G03F7/20

Abstract: The inventive concept provides a substrate treating apparatus and a substrate treating method. The sub substrate treating apparatus may include a support unit that supports a substrate, a liquid supply unit that supplies a liquid onto the substrate supported by the support unit, and a controller that controls the liquid supply unit and the support unit, the liquid supply unit may include a pre-treatment nozzle that discharges a first treatment liquid in a stream scheme, and a main nozzle that discharges a second treatment liquid in a liquid curtain scheme, and the controller may control the support unit such that a rotational direction of the substrate when the first treatment liquid is discharged from the main nozzle and a rotational direction of the substrate when the second treatment liquid is discharged from the pre-treatment nozzle are opposite to each other.

公开(公告)号：US20170309473A9

公开(公告)日：2017-10-26

申请号：US15078249

申请日：2016-03-23

Applicant: Semes Co., Ltd.

Inventor： EUN SAEM AHN ,  Choongki Min ,  Jung Yul Lee ,  Min Jung Park

IPC: H01L21/027 ,  B05B13/02 ,  B05B1/16 ,  B05B7/00 ,  H01L21/67

CPC classification number: H01L21/0273 ,  B05B1/16 ,  B05B7/00 ,  B05B13/0228 ,  B05B13/0242 ,  B05B13/0278 ,  G03F7/162 ,  H01L21/6715

Abstract: Disclosed are a method and an apparatus for applying a liquid onto a substrate. The method for treating a substrate, the method includes: a liquid supplying step of supplying a treatment liquid for forming a liquid film on the substrate while rotating the substrate; and a liquid diffusing step of diffusing the treatment liquid discharged to the substrate by rotating the substrate, after the liquid supplying step. The liquid diffusing step includes: a primary diffusion step of rotating the substrate at a first diffusion speed; and a secondary diffusion step of rotating the substrate at a second diffusion speed, after the primary diffusion step. The second diffusion speed is higher than the first diffusion speed. Accordingly, the treatment liquid can be applied to the substrate again by performing the secondary diffusion step, making it possible to adjust the thickness of a photosensitive film.

公开(公告)号：US11380560B2

公开(公告)日：2022-07-05

申请号：US16396982

申请日：2019-04-29

Applicant: SEMES CO., LTD.

Inventor： Ki Seung Lee ,  Choongki Min ,  Soo Hyun Cho ,  Okseong Lee

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687

Abstract: The inventive concept relates to an apparatus and method for forming a film on a substrate by spin coating. The apparatus includes liquid dispensing units that dispense processing liquids to form liquid films on the first and second substrates, respectively, air-flow supply units that form downward air flows in the first and second spaces, respectively, and a controller that controls the liquid dispensing units and the air-flow supply units. Each of the liquid dispensing units includes a pre-treatment nozzle that dispenses a pre-treatment liquid and a coating solution nozzle that dispenses a coating solution onto a corresponding one of the first and second substrates. The controller controls the liquid dispensing units to dispense the pre-treatment liquids and thereafter the coating solutions onto the first and second substrates and adjusts supply states of the downward air flows according to amounts of the pre-treatment liquids dispensed.

公开(公告)号：US09793118B2

公开(公告)日：2017-10-17

申请号：US15078249

申请日：2016-03-23

Applicant: SEMES CO., LTD.

Inventor： Eun Saem Ahn ,  Choongki Min ,  Jung Yul Lee ,  Min Jung Park

IPC: H01L21/00 ,  H01L21/027 ,  B05B1/16 ,  B05B7/00 ,  B05B13/02

CPC classification number: H01L21/0273 ,  B05B1/16 ,  B05B7/00 ,  B05B13/0228 ,  B05B13/0242 ,  B05B13/0278 ,  G03F7/162 ,  H01L21/6715

Abstract: Disclosed are a method and an apparatus for applying a liquid onto a substrate. The method for treating a substrate, the method includes: a liquid supplying step of supplying a treatment liquid for forming a liquid film on the substrate while rotating the substrate; and a liquid diffusing step of diffusing the treatment liquid discharged to the substrate by rotating the substrate, after the liquid supplying step. The liquid diffusing step includes: a primary diffusion step of rotating the substrate at a first diffusion speed; and a secondary diffusion step of rotating the substrate at a second diffusion speed, after the primary diffusion step. The second diffusion speed is higher than the first diffusion speed. Accordingly, the treatment liquid can be applied to the substrate again by performing the secondary diffusion step, making it possible to adjust the thickness of a photosensitive film.

公开(公告)号：US20160293404A1

公开(公告)日：2016-10-06

申请号：US15078249

申请日：2016-03-23

Applicant: Semes Co., Ltd.

Inventor： EUN SAEM AHN ,  Choongki Min ,  Jung Yul Lee ,  Min Jung Park

IPC: H01L21/027 ,  B05B1/00

CPC classification number: H01L21/0273 ,  B05B1/16 ,  B05B7/00 ,  B05B13/0228 ,  B05B13/0242 ,  B05B13/0278 ,  G03F7/162 ,  H01L21/6715

Abstract: Disclosed are a method and an apparatus for applying a liquid onto a substrate. The method for treating a substrate, the method includes: a liquid supplying step of supplying a treatment liquid for forming a liquid film on the substrate while rotating the substrate; and a liquid diffusing step of diffusing the treatment liquid discharged to the substrate by rotating the substrate, after the liquid supplying step. The liquid diffusing step includes: a primary diffusion step of rotating the substrate at a first diffusion speed; and a secondary diffusion step of rotating the substrate at a second diffusion speed, after the primary diffusion step. The second diffusion speed is higher than the first diffusion speed. Accordingly, the treatment liquid can be applied to the substrate again by performing the secondary diffusion step, making it possible to adjust the thickness of a photosensitive film.

Abstract translation: 公开了一种将液体施加到基板上的方法和装置。 一种处理基板的方法，所述方法包括：液体供给步骤，在旋转所述基板的同时，在所述基板上供给用于形成液膜的处理液; 以及液体扩散步骤，在液体供给步骤之后，通过旋转基板来扩散排放到基板的处理液。 液体扩散步骤包括：以第一扩散速度旋转衬底的一次扩散步骤; 以及在第一扩散步骤之后以第二扩散速度旋转衬底的二次扩散步骤。 第二扩散速度高于第一扩散速度。 因此，可以通过执行二次扩散步骤再次将处理液施加到基板，使得可以调节感光膜的厚度。