公开(公告)号：US20230129923A1

公开(公告)日：2023-04-27

申请号：US17971734

申请日：2022-10-24

Applicant: SEMES CO., LTD.

Inventor： Jin Woo JUNG ,  Jin Mo JAE ,  Sang Min LEE ,  Young Hun LEE ,  Yong Hyun CHOI ,  Yong Joon IM ,  Seung Hoon OH

IPC: H01L21/687 ,  H01L21/67 ,  B08B3/04 ,  B08B13/00

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing for providing a treating space for treating a substrate within; a support unit for supporting the substrate in the treating space; a bottom supply port for supplying a process fluid to the treating space; and a filler member positioned below the substrate supported on the support unit in the treating space, and wherein the filler member forms a buffer space facing the bottom supply port, and a passage is formed between the filler member and an inner wall of the housing and flows the process fluid which is introduced to the buffer space in a direction of the substrate.

公开(公告)号：US20240116086A1

公开(公告)日：2024-04-11

申请号：US18117524

申请日：2023-03-06

Applicant: SEMES CO., LTD.

Inventor： Yong Hyun CHOI ,  Woo Young KIM ,  Dong Gyu JIN

IPC: B08B3/08 ,  B08B3/02 ,  B08B5/00 ,  B08B7/00 ,  B08B7/04

CPC classification number: B08B3/08 ,  B08B3/02 ,  B08B5/00 ,  B08B7/0071 ,  B08B7/04 ,  B08B2220/01 ,  F26B3/06

Abstract: A substrate processing facility includes a cleaning device for cleaning a substrate; and a drying device for drying the substrate cleaned by the cleaning device with a supercritical gas, wherein the cleaning device includes a sulfuric acid cleaning chamber.

公开(公告)号：US20230201884A1

公开(公告)日：2023-06-29

申请号：US18068917

申请日：2022-12-20

Applicant: SEMES CO, LTD.

Inventor： Yong Hyun CHOI ,  Young Hun LEE ,  Seung Hoon OH ,  Mi So PARK ,  Tae Jong CHOI ,  Yong Sun KO ,  Jin Woo JUNG

IPC: B08B3/02 ,  F26B5/00

CPC classification number: B08B3/022 ,  F26B5/005 ,  H01L21/02057

Abstract: The present invention provides a method for treating a substrate. The method for treating a substrate comprises: treating the substrate with liquid; and drying the liquid-treated substrate, and the liquid treatment step includes: a first liquid supply step of supplying a first liquid to an upper surface of the rotating substrate; and a second liquid supply step of supplying a second liquid to an upper surface of the rotating substrate, and in the second liquid supply step, a rotation speed of the substrate is adjusted such that the second liquid supplied on the substrate flows from a central region of the substrate to an edge region of the substrate.

公开(公告)号：US20240203726A1

公开(公告)日：2024-06-20

申请号：US18241893

申请日：2023-09-03

Applicant: SEMES CO., LTD.

Inventor： Myung Seok CHA ,  Ki Bong KIM ,  Yong Hyun CHOI ,  Ju Yeon SONG

IPC: H01L21/02 ,  H01L21/67 ,  H01L21/677

CPC classification number: H01L21/02101 ,  H01L21/02057 ,  H01L21/67034 ,  H01L21/67748 ,  H01L21/6776

Abstract: Proposed are an organic solvent supplying apparatus, a substrate processing method, and a substrate processing apparatus. An organic solvent supplying apparatus according to an embodiment supplies an organic solvent to a liquid processing chamber of a substrate processing apparatus, the substrate processing apparatus including the liquid processing chamber for supplying the organic solvent to a substrate and a supercritical processing chamber for drying the substrate coated with the organic solvent using supercritical fluid. The organic solvent supplying apparatus includes a supply tank for storing the organic solvent, a supply line connected to the supply tank and the liquid processing chamber, and a cooling module provided on the supply line.