公开(公告)号：US09258890B2

公开(公告)日：2016-02-09

申请号：US14294875

申请日：2014-06-03

Applicant: STMicroelectronics, Inc.

Inventor： Rammil Seguido ,  Frederick Ray Gomez ,  Emmanuel Angeles

IPC: H01L23/52 ,  H01L23/48 ,  H05K1/02 ,  H05K3/30 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0296 ,  H01L23/66 ,  H01L25/0652 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0271 ,  H05K1/111 ,  H05K1/181 ,  H05K3/305 ,  H05K2201/09236 ,  H05K2201/09781 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10719 ,  H05K2201/10977 ,  H05K2203/049 ,  Y10T29/49146 ,  H01L2924/00014

Abstract: Delamination of stacked integrated circuit die configurations on printed circuit boards is avoided by providing a metal trace support structure underneath the die stack. The metal trace support structure features substantially equally spaced thin metal traces in place of a contiguous metal plate which has been used in the past. Spaced apart thin metal traces are less vulnerable to thermal expansion than a metal plate which has a large thermal mass. The metal traces still provide structural stability, while preventing delamination of the die stack configuration during thermal processing. A method of attaching a bridge die stack configuration to a printed circuit board by adhering a die attach film to a field of metal traces is demonstrated. In addition, the electrical and structural integrity of the bridge die stack formed with a metal trace support structure is confirmed with test results.

Abstract translation: 通过在管芯堆叠下方提供金属迹线支撑结构，可以避免印刷电路板上的堆叠集成电路管芯结构的分层。 金属迹线支撑结构具有基本相等间隔的细金属迹线，代替过去使用的连续金属板。 分隔开的薄金属迹线比具有大热质量的金属板不易受热膨胀。 金属迹线仍然提供结构稳定性，同时防止热处理期间芯片堆叠配置的分层。 证明了通过将管芯附着膜粘附到金属痕迹的领域将桥模组叠构造附着到印刷电路板的方法。 此外，用测试结果证实了由金属迹线支撑结构形成的桥模组的电气和结构完整性。

公开(公告)号：US20220102166A1

公开(公告)日：2022-03-31

申请号：US17546960

申请日：2021-12-09

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo ,  Frederick Ray Gomez

IPC: H01L21/48 ,  H05K1/11 ,  H01L23/00 ,  H05K1/18 ,  H01L23/495 ,  H01L21/54 ,  H01L21/78

Abstract: Embodiments of the present disclosure are directed to a leadframe package with recesses formed in outer surface of the leads. The recesses are filled with a filler material, such as solder. The filler material in the recesses provides a wetable surface for filler material, such as solder, to adhere to during mounting of the package to another device, such as a printed circuit board (PCB). This enables strong solder joints between the leads of the package and the PCB. It also enables improved visual inspection of the solder joints after the package has been mounted.

公开(公告)号：US11227776B2

公开(公告)日：2022-01-18

申请号：US15392909

申请日：2016-12-28

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo ,  Frederick Ray Gomez

IPC: H01L21/44 ,  H01L21/48 ,  H01L23/495 ,  H05K1/11 ,  H01L23/00 ,  H05K1/18 ,  H01L21/54 ,  H01L21/78 ,  H01L23/31 ,  H01L21/56

Abstract: Embodiments of the present disclosure are directed to a leadframe package with recesses formed in outer surface of the leads. The recesses are filled with a filler material, such as solder. The filler material in the recesses provides a wetable surface for filler material, such as solder, to adhere to during mounting of the package to another device, such as a printed circuit board (PCB). This enables strong solder joints between the leads of the package and the PCB. It also enables improved visual inspection of the solder joints after the package has been mounted.

公开(公告)号：US10388594B2

公开(公告)日：2019-08-20

申请号：US15636533

申请日：2017-06-28

Applicant: STMICROELECTRONICS, INC.

Inventor： Frederick Ray Gomez ,  Tito Mangaoang, Jr. ,  Jefferson Talledo

IPC: H01L21/48 ,  H01L21/56 ,  H01L21/66 ,  H01L23/00 ,  H01L23/31 ,  H01L23/60 ,  H01L23/495

Abstract: According to principles of the disclosure as explained herein, selected leads are electrically connected through metal strips to the lead frame until the end of the manufacturing process. The lead frame is grounded through the manufacturing process to prevent any ESD event from causing damage to the protected leads. In the final singulation step, the leads are electrically isolated from each other and from the lead frame, thus maintaining protection from a potential ESD event up until the final package singulation step.

公开(公告)号：US20170110340A1

公开(公告)日：2017-04-20

申请号：US15392909

申请日：2016-12-28

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo ,  Frederick Ray Gomez

IPC: H01L21/48 ,  H01L21/54 ,  H01L21/78

CPC classification number: H01L21/4842 ,  H01L21/4825 ,  H01L21/54 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/8385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/181 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10628 ,  H05K2201/10992 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2924/01047 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Embodiments of the present disclosure are directed to a leadframe package with recesses formed in outer surface of the leads. The recesses are filled with a filler material, such as solder. The filler material in the recesses provides a wetable surface for filler material, such as solder, to adhere to during mounting of the package to another device, such as a printed circuit board (PCB). This enables strong solder joints between the leads of the package and the PCB. It also enables improved visual inspection of the solder joints after the package has been mounted.

公开(公告)号：US12094725B2

公开(公告)日：2024-09-17

申请号：US17546960

申请日：2021-12-09

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo ,  Frederick Ray Gomez

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/54 ,  H01L21/78 ,  H01L23/00 ,  H05K1/11 ,  H05K1/18 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L21/4842 ,  H01L21/4825 ,  H01L21/54 ,  H01L21/78 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/83 ,  H05K1/111 ,  H05K1/181 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/8385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/181 ,  H05K2201/10628 ,  H05K2201/10992 ,  H01L2224/97 ,  H01L2224/85 ,  H01L2224/97 ,  H01L2224/83 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/83439 ,  H01L2924/00014 ,  H01L2224/85439 ,  H01L2924/00014 ,  H01L2224/83444 ,  H01L2924/01047 ,  H01L2224/85444 ,  H01L2924/01047 ,  H01L2224/83101 ,  H01L2924/00014 ,  H01L2224/2919 ,  H01L2924/0665 ,  H01L2224/48105 ,  H01L2924/00014 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2224/48465 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00 ,  H01L2224/48465 ,  H01L2224/48247 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/73265 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed to a leadframe package with recesses formed in outer surface of the leads. The recesses are filled with a filler material, such as solder. The filler material in the recesses provides a wetable surface for filler material, such as solder, to adhere to during mounting of the package to another device, such as a printed circuit board (PCB). This enables strong solder joints between the leads of the package and the PCB. It also enables improved visual inspection of the solder joints after the package has been mounted.

公开(公告)号：US09578744B2

公开(公告)日：2017-02-21

申请号：US14579902

申请日：2014-12-22

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo ,  Frederick Ray Gomez

IPC: H01L23/495 ,  H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H05K1/11 ,  H01L23/00 ,  H05K1/18 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L21/4842 ,  H01L21/4825 ,  H01L21/54 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/8385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/181 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10628 ,  H05K2201/10992 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2924/01047 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Embodiments of the present disclosure are directed to a leadframe package with recesses formed in outer surface of the leads. The recesses are filled with a filler material, such as solder. The filler material in the recesses provides a wetable surface for filler material, such as solder, to adhere to during mounting of the package to another device, such as a printed circuit board (PCB). This enables strong solder joints between the leads of the package and the PCB. It also enables improved visual inspection of the solder joints after the package has been mounted.

Abstract translation: 本公开的实施例涉及具有形成在引线的外表面中的凹部的引线框封装。 这些凹部填充有诸如焊料的填充材料。 凹槽中的填充材料提供用于填充材料（例如焊料）的可润湿表面，以在将包装安装到诸如印刷电路板（PCB）的另一装置时粘附。 这使得封装引线与PCB之间能够实现强焊点。 它还可以在安装包装后改善焊点的目视检查。

公开(公告)号：US12211774B2

公开(公告)日：2025-01-28

申请号：US16848635

申请日：2020-04-14

Applicant: STMICROELECTRONICS, INC.

Inventor： Ela Mia Cadag ,  Frederick Ray Gomez ,  Aaron Cadag

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00

Abstract: Generally described, one or more embodiments are directed to semiconductor packages comprising a plurality of leads and methods of forming same. The plurality of leads include active leads that are electrically coupled to bond pads of a semiconductor die and thereby coupled to active components of the semiconductor die, and inactive leads that are not electrically coupled to bond pads of the semiconductor die. The active leads have surfaces that are exposed at a lower surface of the semiconductor package and forms lands, while the inactive leads are not exposed at the lower surface of the package.

公开(公告)号：US10672689B2

公开(公告)日：2020-06-02

申请号：US16460704

申请日：2019-07-02

Applicant: STMICROELECTRONICS, INC.

Inventor： Frederick Ray Gomez ,  Tito Mangaoang, Jr. ,  Jefferson Talledo

IPC: H01L23/495 ,  H01L21/56 ,  H01L21/48 ,  H01L23/60 ,  H01L23/31 ,  H01L23/00 ,  H01L21/66

Abstract: According to principles of the disclosure as explained herein, selected leads are electrically connected through metal strips to the lead frame until the end of the manufacturing process. The lead frame is grounded through the manufacturing process to prevent any ESD event from causing damage to the protected leads. In the final singulation step, the leads are electrically isolated from each other and from the lead frame, thus maintaining protection from a potential ESD event up until the final package singulation step.

公开(公告)号：US20160183369A1

公开(公告)日：2016-06-23

申请号：US14579902

申请日：2014-12-22

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo ,  Frederick Ray Gomez

IPC: H05K1/11 ,  H05K1/18 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00

CPC classification number: H01L21/4842 ,  H01L21/4825 ,  H01L21/54 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/8385 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/181 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10628 ,  H05K2201/10992 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2924/01047 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Embodiments of the present disclosure are directed to a leadframe package with recesses formed in outer surface of the leads. The recesses are filled with a filler material, such as solder. The filler material in the recesses provides a wetable surface for filler material, such as solder, to adhere to during mounting of the package to another device, such as a printed circuit board (PCB). This enables strong solder joints between the leads of the package and the PCB. It also enables improved visual inspection of the solder joints after the package has been mounted.

Abstract translation: 本公开的实施例涉及具有形成在引线的外表面中的凹部的引线框封装。 这些凹部填充有诸如焊料的填充材料。 凹槽中的填充材料提供用于填充材料（例如焊料）的可润湿表面，以在将包装安装到诸如印刷电路板（PCB）的另一装置时粘附。 这使得封装引线与PCB之间能够实现强焊点。 它还可以在安装包装后改善焊点的目视检查。