公开(公告)号：US20170125387A1

公开(公告)日：2017-05-04

申请号：US15402521

申请日：2017-01-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： UN-BYOUNG KANG ,  Tae-Je Cho ,  Byung-Hyug Roh

IPC: H01L25/065 ,  H01L21/56 ,  H01L23/31 ,  H01L21/78 ,  H01L23/00 ,  H01L25/00 ,  H01L21/768

CPC classification number: H01L25/0657 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3142 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/92 ,  H01L24/94 ,  H01L24/96 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/0231 ,  H01L2224/02372 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05548 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/06131 ,  H01L2224/13023 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1413 ,  H01L2224/14181 ,  H01L2224/16113 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/1713 ,  H01L2224/17181 ,  H01L2224/73204 ,  H01L2224/9202 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2924/05442 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/186 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2924/014

Abstract: A chip-stacked semiconductor package includes a first chip having a first front surface, a first back surface, and a first connection member on the first front surface, the first back surface being opposite to the first front surface; a second chip having a second front surface, a second back surface, a second connection member and a first through-silicon via (TSV) electrically connected to the second connection member, the second back surface opposite to the second front surface, and the second connection member on the second front face; and a first sealing member between the first front surface and the second front surface, the first sealing member filling a space between the first connection member and the second connection member, the first connection member of the first chip and the second connection member of the second chip being symmetric with respect to each other.

公开(公告)号：US09905538B2

公开(公告)日：2018-02-27

申请号：US15402521

申请日：2017-01-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Un-Byoung Kang ,  Tae-Je Cho ,  Byung-Hyug Roh

IPC: H01L25/065 ,  H01L23/00 ,  H01L21/56 ,  H01L21/768 ,  H01L21/78 ,  H01L25/00 ,  H01L23/31 ,  H01L23/29

CPC classification number: H01L25/0657 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3142 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/92 ,  H01L24/94 ,  H01L24/96 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/0231 ,  H01L2224/02372 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05548 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/06131 ,  H01L2224/13023 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1413 ,  H01L2224/14181 ,  H01L2224/16113 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/1713 ,  H01L2224/17181 ,  H01L2224/73204 ,  H01L2224/9202 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2924/05442 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/186 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2924/014

Abstract: A chip-stacked semiconductor package includes a first chip having a first front surface, a first back surface, and a first connection member on the first front surface, the first back surface being opposite to the first front surface; a second chip having a second front surface, a second back surface, a second connection member and a first through-silicon via (TSV) electrically connected to the second connection member, the second back surface opposite to the second front surface, and the second connection member on the second front face; and a first sealing member between the first front surface and the second front surface, the first sealing member filling a space between the first connection member and the second connection member, the first connection member of the first chip and the second connection member of the second chip being symmetric with respect to each other.