公开(公告)号：US20160163663A1

公开(公告)日：2016-06-09

申请号：US14958922

申请日：2015-12-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gi-bum KIM ,  Sang-hyun LEE ,  Ho-seob LEE

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L24/13 ,  H01L27/156 ,  H01L33/62 ,  H01L2224/02126 ,  H01L2224/02375 ,  H01L2224/02377 ,  H01L2224/0392 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05171 ,  H01L2224/05178 ,  H01L2224/0518 ,  H01L2224/05552 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/05576 ,  H01L2224/0558 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13021 ,  H01L2224/13024 ,  H01L2224/13027 ,  H01L2224/13111 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/01079

Abstract: An embodiment includes a semiconductor light-emitting device comprising: an electrode pad; a first under-barrier metal (UBM) layer stacked on the electrode pad; a second UBM layer stacked on the first UBM layer and having a multilayered structure including at least two layers; and a solder bump disposed on the second UBM layer, wherein adhesion between the second UBM layer and the first UBM layer is higher than adhesion between the first UBM layer and the solder bump.

Abstract translation: 实施例包括半导体发光器件，包括：电极焊盘; 堆叠在所述电极焊盘上的第一下阻挡金属（UBM）层; 第二UBM层，堆叠在第一UBM层上并且具有包括至少两层的多层结构; 以及设置在所述第二UBM层上的焊料凸块，其中所述第二UBM层和所述第一UBM层之间的粘附性高于所述第一UBM层和所述焊料凸块之间的粘附。