Abstract:
Provided are a polymer, a resist composition including the same, and a method of forming a pattern using the resist composition, the polymer including one or more of a first repeating unit represented by Formula 1 and a second repeating unit represented by Formula 2, and free of a repeating unit of which a structure changes by an acid:
In Formulae 1 and 2, R11 to R16, b12, X−, R21 to R24, b22, and Y are as described in the specification.
Abstract:
Disclosed are a composition comprising a silane compound having a fluorine-containing (poly)ether group represented by Formula 1, a film formed from the composition, a display device including the film, and an article including a coating product of the composition: Rf-(L1)p1(L)a-C(═O)NR-(L2)p2-Si(R1)(R2)(R3) Formula 1 wherein in Formula 1, R is -(L3)p3-Si(R4)(R5)(R6), L is —CH2— or —CH2—O—CH2—, Rf is a fluorine-containing (poly)ether group, and L1 to L3, p1 to p3, and R1 to R6 are the same as defined in the detailed description.
Abstract:
Provided are a polymer including a first repeating unit represented by Formula 1 and having a glass transition temperature of 50° C. or less, a polymer-containing composition including the polymer, and a method of forming a pattern by using the polymer-containing composition: wherein, in Formula 1, descriptions of L11 to L13, a11 to a13, An, R11, R12, b12, and p1 are provided in the present specification.
Abstract:
Provided are an organic salt represented by Formula 1 below, a photoresist composition including the same, and a method of forming a pattern by using the photoresist composition.
Abstract:
A poly(amide-imide) copolymer that is a reaction product of a diamine represented by Chemical Formula 1, a diamine represented by Chemical Formula 2, a dicarbonyl compound represented by Chemical Formula 3, and a tetracarboxylic acid dianhydride represented by Chemical Formula 4, a composition for preparing the poly(amide-imide copolymer, and an article including the copolymer, e.g., a film are provided: wherein, in Chemical Formulae 1 to 4, Ra, L1, L2, n1, A, R3, X, R10, R12, R13, n7 and n8 are the same as defined in the specification.
Abstract:
A laminated film including a first film; and a second film disposed on the first film, wherein a tensile modulus of the second film is greater than or equal to a tensile modulus of the first film, and a transmittance of the first film is greater than or equal to a transmittance of the second film, provided that at least one of the tensile modulus of the first film and the tensile modulus of the second film are not equal or the transmittance of the first film and the transmittance of the second film are not equal.
Abstract:
A laminated film including a first film; and a second film disposed on the first film, wherein a tensile modulus of the second film is greater than or equal to a tensile modulus of the first film, and a transmittance of the first film is greater than or equal to a transmittance of the second film, provided that at least one of the tensile modulus of the first film and the tensile modulus of the second film are not equal or the transmittance of the first film and the transmittance of the second film are not equal.
Abstract:
A poly(amide-imide) copolymer including a reaction product of at least one tetracarboxylic acid dianhydride, at least one diamine, and at least one dicarboxylic acid derivative, wherein the at least one tetracarboxylic acid dianhydride includes a tetracarboxylic acid dianhydride represented by Chemical Formula 1, the at least one diamine includes a diamine represented by Chemical Formula 2, and the at least one dicarboxylic acid derivative includes a dicarboxylic acid derivative represented by Chemical Formula 3: wherein, R1 to R3, X1 and X2 are the same as defined in the specification.
Abstract:
A window for a display device including a plastic substrate having yield strain of greater than or equal to about 0.8% at about 85 degrees Celsius and 85% relative humidity and a hard coating layer disposed on at least one side of the plastic substrate.
Abstract:
Provided are an organometallic compound represented by one of Formulae 1-1 to 1-4, a resist composition including the same, and a pattern formation method using the resist composition: M11, Q11 to Q14, b11 to b14, R11 to R14, Y11 to Y13, and X11 to X14 in Formulae 1-1 to 1-4 are as described in the specification.