公开(公告)号：US20160133788A1

公开(公告)日：2016-05-12

申请号：US14789278

申请日：2015-07-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tae Hun KIM ,  Myong Soo CHO ,  Yeon Ji KIM ,  Yong Seok KIM ,  Tae Kang KIM ,  Jae Ho HAN

IPC: H01L33/20 ,  H01L33/38 ,  H01L33/54 ,  H01L33/50 ,  H01L33/46 ,  H01L33/24 ,  H01L33/44

CPC classification number: H01L33/20 ,  H01L33/38 ,  H01L33/46 ,  H01L33/54

Abstract: Semiconductor light-emitting devices, and semiconductor light-emitting packages, include at least one light-emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer sequentially stacked on a substrate, the at least one light-emitting structure having a first region and a second region delimiting the first region. The light-emitting device includes a groove in the second region, and the groove is adjacent to an edge of the substrate and extends parallel to the edge of the substrate.

Abstract translation: 半导体发光器件和半导体发光封装包括至少一个发光结构，其包括依次堆叠在衬底上的第一导电类型半导体层，有源层和第二导电类型半导体层， 至少一个发光结构具有第一区域和限定第一区域的第二区域。 发光装置包括在第二区域中的凹槽，并且凹槽与衬底的边缘相邻并且平行于衬底的边缘延伸。

公开(公告)号：US20160365497A1

公开(公告)日：2016-12-15

申请号：US15139930

申请日：2016-04-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Tae Hun KIM ,  Myong Soo CHO ,  Jung Hee KWAK ,  Yeon Ji KIM ,  Yong Seok KIM ,  Tae Kang KIM

IPC: H01L33/62 ,  H01L33/46 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L24/00 ,  H01L25/0753 ,  H01L33/38

Abstract: A light emitting device package includes: a package board including a first electrode structure and a second electrode structure; and a light emitting device mounted on the package board and configured to emit light, the light emitting device including: light emitting structures provided on a growth substrate, electrically connected in series, and including an input terminal and an output terminal; a first solder pad and a second solder pad electrically connected to the input terminal and the output terminal, respectively, and in contact with the first and second electrode structures; and dummy solder pads provided on the light emitting structures and electrically insulated from the light emitting structures.

Abstract translation: 发光器件封装包括：包括第一电极结构和第二电极结构的封装板; 以及安装在所述封装板上并被配置为发光的发光器件，所述发光器件包括：设置在生长衬底上的发光结构，其串联电连接，并且包括输入端子和输出端子; 分别与输入端子和输出端子电连接并与第一和第二电极结构接触的第一焊盘和第二焊盘; 以及设置在发光结构上并与发光结构电绝缘的虚拟焊盘。

公开(公告)号：US20150108520A1

公开(公告)日：2015-04-23

申请号：US14454612

申请日：2014-08-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Tae Hun KIM ,  Ki Seok KIM ,  Chan Mook LIM ,  Tae Kang KIM

IPC: H01L33/14 ,  H01L33/40 ,  H01L33/42 ,  H01L33/60

CPC classification number: H01L33/40 ,  H01L33/145 ,  H01L33/38 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48465 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor light emitting device includes a light emitting structure and first and second electrodes. The light emitting structure includes first and second conductivity type semiconductor layers and an active layer interposed therebetween. The first and second electrodes are electrically connected to the first and second conductivity type semiconductor layers. The second electrode includes a current blocking layer, a reflective part disposed on the current blocking layer, a transparent electrode layer disposed on the second conductivity type semiconductor layer, a pad electrode part disposed within a region of the current blocking layer, and at least one finger electrode part disposed at least in part on the transparent electrode layer. The transparent electrode layer can be spaced apart from the reflective part, and have an opening surrounding the reflective part. In some examples, the transparent electrode layer can further be spaced apart from the current blocking layer.

Abstract translation: 半导体发光器件包括发光结构和第一和第二电极。 发光结构包括第一和第二导电类型的半导体层和介于它们之间的有源层。 第一和第二电极电连接到第一和第二导电类型半导体层。 第二电极包括电流阻挡层，设置在电流阻挡层上的反射部分，设置在第二导电类型半导体层上的透明电极层，设置在电流阻挡层的区域内的焊盘电极部分，以及至少一个 指状电极部分至少部分地设置在透明电极层上。 透明电极层可以与反射部分间隔开，并且具有围绕反射部分的开口。 在一些示例中，透明电极层可以进一步与电流阻挡层间隔开。