摘要:
An information processing apparatus that can adjust the scrolling speed for data displayed in an application window on a display and display a visual scrolling speed indicator. When the user manipulates a mouse to request scrolling of data in a window, the display form of the mouse cursor is changed. That is, in addition to the mouse cursor, one or more speed indicators appears in the scrolling direction. The number of speed indicators which are displayed corresponds to the scrolling speed. The speed indicators are arranged from the center of the mouse cursor in the scrolling direction. A speed indicator is shaped like a small isosceles triangle, and as its vertex is facing in the scrolling direction, it is a very effective visual aid for a user. Preferably, one speed indicator is displayed for a low scrolling speed, two for a moderate scrolling speed and three for a high speed scrolling. Since the speed indicators are extended in the scrolling direction in accordance with the current scrolling speed, a user can intuitively and quantitatively comprehend the scrolling speed and direction. Since the speed indicator is displayed in the vicinity of the mouse cursor, a user does not need to remove his or her eyes from a focus point on the display screen and the continuity of the operation can be maintained.
摘要:
A method for SAC etching is provided involving a) etching a Si wafer having a nitride present thereon with a first etching gas containing a first perfluorocarbon and carbon monoxide, and b) etching the resultant Si wafer having an initially etched nitride photoresist thereon with a second etching gas containing a second perfluorocarbon in the substantial absence of carbon monoxide, wherein the etching steps a) and b) are performed at high RF power and low pressure compared to conventional processes to provide higher selectivity etching and a larger process window for SAC etching, as well as the ability to perform SAC etching and island contact etching under the same conditions with high verticality of the island contact and SAC walls.
摘要:
A method for SAC etching is provided involving a) etching a Si wafer having a nitride present thereon with a first etching gas containing a first perfluorocarbon and carbon monoxide, and b) etching the resultant Si wafer having an initially etched nitride photoresist thereon with a second etching gas containing a second perfluorocarbon in the substantial absence of carbon monoxide, wherein the etching steps a) and b) are performed at high RF power and low pressure compared to conventional processes to provide higher selectivity etching and a larger process window for SAC etching, as well as the ability to perform SAC etching and island contact etching under the same conditions with high verticality of the island contact and SAC walls.
摘要:
A flexible pipe connector which makes use of a pair of intermediate sleeves each having one end portion overlapped with and connected through a rubber-like elastic body to a connection pipe, each of said intermediate sleeves being coaxially arranged with the connection pipe and adapted to move in a fluid-tight manner in the axial direction thereof.
摘要:
A method for SAC etching is provided involving a) etching a Si wafer having a nitride present thereon with a first etching gas containing a first perfluorocarbon and carbon monoxide, and b) etching the resultant Si wafer having an initially etched nitride photoresist thereon with a second etching gas containing a second perfluorocarbon in the substantial absence of carbon monoxide, wherein the etching steps a) and b) are performed at high RF power and low pressure compared to conventional processes to provide higher selectivity etching and a larger process window for SAC etching, as well as the ability to perform SAC etching and island contact etching under the same conditions with high verticality of the island contact and SAC walls.
摘要:
A shaped electroconductive thermoplastic resin composition article having a preferable surface appearance is produced by a process including (1) mixing a matrix resinous material containing 100 parts by weight of a thermoplastic resin and, optionally, 120 parts by weight or less of a flame x retardant additive and 40 parts by weight or less of a flame retardant synergistic additive, with 1 to 15% based on the weight of the matrix resinous material, of stainless steel fibers having a length of 2.5 to 7.5 mm and adhered to each other with a thermoplastic resinous adhesive to form a number of bundles; (2) kneading the resultant mixture at an elevated temperature at which the matrix resinous material is melted and (3) shaping the kneaded mixture into a desired form, the kneading the shaping procedures being carried out so that the stainless steel fibers are uniformly dispersed in the melted matrix resinous material and the dispersed stainless steel fibers have an average length of 0.5 to 2.0 mm. The ratio of the average length of the dispersed and sheared stainless steel fibers to the length of the stainless steel fiber bundles is preferably in a range of 1/6 to 1/3.
摘要:
Provided is a metal double-layer structure in which a modified metallic member modified from a flat plate metallic member is bonded to be stuck to a plate material, manufacturing method thereof, and a method of regenerating a sputtering target using the method. The method includes the steps of: overlapping the plate material with the metallic member; inserting a rotary tool having a rotor and a probe projecting from a bottom surface of the rotor into a surface of the metallic member while rotated; bringing a distal end of the probe to a position close to a mating plane between the metallic member and the plate material to generate friction heat and stir the distal end, and moving the rotary tool to form adjacent motion tracks on the surface of the metallic member; and forming stirred areas along the mating plane to bond the metallic member and the plate material together, and modifying the metallic member into a modified metallic member.
摘要:
A plasma processing apparatus comprises a first passage opened in a top of suscepter at a peripheral area thereof, a first gas supply source for supplying heat exchange gas into a small clearance between the suscepter and a wafer through the first passage, a first vacuum pump for exhausting the clearance through the first passage, a second passage opened in the top of the suscepter at a center area thereof, a second gas supply source for supplying heat exchange gas into the clearance through the second passage, a second vacuum pump for exhausting the clearance through the second passage, and a controller for controlling the first and second gas supply sources and the first and second vacuum pumps independently of the others in such a way that backpressure caused in the second passage by the second gas supply source and vacuum pump can become lower than backpressure caused in the first passage by the first gas supply source and vacuum pump.
摘要:
A plasma processing apparatus comprises a first passage opened in a top of suscepter at a peripheral area thereof, a first gas supply source for supplying heat exchange gas into a small clearance between the suscepter and a wafer through the first passage, a first vacuum pump for exhausting the clearance through the first passage, a second passage opened in the top of the suscepter at a center area thereof, a second gas supply source for supplying heat exchange gas into the clearance through the second passage, a second vacuum pump for exhausting the clearance through the second passage, and a controller for controlling the first and second gas supply sources and the first and second vacuum pumps independently of the others in such a way that backpressure caused in the second passage by the second gas supply source and vacuum pump can become lower than backpressure caused in the first passage by the first gas supply source and vacuum pump.