公开(公告)号：US09245638B2

公开(公告)日：2016-01-26

申请号：US14216776

申请日：2014-03-17

Applicant: Silicon Storage Technology, Inc.

Inventor： Nhan Do ,  Elizabeth A. Cuevas ,  Yuri Tkachev ,  Mandana Tadayoni ,  Henry A. Om'mani

IPC: G11C16/04 ,  G11C16/26 ,  H01L27/115 ,  G11C16/14

CPC classification number: G11C16/26 ,  G11C16/0433 ,  G11C16/14 ,  H01L27/115

Abstract: A method of operating a memory cell that comprises first and second regions spaced apart in a substrate with a channel region therebetween, a floating gate disposed over the channel region and the fir region, a control gate disposed over the channel region and laterally adjacent to the floating gate with a portion disposed over the floating gate, and a coupling gate disposed over the first region and laterally adjacent to the floating gate. A method of erasing the memory cell includes applying a positive voltage to the control gate and a negative voltage to the coupling gate. A method of reading the memory cell includes applying positive voltages to the control gate, to the coupling gate, and to one of the first and second regions.

Abstract translation: 一种操作存储单元的方法，所述存储单元包括在衬底中间隔开的沟道区域中的第一和第二区域，设置在所述沟道区域和所述冷杉区域上方的浮置栅极，设置在所述沟道区域上方且横向邻近 浮动栅极，其具有设置在浮置栅极上的部分，以及耦合栅极，设置在第一区域上并且横向邻近浮动栅极。 擦除存储单元的方法包括向控制栅极施加正电压，向耦合栅极施加负电压。 读取存储单元的方法包括向控制栅极，耦合栅极以及第一和第二区域之一施加正电压。

公开(公告)号：US09793279B2

公开(公告)日：2017-10-17

申请号：US15182527

申请日：2016-06-14

Applicant: Silicon Storage Technology, Inc.

Inventor： Jeng-Wei Yang ,  Man-Tang Wu ,  Chun-Ming Chen ,  Mandana Tadayoni ,  Chien-Sheng Su ,  Nhan Do

IPC: H01L27/115 ,  H01L27/11524 ,  H01L29/423 ,  H01L21/28 ,  H01L29/788 ,  H01L29/66 ,  G11C16/26 ,  H01L27/11521

CPC classification number: H01L27/11524 ,  G11C16/26 ,  H01L21/28273 ,  H01L27/11521 ,  H01L29/42328 ,  H01L29/66825 ,  H01L29/7881 ,  H01L29/7883

Abstract: A memory device including a silicon semiconductor substrate, spaced apart source and drain regions formed in the substrate with a channel region there between, and a conductive floating gate disposed over a first portion of the channel region and a first portion of the source region. An erase gate includes a first portion that is laterally adjacent to the floating gate and over the source region, and a second portion that extends up and over the floating gate. A conductive word line gate is disposed over a second portion of the channel region. The word line gate is disposed laterally adjacent to the floating gate and includes no portion disposed over the floating gate. The thickness of insulation separating the word line gate from the second portion of the channel region is less than that of insulation separating the floating gate from the erase gate.

公开(公告)号：US20170012049A1

公开(公告)日：2017-01-12

申请号：US15182527

申请日：2016-06-14

Applicant: Silicon Storage Technology, Inc.

Inventor： Jeng-Wei Yang ,  Man-Tang Wu ,  Chun-Ming Chen ,  Mandana Tadayoni ,  Chien-Sheng Su ,  Nhan Do

IPC: H01L27/115 ,  G11C16/26 ,  H01L29/788 ,  H01L29/66 ,  H01L29/423 ,  H01L21/28

CPC classification number: H01L27/11524 ,  G11C16/26 ,  H01L21/28273 ,  H01L27/11521 ,  H01L29/42328 ,  H01L29/66825 ,  H01L29/7881 ,  H01L29/7883

Abstract: A memory device including a silicon semiconductor substrate, spaced apart source and drain regions formed in the substrate with a channel region there between, and a conductive floating gate disposed over a first portion of the channel region and a first portion of the source region. An erase gate includes a first portion that is laterally adjacent to the floating gate and over the source region, and a second portion that extends up and over the floating gate. A conductive word line gate is disposed over a second portion of the channel region. The word line gate is disposed laterally adjacent to the floating gate and includes no portion disposed over the floating gate. The thickness of insulation separating the word line gate from the second portion of the channel region is less than that of insulation separating the floating gate from the erase gate.

Abstract translation: 一种存储器件，包括硅半导体衬底，形成在衬底中的间隔开的源极和漏极区域，其间具有沟道区域，以及布置在沟道区域的第一部分和源极区域的第一部分之间的导电浮动栅极。 擦除栅极包括横向邻近浮动栅极并在源极区域上方的第一部分，以及在浮动栅极上方和上方延伸的第二部分。 导电字线栅极设置在沟道区域的第二部分上。 字线栅极横向地布置在浮动栅极附近，并且不包括设置在浮动栅极上的部分。 将字线栅极与沟道区域的第二部分分开的绝缘层的厚度小于将浮栅与擦除栅极分开的绝缘层的厚度。

公开(公告)号：US20160086962A1

公开(公告)日：2016-03-24

申请号：US14491596

申请日：2014-09-19

Applicant: Silicon Storage Technology, Inc.

Inventor： Chien-Sheng Su ,  Hieu Van Tran ,  Mandana Tadayoni ,  Nhan Do ,  Jeng-Wei Yang

IPC: H01L27/115 ,  H01L21/762 ,  H01L29/423 ,  H01L21/306 ,  H01L29/66 ,  H01L29/06

CPC classification number: H01L27/11531 ,  H01L21/28273 ,  H01L21/30604 ,  H01L21/76224 ,  H01L21/7624 ,  H01L27/11521 ,  H01L27/11534 ,  H01L27/1207 ,  H01L29/0649 ,  H01L29/42328 ,  H01L29/66825

Abstract: A method of forming a semiconductor device starts with a substrate of silicon, a first insulation layer on the silicon, and a silicon layer on the first insulation layer. The silicon layer and the insulation layer are removed just from a second substrate area. A second insulation layer is formed over the silicon layer in the substrate first area and over the silicon in the second substrate area. A first plurality of trenches is formed in the first substrate area that each extends through all the layers and into the silicon. A second plurality of trenches is formed in the second substrate area that each extends through the second insulation layer and into the silicon. An insulation material is formed in the first and second trenches. Logic devices are formed in the first substrate area, and memory cells are formed in the second substrate area.

Abstract translation: 形成半导体器件的方法从硅衬底，硅上的第一绝缘层和第一绝缘层上的硅层开始。 仅从第二衬底区域去除硅层和绝缘层。 第二绝缘层形成在衬底第一区域中的硅层之上并且在第二衬底区域中的硅上方。 第一多个沟槽形成在第一衬底区域中，每个沟槽延伸穿过所有层并进入硅中。 第二多个沟槽形成在第二衬底区域中，每个沟槽延伸穿过第二绝缘层并进入硅中。 绝缘材料形成在第一和第二沟槽中。 逻辑器件形成在第一衬底区域中，并且存储器单元形成在第二衬底区域中。

公开(公告)号：US20160225878A1

公开(公告)日：2016-08-04

申请号：US15091202

申请日：2016-04-05

Applicant: Silicon Storage Technology, Inc.

Inventor： Willem-Jan Toren ,  Xian Liu ,  Gerhard Metzger-Brueckl ,  Nhan Do ,  Stephan Wege ,  Nadia Miridi ,  Chieng-Sheng Su ,  Cecile Bernardi ,  Liz Cuevas ,  Florence Guyot ,  Yueh-Hsin Chen ,  Henry Om'mani ,  Mandana Tadayoni

IPC: H01L29/66 ,  H01L21/28

CPC classification number: H01L29/66545 ,  H01L21/28273 ,  H01L21/28282 ,  H01L21/76283 ,  H01L27/11521 ,  H01L27/11568

Abstract: A stack gate structure for a non-volatile memory array has a semiconductor substrate having a plurality of substantially parallel spaced apart active regions, with each active region having an axis in a first direction. A first insulating material is between each stack gate structure in the second direction perpendicular to the first direction. Each stack gate structure has a second insulating material over the active region, a charge holding gate over the second insulating material, a third insulating material over the charge holding gate, and a first portion of a control gate over the third insulating material. A second portion of the control gate is over the first portion of the control gate and over the first insulating material adjacent thereto and extending in the second direction. A fourth insulating material is over the second portion of the control gate.

Abstract translation: 用于非易失性存储器阵列的堆叠栅极结构具有半导体衬底，该半导体衬底具有多个基本上平行的间隔开的有源区，每个有源区具有沿第一方向的轴。 在垂直于第一方向的第二方向上，第一绝缘材料位于每个堆叠栅极结构之间。 每个堆叠栅极结构在有源区域上具有第二绝缘材料，在第二绝缘材料上方的电荷保持栅极，电荷保持栅极上方的第三绝缘材料以及位于第三绝缘材料上的控制栅极的第一部分。 控制栅极的第二部分在控制栅极的第一部分之上，并且与第一部分相邻并且在第二方向上延伸。 第四绝缘材料位于控制栅极的第二部分之上。

公开(公告)号：US20140084367A1

公开(公告)日：2014-03-27

申请号：US13974936

申请日：2013-08-23

Applicant: Silicon Storage Technology, Inc.

Inventor： Chien-Sheng Su ,  Mandana Tadayoni ,  Yueh-Hsin Chen

IPC: H01L29/78 ,  H01L29/66

CPC classification number: H01L29/66492 ,  H01L21/265 ,  H01L29/6653 ,  H01L29/6656 ,  H01L29/66575 ,  H01L29/6659 ,  H01L29/7833

Abstract: A transistor and method of making same include a substrate, a conductive gate over the substrate and a channel region in the substrate under the conductive gate. First and second insulating spacers are laterally adjacent to first and second sides of the conductive gate. A source region in the substrate is adjacent to but laterally spaced from the first side of the conductive gate and the first spacer, and a drain region in the substrate is adjacent to but laterally spaced apart from the second side of the conductive gate and the second spacer. First and second LD regions are in the substrate and laterally extend between the channel region and the source or drain regions respectively, each with a portion thereof not disposed under the first and second spacers nor under the conductive gate, and each with a dopant concentration less than that of the source or drain regions.

Abstract translation: 晶体管及其制造方法包括衬底，衬底上的导电栅极和导电栅极下的衬底中的沟道区。 第一和第二绝缘间隔件横向邻近导电栅极的第一和第二侧。 衬底中的源极区域与导电栅极和第一间隔物的第一侧相邻但是横向间隔开，并且衬底中的漏极区域与导电栅极的第二侧相邻但横向间隔开，并且第二 间隔 第一LD区域和第二LD区域分别位于衬底中并分别在沟道区域和源极或漏极区域之间横向延伸，每个区域的一部分没有设置在第一和第二间隔物之下，也不设置在导电栅极之下，并且每个具有掺杂剂浓度 比源区或漏区。

公开(公告)号：US09634020B1

公开(公告)日：2017-04-25

申请号：US15225425

申请日：2016-08-01

Applicant: Silicon Storage Technology, Inc.

Inventor： Chien Sheng Su ,  Mandana Tadayoni ,  Nhan Do

IPC: H01L27/115 ,  H01L21/762 ,  H01L27/11521 ,  H01L21/84 ,  H01L21/02 ,  H01L21/28 ,  H01L29/08 ,  H01L29/423 ,  H01L29/49 ,  H01L29/66 ,  H01L27/11534 ,  H01L27/11531

CPC classification number: H01L27/11521 ,  H01L21/02532 ,  H01L21/02634 ,  H01L21/28035 ,  H01L21/28273 ,  H01L21/76283 ,  H01L21/84 ,  H01L27/11531 ,  H01L27/11534 ,  H01L27/11536 ,  H01L27/1203 ,  H01L29/0847 ,  H01L29/42328 ,  H01L29/4916 ,  H01L29/66825 ,  H01L29/7881

Abstract: A method of forming a semiconductor device with memory cells and logic devices on the same silicon-on-insulator substrate. The method includes providing a substrate that includes silicon, a first insulation layer directly over the silicon, and a silicon layer directly over the first insulation layer. Silicon is epitaxially grown on the silicon layer in a first (memory) area of the substrate and not in a second (logic device) area of the substrate such that the silicon layer is thicker in the first area of the substrate relative to the second area of the substrate. Memory cells are formed in the first area of the substrate, and logic devices are formed in the second area of the substrate.

公开(公告)号：US09306039B2

公开(公告)日：2016-04-05

申请号：US14665079

申请日：2015-03-23

Applicant: Silicon Storage Technology, Inc.

Inventor： Mandana Tadayoni ,  Nhan Do

IPC: H01L21/336 ,  H01L29/66 ,  H01L29/788 ,  H01L29/423 ,  H01L29/778 ,  H01L21/28 ,  H01L27/115 ,  H01L29/78

CPC classification number: H01L29/66825 ,  H01L21/28273 ,  H01L27/11521 ,  H01L27/11524 ,  H01L29/1054 ,  H01L29/42324 ,  H01L29/42328 ,  H01L29/66484 ,  H01L29/7781 ,  H01L29/7849 ,  H01L29/788

Abstract: A memory device, and method of make same, having a substrate of semiconductor material of a first conductivity type, first and second spaced-apart regions in the substrate of a second conductivity type, with a channel region in the substrate therebetween, a conductive floating gate over and insulated from the substrate, wherein the floating gate is disposed at least partially over the first region and a first portion of the channel region, a conductive second gate laterally adjacent to and insulated from the floating gate, wherein the second gate is disposed at least partially over and insulated from a second portion of the channel region, and a stressor region of embedded silicon carbide formed in the substrate underneath the second gate.

Abstract translation: 一种存储器件及其制造方法，具有第一导电类型的半导体材料的衬底，第二导电类型的衬底中的第一和第二间隔开的区域，衬底中的沟道区域，导电浮动 栅极覆盖并与衬底绝缘，其中浮置栅极至少部分地布置在第一区域和通道区域的第一部分之上，导电第二栅极横向邻近并与浮动栅极绝缘，其中第二栅极被布置 至少部分地覆盖并与沟道区的第二部分绝缘，以及形成在第二栅极下方的衬底中的嵌入碳化硅的应力区域。

公开(公告)号：US20150200278A1

公开(公告)日：2015-07-16

申请号：US14665079

申请日：2015-03-23

Applicant: Silicon Storage Technology, Inc.

Inventor： Mandana Tadayoni ,  Nhan Do

IPC: H01L29/66 ,  H01L29/78

CPC classification number: H01L29/66825 ,  H01L21/28273 ,  H01L27/11521 ,  H01L27/11524 ,  H01L29/1054 ,  H01L29/42324 ,  H01L29/42328 ,  H01L29/66484 ,  H01L29/7781 ,  H01L29/7849 ,  H01L29/788

Abstract: A memory device, and method of make same, having a substrate of semiconductor material of a first conductivity type, first and second spaced-apart regions in the substrate of a second conductivity type, with a channel region in the substrate therebetween, a conductive floating gate over and insulated from the substrate, wherein the floating gate is disposed at least partially over the first region and a first portion of the channel region, a conductive second gate laterally adjacent to and insulated from the floating gate, wherein the second gate is disposed at least partially over and insulated from a second portion of the channel region, and a stressor region of embedded silicon carbide formed in the substrate underneath the second gate.

Abstract translation: 一种存储器件及其制造方法，具有第一导电类型的半导体材料的衬底，第二导电类型的衬底中的第一和第二间隔开的区域，衬底中的沟道区域，导电浮动 栅极覆盖并与衬底绝缘，其中浮置栅极至少部分地布置在第一区域和通道区域的第一部分之上，导电第二栅极横向邻近并与浮动栅极绝缘，其中第二栅极被布置 至少部分地覆盖并与沟道区的第二部分绝缘，以及形成在第二栅极下方的衬底中的嵌入碳化硅的应力区域。

公开(公告)号：US09570581B2

公开(公告)日：2017-02-14

申请号：US15091202

申请日：2016-04-05

Applicant: Silicon Storage Technology, Inc.

Inventor： Willem-Jan Toren ,  Xian Liu ,  Gerhard Metzger-Brueckl ,  Nhan Do ,  Stephan Wege ,  Nadia Miridi ,  Chieng-Sheng Su ,  Cecile Bernardi ,  Liz Cuevas ,  Florence Guyot ,  Yueh-Hsin Chen ,  Henry Om'mani ,  Mandana Tadayoni

IPC: H01L29/788 ,  H01L29/66 ,  H01L21/28 ,  H01L27/115 ,  H01L21/762

CPC classification number: H01L29/66545 ,  H01L21/28273 ,  H01L21/28282 ,  H01L21/76283 ,  H01L27/11521 ,  H01L27/11568

Abstract: A stack gate structure for a non-volatile memory array has a semiconductor substrate having a plurality of substantially parallel spaced apart active regions, with each active region having an axis in a first direction. A first insulating material is between each stack gate structure in the second direction perpendicular to the first direction. Each stack gate structure has a second insulating material over the active region, a charge holding gate over the second insulating material, a third insulating material over the charge holding gate, and a first portion of a control gate over the third insulating material. A second portion of the control gate is over the first portion of the control gate and over the first insulating material adjacent thereto and extending in the second direction. A fourth insulating material is over the second portion of the control gate.

Abstract translation: 用于非易失性存储器阵列的堆叠栅极结构具有半导体衬底，该半导体衬底具有多个基本上平行的间隔开的有源区，每个有源区具有沿第一方向的轴。 在垂直于第一方向的第二方向上，第一绝缘材料位于每个堆叠栅极结构之间。 每个堆叠栅极结构在有源区域上具有第二绝缘材料，在第二绝缘材料上方的电荷保持栅极，电荷保持栅极上方的第三绝缘材料以及位于第三绝缘材料上的控制栅极的第一部分。 控制栅极的第二部分在控制栅极的第一部分之上，并且与第一部分相邻并且在第二方向上延伸。 第四绝缘材料位于控制栅极的第二部分之上。