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公开(公告)号：US10309587B2
公开(公告)日：2019-06-04
申请号：US13886878
申请日：2013-05-03
申请人： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac , Stanton Earl Weaver, Jr. , Thomas F. Soules
发明人： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac , Stanton Earl Weaver, Jr. , Thomas F. Soules
IPC分类号： F21K9/64 , F21K9/68 , F21V13/08 , H01L33/46 , H01L33/50 , H01L33/58 , H01L33/60 , F21Y105/10 , F21Y115/10
摘要： In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
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公开(公告)号：US20180080614A9
公开(公告)日：2018-03-22
申请号：US13886878
申请日：2013-05-03
申请人： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac , Stanton Earl Weaver, JR. , Thomas F. Soules
发明人： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac , Stanton Earl Weaver, JR. , Thomas F. Soules
CPC分类号： F21K9/64 , F21K9/68 , F21V13/08 , F21Y2105/10 , F21Y2115/10 , H01L33/46 , H01L33/505 , H01L33/507 , H01L33/508 , H01L33/58 , H01L33/60 , H01L2224/48091 , H01L2224/48227 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
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公开(公告)号：US10340424B2
公开(公告)日：2019-07-02
申请号：US14062169
申请日：2013-10-24
申请人： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
发明人： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
摘要： In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
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公开(公告)号：US07800121B2
公开(公告)日：2010-09-21
申请号：US11312268
申请日：2005-12-20
申请人： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
发明人： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
IPC分类号： H01L29/22 , H01L29/227 , H01L27/15 , H01L29/267 , H01L29/24
CPC分类号： H01L25/0753 , F21K9/68 , F21V23/00 , H01L33/507 , H01L2224/48091 , H01L2924/01322 , H01L2924/00 , H01L2924/00014
摘要： In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
摘要翻译： 在照明封装中，印刷电路板支撑至少一个发光管芯。 透光罩设置在至少一个发光管芯上。 荧光体设置在透光圆顶盖的内部或内部。 荧光体响应于至少一个发光管芯的照射而输出转换的光。 密封剂基本上填充由透光盖和印刷电路板限定的内部空间。
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公开(公告)号：US20140049965A1
公开(公告)日：2014-02-20
申请号：US14062169
申请日：2013-10-24
申请人： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
发明人： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
CPC分类号： H01L33/44 , F21K9/64 , H01L25/0753 , H01L33/501 , H01L33/502 , H01L33/507 , H01L33/54 , H01L2224/48091 , H01L2924/00014
摘要： In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
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公开(公告)号：US20110018014A1
公开(公告)日：2011-01-27
申请号：US12884717
申请日：2010-09-17
申请人： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
发明人： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
CPC分类号： H01L25/0753 , F21K9/68 , F21V23/00 , H01L33/507 , H01L2224/48091 , H01L2924/01322 , H01L2924/00 , H01L2924/00014
摘要： In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially tills an interior volume defined by the light-transmissive cover and the printed circuit board.
摘要翻译： 在照明封装中，印刷电路板支撑至少一个发光管芯。 透光罩设置在至少一个发光管芯上。 荧光体设置在透光圆顶盖的内部或内部。 荧光体响应于至少一个发光管芯的照射而输出转换的光。 密封剂基本上覆盖由透光盖和印刷电路板限定的内部空间。
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公开(公告)号：US08362695B2
公开(公告)日：2013-01-29
申请号：US12884612
申请日：2010-09-17
申请人： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
发明人： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
IPC分类号： H01J1/62
CPC分类号： H01L25/0753 , F21K9/68 , F21V23/00 , H01L33/507 , H01L2224/48091 , H01L2924/01322 , H01L2924/00 , H01L2924/00014
摘要： In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
摘要翻译： 在照明封装中，印刷电路板支撑至少一个发光管芯。 透光罩设置在至少一个发光管芯上。 荧光体设置在透光圆顶盖的内部或内部。 荧光体响应于至少一个发光管芯的照射而输出转换的光。 密封剂基本上填充由透光盖和印刷电路板限定的内部空间。
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公开(公告)号：US20140328046A1
公开(公告)日：2014-11-06
申请号：US13886878
申请日：2013-05-03
申请人： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
发明人： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
CPC分类号： F21K9/64 , F21K9/68 , F21V13/08 , F21Y2105/10 , F21Y2115/10 , H01L33/46 , H01L33/505 , H01L33/507 , H01L33/508 , H01L33/58 , H01L33/60 , H01L2224/48091 , H01L2224/48227 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
摘要翻译： 在照明封装中，印刷电路板支撑至少一个发光管芯。 透光罩设置在至少一个发光管芯上。 荧光体设置在透光圆顶盖的内部或内部。 荧光体响应于至少一个发光管芯的照射而输出转换的光。 密封剂基本上填充由透光盖和印刷电路板限定的内部空间。
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公开(公告)号：US08436380B2
公开(公告)日：2013-05-07
申请号：US12884717
申请日：2010-09-17
申请人： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
发明人： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
IPC分类号： H01L29/22 , H01L29/227 , H01L27/15 , H01L29/267 , H01L29/24
CPC分类号： H01L25/0753 , F21K9/68 , F21V23/00 , H01L33/507 , H01L2224/48091 , H01L2924/01322 , H01L2924/00 , H01L2924/00014
摘要： In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially tills an interior volume defined by the light-transmissive cover and the printed circuit board.
摘要翻译： 在照明封装中，印刷电路板支撑至少一个发光管芯。 透光罩设置在至少一个发光管芯上。 荧光体设置在透光圆顶盖的内部或内部。 荧光体响应于至少一个发光管芯的照射而输出转换的光。 密封剂基本上覆盖由透光盖和印刷电路板限定的内部空间。
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公开(公告)号：US20110001422A1
公开(公告)日：2011-01-06
申请号：US12884612
申请日：2010-09-17
申请人： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
发明人： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
IPC分类号： H01J1/62
CPC分类号： H01L25/0753 , F21K9/68 , F21V23/00 , H01L33/507 , H01L2224/48091 , H01L2924/01322 , H01L2924/00 , H01L2924/00014
摘要： In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
摘要翻译： 在照明封装中，印刷电路板支撑至少一个发光管芯。 透光罩设置在至少一个发光管芯上。 荧光体设置在透光圆顶盖的内部或内部。 荧光体响应于至少一个发光管芯的照射而输出转换的光。 密封剂基本上填充由透光盖和印刷电路板限定的内部空间。
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