公开(公告)号：US20050090040A1

公开(公告)日：2005-04-28

申请号：US10994995

申请日：2004-11-22

Applicant: Phil Geng ,  Stephen Joy

Inventor： Phil Geng ,  Stephen Joy

IPC: H05K3/42 ,  H01L23/12 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H05K3/3436 ,  H01L2224/81 ,  H05K1/113 ,  H05K3/0094 ,  H05K2201/0959 ,  H05K2201/10734 ,  H05K2203/1178 ,  Y02P70/613

Abstract: The electrical contacts, such as ball grid array (BGA) solder balls, of an integrated circuit (IC) are coupled to printed circuit board (PCB) bonding pads that include vias. According to an embodiment of an electronic assembly, the vias are formed off-center, so as to inhibit bridging between adjacent solder balls during a solder reflow operation by minimizing the effect of solder ball ballooning resulting from outgassing of a thermally expansive substance, such as a volatile organic compound (VOC) from the via channels. The bonding pads are separated into two groups, each having vias offset in a different direction, so that asymmetric surface tension forces in the molten solder during a solder reflow operation do not cause the IC to slide to one side. A substrate, an electronic assembly, an electronic system, and fabrication methods are also described.

Abstract translation: 诸如集成电路（IC）的球栅阵列（BGA）焊球的电触点耦合到包括通孔的印刷电路板（PCB）接合焊盘。 根据电子组件的实施例，过孔形成通孔，以便在焊料回流操作期间通过最小化由放热热膨胀物质引起的焊球膨胀的影响来抑制相邻焊球之间的桥接，例如 来自通道的挥发性有机化合物（VOC）。 接合焊盘被分成两组，每组具有沿不同方向偏移的通孔，使得在回流焊接操作期间熔融焊料中的不对称表面张力不会导致IC滑到一侧。 还描述了基板，电子组件，电子系统和制造方法。

公开(公告)号：US20050286238A1

公开(公告)日：2005-12-29

申请号：US10875964

申请日：2004-06-24

Applicant: Stephen Joy

Inventor： Stephen Joy

IPC: H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K1/184 ,  H05K3/308 ,  H05K3/3447 ,  H05K3/4046 ,  H05K2201/092 ,  H05K2201/09645 ,  H05K2201/09809 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10242 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/1081 ,  H05K2201/10893 ,  H05K2203/1115 ,  H05K2203/1189

Abstract: An interconnection structure for coupling conductive layers of a circuit board includes a pin configured to be press-fitted in an aperture traversing the circuit board, to electrically couple the conductive traces. The pin may be placed in a predrilled aperture, or driven into the circuit board, forming the aperture thereby. The pin may also be configured as a punch, removing a plug of material as it is driven therethrough. The pin may comprise a capacitive or resistive region configured to capacitively or resistively couple the first and second traces. The pin may be configured such that capacitive or resistive values are selectable according to a depth to which the pin is positioned in the aperture. The pin may serve as an offset post for mounting the circuit board to a chassis. In such a case, the pin may be provided with a longitudinal aperture configured to receive a threaded screw.

Abstract translation: 用于耦合电路板的导电层的互连结构包括被配置成压配合在穿过电路板的孔中的引脚，用于电连接导电迹线。 销可以放置在预钻孔中，或者被驱动到电路板中，从而形成孔。 该销还可以被配置为冲头，当其被驱动通过其时移除材料塞。 引脚可以包括被配置为电容地或电阻地耦合第一和第二迹线的电容或电阻区域。 引脚可以被配置为使得电容或电阻值可根据销定位在孔中的深度来选择。 该引脚可以用作将电路板安装到底盘的偏移柱。 在这种情况下，销可以设置有构造成接收螺纹螺钉的纵向孔。