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公开(公告)号：US20090301775A1
公开(公告)日：2009-12-10
申请号：US12461576
申请日：2009-08-17
IPC分类号： H05K5/00
CPC分类号： H05K1/0271 , H05K1/0219 , H05K1/028 , H05K1/148 , H05K2201/09063 , H05K2201/09236 , H05K2201/09563 , H05K2201/09809
摘要： A wired circuit board has an insulating layer extending in a longitudinal direction, a conductive layer having a plurality of signal wirings covered with the insulating layer and arranged in mutually spaced-apart and parallel relation in a perpendicular direction to the longitudinal direction and a thickness direction of the insulating layer, and connecting terminals provided on both longitudinal ends of each of the signal wirings and exposed from the insulating layer, and a ground layer covered with the insulating layer and formed to surround each of the signal wirings in a perpendicular direction to the longitudinal direction. A slit along the longitudinal direction is formed between each of the signal wirings in the insulating layer.
摘要翻译： 布线电路板具有沿纵向方向延伸的绝缘层，导电层具有覆盖有绝缘层的多个信号布线，并且沿垂直于纵向的方向以相互间隔开的平行关系布置，厚度方向 的绝缘层，以及设置在每个信号布线的两个纵向端并从绝缘层露出的连接端子，以及覆盖有绝缘层的接地层，并且形成为围绕每个信号布线沿垂直于 纵向。 在绝缘层中的每个信号布线之间形成沿着纵向的狭缝。
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公开(公告)号：US08022308B2
公开(公告)日：2011-09-20
申请号：US11902553
申请日：2007-09-24
IPC分类号： H05K1/00
CPC分类号： H05K1/0271 , H05K1/0219 , H05K1/028 , H05K1/148 , H05K2201/09063 , H05K2201/09236 , H05K2201/09563 , H05K2201/09809
摘要： A wired circuit board has an insulating layer extending in a longitudinal direction, a conductive layer having a plurality of signal wirings covered with the insulating layer and arranged in mutually spaced-apart and parallel relation in a perpendicular direction to the longitudinal direction and a thickness direction of the insulating layer, and connecting terminals provided on both longitudinal ends of each of the signal wirings and exposed from the insulating layer, and a ground layer covered with the insulating layer and formed to surround each of the signal wirings in a perpendicular direction to the longitudinal direction. A slit along the longitudinal direction is formed between each of the signal wirings in the insulating layer.
摘要翻译： 布线电路板具有沿纵向方向延伸的绝缘层，导电层具有覆盖有绝缘层的多个信号布线，并且沿垂直于纵向的方向以相互间隔开的平行关系布置，厚度方向 的绝缘层，以及设置在每个信号布线的两个纵向端并从绝缘层露出的连接端子，以及覆盖有绝缘层的接地层，并且形成为围绕每个信号布线沿垂直于 纵向。 在绝缘层中的每个信号布线之间形成沿着纵向的狭缝。
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公开(公告)号：US07569773B2
公开(公告)日：2009-08-04
申请号：US11902556
申请日：2007-09-24
IPC分类号： H01B7/08
CPC分类号： H05K1/0221 , H05K1/117 , H05K3/4644 , H05K2201/09236 , H05K2201/09481 , H05K2201/09809 , H05K2203/0733
摘要： A wired circuit board has a plurality of insulating layers, a conductive layer having a signal wiring extending in a longitudinal direction which is covered with the insulating layers, and a signal connecting terminal provided on a longitudinal end of the signal wiring and exposed from the insulating layers, and a ground layer having a ground wiring covered with the insulating layers and formed to surround the signal wiring in a perpendicular direction to the longitudinal direction, and a ground connecting terminal provided on a longitudinal end of the ground wiring and exposed from the insulating layers. The signal connecting terminal and the ground connecting terminal are formed on an upper surface of the same insulating layer among the plurality of the insulating layers.
摘要翻译： 布线电路板具有多个绝缘层，导电层具有沿纵向方向延伸并被绝缘层覆盖的信号布线，以及信号连接端子，设置在信号布线的纵向端并从绝缘层 以及接地层，其具有覆盖有绝缘层的接地布线，并且形成为围绕与纵向方向垂直的方向的信号布线;以及接地端子，其设置在接地布线的纵向端部并从绝缘体 层。 信号连接端子和接地连接端子形成在多个绝缘层中的相同绝缘层的上表面上。
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公开(公告)号：US20080078573A1
公开(公告)日：2008-04-03
申请号：US11902553
申请日：2007-09-24
IPC分类号： H01R12/04
CPC分类号： H05K1/0271 , H05K1/0219 , H05K1/028 , H05K1/148 , H05K2201/09063 , H05K2201/09236 , H05K2201/09563 , H05K2201/09809
摘要： A wired circuit board has an insulating layer extending in a longitudinal direction, a conductive layer having a plurality of signal wirings covered with the insulating layer and arranged in mutually spaced-apart and parallel relation in a perpendicular direction to the longitudinal direction and a thickness direction of the insulating layer, and connecting terminals provided on both longitudinal ends of each of the signal wirings and exposed from the insulating layer, and a ground layer covered with the insulating layer and formed to surround each of the signal wirings in a perpendicular direction to the longitudinal direction. A slit along the longitudinal direction is formed between each of the signal wirings in the insulating layer.
摘要翻译： 布线电路板具有沿纵向方向延伸的绝缘层，导电层具有覆盖有绝缘层的多个信号布线，并且沿垂直于纵向的方向以相互间隔开的平行关系布置，厚度方向 的绝缘层，以及设置在每个信号布线的两个纵向端并从绝缘层露出的连接端子，以及覆盖有绝缘层的接地层，并且形成为围绕每个信号布线沿垂直于 纵向。 在绝缘层中的每个信号布线之间形成沿着纵向的狭缝。
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5.发明授权公开(公告)号：US08434223B2
公开(公告)日：2013-05-07
申请号：US13487435
申请日：2012-06-04
IPC分类号： H01R43/00
CPC分类号： G11B25/043 , G11B33/1406 , G11B33/1426 , H01L23/367 , H01L23/3735 , H01L2924/0002 , H05K1/0203 , H05K1/056 , H05K2201/056 , H05K2203/302 , Y10T29/49124 , Y10T29/49169 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49222 , Y10T428/24273 , H01L2924/00
摘要： A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.
摘要翻译： 用于安装前置放大器芯片的基板，使用由导电材料制成的加强层制造; 设置在基板的电路区域上的绝缘层; 由绝缘层上提供的导电材料制成的电路; 以及作为在其上设置有绝缘层的加强层的延伸部的翼片。 制造折片以折叠前置放大器芯片以从中去除热量。
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公开(公告)号：US08213125B2
公开(公告)日：2012-07-03
申请号：US13214120
申请日：2011-08-19
IPC分类号： G11B5/55
CPC分类号： G11B25/043 , G11B33/1406 , G11B33/1426 , H01L23/367 , H01L23/3735 , H01L2924/0002 , H05K1/0203 , H05K1/056 , H05K2201/056 , H05K2203/302 , Y10T29/49124 , Y10T29/49169 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49222 , Y10T428/24273 , H01L2924/00
摘要： A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.
摘要翻译： 用于安装前置放大器芯片的基板，使用由导电材料制成的加强层制造; 设置在基板的电路区域上的绝缘层; 由绝缘层上提供的导电材料制成的电路; 以及作为在其上设置有绝缘层的加强层的延伸部的翼片。 制造折片以折叠前置放大器芯片以从中去除热量。
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公开(公告)号：US20080088977A1
公开(公告)日：2008-04-17
申请号：US11548681
申请日：2006-10-11
IPC分类号： G11B5/55
CPC分类号： G11B25/043 , G11B33/1406 , G11B33/1426 , H01L23/367 , H01L23/3735 , H01L2924/0002 , H05K1/0203 , H05K1/056 , H05K2201/056 , H05K2203/302 , Y10T29/49124 , Y10T29/49169 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49222 , Y10T428/24273 , H01L2924/00
摘要： A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.
摘要翻译： 用于安装前置放大器芯片的基板，使用由导电材料制成的加强层制造; 设置在基板的电路区域上的绝缘层; 由绝缘层上提供的导电材料制成的电路; 以及作为在其上设置有绝缘层的加强层的延伸部的翼片。 制造折片以折叠前置放大器芯片以从中去除热量。
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公开(公告)号：US20120008227A1
公开(公告)日：2012-01-12
申请号：US13214120
申请日：2011-08-19
CPC分类号： G11B25/043 , G11B33/1406 , G11B33/1426 , H01L23/367 , H01L23/3735 , H01L2924/0002 , H05K1/0203 , H05K1/056 , H05K2201/056 , H05K2203/302 , Y10T29/49124 , Y10T29/49169 , Y10T29/49204 , Y10T29/49208 , Y10T29/4921 , Y10T29/49222 , Y10T428/24273 , H01L2924/00
摘要： A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.
摘要翻译： 用于安装前置放大器芯片的基板，使用由导电材料制成的加强层制造; 设置在基板的电路区域上的绝缘层; 由绝缘层上提供的导电材料制成的电路; 以及作为在其上设置有绝缘层的加强层的延伸部的翼片。 制造折片以折叠前置放大器芯片以从中去除热量。
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9.发明申请Connecting configuration for flexible wired circuit board and electronic device 失效柔性布线电路板和电子设备的连接配置公开(公告)号：US20080182435A1
公开(公告)日：2008-07-31
申请号：US12010177
申请日：2008-01-22
申请人： Voon Yee Ho , Szu-Han Hu
发明人： Voon Yee Ho , Szu-Han Hu
IPC分类号： H01R12/00
CPC分类号： H01R35/025 , H05K1/028 , H05K1/0281 , H05K2201/051 , H05K2201/09781 , H05K2201/2009
摘要： A connecting configuration for a flexible wired circuit board includes a first terminal member, a second terminal member, and a flexible wired circuit board having a conductive pattern for electrically connecting the first terminal member and the second terminal member. The first terminal member and the second terminal member are provided such that at least one of the terminal members is linearly movable to be adjacent to and apart from the other terminal member. The flexible wired circuit board is provided to be wound or twisted in the middle of the moving direction.
摘要翻译： 柔性布线电路板的连接结构包括第一端子构件，第二端子构件和具有用于电连接第一端子构件和第二端子构件的导电图案的柔性布线电路板。 第一端子构件和第二端子构件被设置成使得端子构件中的至少一个可线性地移动以与另一个端子构件相邻并分开。 柔性布线电路板被设置为在移动方向的中间被卷绕或扭曲。
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10.发明授权Connecting configuration for flexible wired circuit board and electronic device 失效柔性布线电路板和电子设备的连接配置公开(公告)号：US07641488B2
公开(公告)日：2010-01-05
申请号：US12010177
申请日：2008-01-22
申请人： Voon Yee Ho , Szu-Han Hu
发明人： Voon Yee Ho , Szu-Han Hu
IPC分类号： H01R3/00
CPC分类号： H01R35/025 , H05K1/028 , H05K1/0281 , H05K2201/051 , H05K2201/09781 , H05K2201/2009
摘要： A connecting configuration for a flexible wired circuit board includes a first terminal member, a second terminal member, and a flexible wired circuit board having a conductive pattern for electrically connecting the first terminal member and the second terminal member. The first terminal member and the second terminal member are provided such that at least one of the terminal members is linearly movable to be adjacent to and apart from the other terminal member. The flexible wired circuit board is provided to be wound or twisted in the middle of the moving direction.
摘要翻译： 柔性布线电路板的连接结构包括第一端子构件，第二端子构件和具有用于电连接第一端子构件和第二端子构件的导电图案的柔性布线电路板。 第一端子构件和第二端子构件被设置成使得端子构件中的至少一个可线性地移动以与另一个端子构件相邻并分开。 柔性布线电路板被设置为在移动方向的中间被卷绕或扭曲。
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