公开(公告)号：US10600724B2

公开(公告)日：2020-03-24

申请号：US15151177

申请日：2016-05-10

Applicant: Texas Instruments Incorporated

Inventor： Chia-Yu Chang ,  Chih-Chien Ho ,  Steven Su

IPC: H01L23/495 ,  G06F17/50 ,  H01L23/00 ,  H01L23/31

Abstract: A leadframe includes a first die attach pad (“DAP”) having a first longitudinally extending edge surface and a second DAP having a first longitudinally extending edge surface. The second DAP is positioned with the first longitudinally extending edge surface thereof in adjacent, laterally and vertically spaced relationship with the first longitudinally extending edge surface of the first DAP.

公开(公告)号：US09922908B2

公开(公告)日：2018-03-20

申请号：US14973927

申请日：2015-12-18

Applicant: Texas Instruments Incorporated

Inventor： Chia-Yu Chang ,  Chih-Chien Ho ,  Steven Su

IPC: H01L23/495 ,  H01L21/00 ,  H05K7/18 ,  H01L23/31 ,  H01L23/13 ,  H01L23/00

CPC classification number: H01L23/49551 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3157 ,  H01L23/49503 ,  H01L23/49517 ,  H01L23/4952 ,  H01L23/49534 ,  H01L23/49575 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/00

Abstract: A leadframe (100) comprises a frame (101) of sheet metal in a first planar level, where the frame has metallic leads (110) and a first metallic pad (120) extending inward from the frame, and the first pad is tied to the frame by first metallic straps (120a). The leadframe further has a second metallic pad (130) in a second planar level parallel to and spaced from the first level, where the second pad is tied by second metallic straps (132) to the frame. In addition, the leadframe has a third metallic pad (140) in a third planar level parallel to and spaced from the second level and additively from the first level, where the third pad is tied by third metallic straps (133) to the second pad.

公开(公告)号：US20170179007A1

公开(公告)日：2017-06-22

申请号：US14973927

申请日：2015-12-18

Applicant: Texas Instruments Incorporated

Inventor： Chia-Yu Chang ,  Chih-Chien Ho ,  Steven Su

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/13

CPC classification number: H01L23/49551 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3157 ,  H01L23/49503 ,  H01L23/49517 ,  H01L23/4952 ,  H01L23/49534 ,  H01L23/49575 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/00

Abstract: A leadframe (100) comprises a frame (101) of sheet metal in a first planar level, where the frame has metallic leads (110) and a first metallic pad (120) extending inward from the frame, and the first pad is tied to the frame by first metallic straps (120a). The leadframe further has a second metallic pad (130) in a second planar level parallel to and spaced from the first level, where the second pad is tied by second metallic straps (132) to the frame. In addition, the leadframe has a third metallic pad (140) in a third planar level parallel to and spaced from the second level and additively from the first level, where the third pad is tied by third metallic straps (133) to the second pad.

公开(公告)号：US20200185308A1

公开(公告)日：2020-06-11

申请号：US16788695

申请日：2020-02-12

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Chia-Yu Chang ,  Chih-Chien Ho ,  Steven Su

IPC: H01L23/495 ,  H01L23/00 ,  G06F30/394

Abstract: A leadframe includes a first die attach pad (“DAP”) having a first longitudinally extending edge surface and a second DAP having a first longitudinally extending edge surface. The second DAP is positioned with the first longitudinally extending edge surface thereof in adjacent, laterally and vertically spaced relationship with the first longitudinally extending edge surface of the first DAP.

公开(公告)号：US20180211905A1

公开(公告)日：2018-07-26

申请号：US15924767

申请日：2018-03-19

Applicant: Texas Instruments Incorporated

Inventor： Chia-Yu Chang ,  Chih-Chien Ho ,  Steven Su

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/13 ,  H01L23/00

CPC classification number: H01L23/49551 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3157 ,  H01L23/49503 ,  H01L23/49517 ,  H01L23/4952 ,  H01L23/49534 ,  H01L23/49575 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/00

Abstract: A leadframe (100) comprises a frame (101) of sheet metal in a first planar level, where the frame has metallic leads (110) and a first metallic pad (120) extending inward from the frame, and the first pad is tied to the frame by first metallic straps (120a). The leadframe further has a second metallic pad (130) in a second planar level parallel to and spaced from the first level, where the second pad is tied by second metallic straps (132) to the frame. In addition, the leadframe has a third metallic pad (140) in a third planar level parallel to and spaced from the second level and additively from the first level, where the third pad is tied by third metallic straps (131) to the second pad.

公开(公告)号：US11342247B2

公开(公告)日：2022-05-24

申请号：US16788695

申请日：2020-02-12

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Chia-Yu Chang ,  Chih-Chien Ho ,  Steven Su

IPC: H01L23/495 ,  H01L23/00 ,  G06F30/394 ,  H01L23/31

Abstract: A leadframe includes a first die attach pad (“DAP”) having a first longitudinally extending edge surface and a second DAP having a first longitudinally extending edge surface. The second DAP is positioned with the first longitudinally extending edge surface thereof in adjacent, laterally and vertically spaced relationship with the first longitudinally extending edge surface of the first DAP.

公开(公告)号：US10957631B2

公开(公告)日：2021-03-23

申请号：US16218102

申请日：2018-12-12

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Chung-Ming Cheng ,  Yuh-Harng Chien ,  Fu-Kang Lee ,  Chia-Yu Chang

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/28 ,  H01L21/48

Abstract: A leadframe comprising a plurality of leads, each of the plurality of leads having a proximal end and a distal end opposite the proximal end, the distal ends positioned along a linear axis. The leadframe further comprises a die pad closer to the proximal ends than the distal ends of the plurality of leads and including an edge positioned along a plane that intersects the linear axis at an angle less than 90 degrees.

公开(公告)号：US10211132B2

公开(公告)日：2019-02-19

申请号：US15924767

申请日：2018-03-19

Applicant: Texas Instruments Incorporated

Inventor： Chia-Yu Chang ,  Chih-Chien Ho ,  Steven Su

IPC: H01L23/495 ,  H01L21/00 ,  H05K7/18 ,  H01L23/31 ,  H01L23/13 ,  H01L23/00

Abstract: A leadframe (100) comprises a frame (101) of sheet metal in a first planar level, where the frame has metallic leads (110) and a first metallic pad (120) extending inward from the frame, and the first pad is tied to the frame by first metallic straps (120a). The leadframe further has a second metallic pad (130) in a second planar level parallel to and spaced from the first level, where the second pad is tied by second metallic straps (132) to the frame. In addition, the leadframe has a third metallic pad (140) in a third planar level parallel to and spaced from the second level and additively from the first level, where the third pad is tied by third metallic straps (131) to the second pad.

公开(公告)号：US20170330822A1

公开(公告)日：2017-11-16

申请号：US15151177

申请日：2016-05-10

Applicant: Texas Instruments Incorporated

Inventor： Chia-Yu Chang ,  Chih-Chien Ho ,  Steven Su

IPC: H01L23/495 ,  G06F17/50 ,  H01L25/065 ,  H01L23/31

Abstract: A leadframe includes a first die attach pad (“DAP”) having a first longitudinally extending edge surface and a second DAP having a first longitudinally extending edge surface. The second DAP is positioned with the first longitudinally extending edge surface thereof in adjacent, laterally and vertically spaced relationship with the first longitudinally extending edge surface of the first DAP.

公开(公告)号：US09786582B2

公开(公告)日：2017-10-10

申请号：US15010938

申请日：2016-01-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Chia-Yu Chang ,  Bob Lee ,  Steven Su

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/31 ,  H05K1/11

CPC classification number: H01L23/49503 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/15151 ,  H01L2924/15159 ,  H01L2924/00012

Abstract: A leadframe for encasing in a mold material includes a plurality of interconnected support members. A die pad is connected to the support members and includes a bottom surface. The die pad is configured to receive a die. A downset is connected to the die pad and positioned below the bottom surface. The downset includes at least one wall defining an interior volume for receiving a flow of the mold material to reduce the velocity of the mold material flow through the downset.