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    SEMICONDUCTOR DEVICE HAVING LATERAL ELEMENT
    2.
    发明申请
    SEMICONDUCTOR DEVICE HAVING LATERAL ELEMENT 有权
    具有横向元件的半导体器件

    公开(公告)号：US20130075877A1

    公开(公告)日：2013-03-28

    申请号：US13615912

    申请日：2012-09-14

    申请人： Takeshi SAKAI ,  Akira Yamada ,  Shigeki Takahashi ,  Youichi Ashida ,  Satoshi Shiraki

    发明人： Takeshi SAKAI ,  Akira Yamada ,  Shigeki Takahashi ,  Youichi Ashida ,  Satoshi Shiraki

    IPC分类号： H01L29/861

    CPC分类号： H01L29/7394 ,  H01L21/765 ,  H01L29/0696 ,  H01L29/0834 ,  H01L29/404 ,  H01L29/405 ,  H01L29/41725 ,  H01L29/8611 ,  H01L29/868

    摘要： A semiconductor device with a lateral element includes a semiconductor substrate, first and second electrodes on the substrate, and a resistive field plate extending from the first electrode to the second electrode. The lateral element passes a current between the first and second electrodes. A voltage applied to the second electrode is less than a voltage applied to the first electrode. The resistive field plate has a first end portion and a second end portion opposite to the first end portion. The second end portion is located closer to the second electrode than the first end portion. An impurity concentration in the second end portion is equal to or greater than 1×1018 cm−3.

    摘要翻译： 具有横向元件的半导体器件包括半导体衬底，衬底上的第一和第二电极以及从第一电极延伸到第二电极的电阻场板。 横向元件在第一和第二电极之间通过电流。 施加到第二电极的电压小于施加到第一电极的电压。 电阻场板具有与第一端部相对的第一端部和第二端部。 第二端部比第一端部更靠近第二电极。 第二端部的杂质浓度为1×1018cm-3以上。

    Lateral semiconductor device
    3.
    发明授权
    Lateral semiconductor device 有权
    侧面半导体器件

    公开(公告)号：US09240445B2

    公开(公告)日：2016-01-19

    申请号：US14113419

    申请日：2012-05-10

    申请人： Takashi Suzuki ,  Norihito Tokura ,  Satoshi Shiraki ,  Shigeki Takahashi ,  Youichi Ashida ,  Akira Yamada

    发明人： Takashi Suzuki ,  Norihito Tokura ,  Satoshi Shiraki ,  Shigeki Takahashi ,  Youichi Ashida ,  Akira Yamada

    IPC分类号： H01L23/62 ,  H01L29/06 ,  H01L29/40 ,  H01L29/861

    CPC分类号： H01L29/063 ,  H01L29/0692 ,  H01L29/402 ,  H01L29/404 ,  H01L29/405 ,  H01L29/861

    摘要： A lateral semiconductor device includes a semiconductor layer, an insulating layer, and a resistive field plate. The semiconductor layer includes a first semiconductor region and a second semiconductor region at a surface portion, and the second semiconductor region makes a circuit around the first semiconductor region. The insulating layer is formed on a surface of the semiconductor layer and is disposed between the first and second semiconductor regions. The resistive field plate is formed on a surface of the insulating layer. Between the first and second semiconductor regions, a first section and a second section are adjacent to each other along a circumferential direction around the first semiconductor region. The resistive field plate includes first and second resistive field plate sections respectively formed in the first and second sections, and the first and second resistive field plate sections are separated from each other.

    摘要翻译： 横向半导体器件包括半导体层，绝缘层和电阻场板。 半导体层包括在表面部分处的第一半导体区域和第二半导体区域，并且第二半导体区域在第一半导体区域周围形成电路。 绝缘层形成在半导体层的表面上并且设置在第一和第二半导体区之间。 电阻场板形成在绝缘层的表面上。 在第一和第二半导体区域之间，第一部分和第二部分沿着围绕第一半导体区域的圆周方向彼此相邻。 电阻场板包括分别形成在第一和第二部分中的第一和第二电阻场板部分，并且第一和第二电阻场板部分彼此分离。

    LATERAL SEMICONDUCTOR DEVICE
    6.
    发明申请
    LATERAL SEMICONDUCTOR DEVICE 有权
    横向半导体器件

    公开(公告)号：US20140048911A1

    公开(公告)日：2014-02-20

    申请号：US14113419

    申请日：2012-05-10

    申请人： Takashi Suzuki ,  Norihito Tokura ,  Satoshi Shiraki ,  Shigeki Takahashi ,  Youichi Ashida ,  Akira Yamada

    发明人： Takashi Suzuki ,  Norihito Tokura ,  Satoshi Shiraki ,  Shigeki Takahashi ,  Youichi Ashida ,  Akira Yamada

    IPC分类号： H01L29/06

    CPC分类号： H01L29/063 ,  H01L29/0692 ,  H01L29/402 ,  H01L29/404 ,  H01L29/405 ,  H01L29/861

    摘要： A lateral semiconductor device includes a semiconductor layer, an insulating layer, and a resistive field plate. The semiconductor layer includes a first semiconductor region and a second semiconductor region at a surface portion, and the second semiconductor region makes a circuit around the first semiconductor region. The insulating layer is formed on a surface of the semiconductor layer and is disposed between the first and second semiconductor regions. The resistive field plate is formed on a surface of the insulating layer. Between the first and second semiconductor regions, a first section and a second section are adjacent to each other along a circumferential direction around the first semiconductor region. The resistive field plate includes first and second resistive field plate sections respectively formed in the first and second sections, and the first and second resistive field plate sections are separated from each other.

    摘要翻译： 横向半导体器件包括半导体层，绝缘层和电阻场板。 半导体层包括在表面部分处的第一半导体区域和第二半导体区域，并且第二半导体区域在第一半导体区域周围形成电路。 绝缘层形成在半导体层的表面上并且设置在第一和第二半导体区之间。 电阻场板形成在绝缘层的表面上。 在第一和第二半导体区域之间，第一部分和第二部分沿着围绕第一半导体区域的圆周方向彼此相邻。 电阻场板包括分别形成在第一和第二部分中的第一和第二电阻场板部分，并且第一和第二电阻场板部分彼此分离。