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    Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device
    5.
    发明申请
    Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device 审中-公开
    用于冷却发热装置中所需热点的柔性流体输送的方法和装置

    公开(公告)号：US20050211427A1

    公开(公告)日：2005-09-29

    申请号：US10882142

    申请日：2004-06-29

    申请人： Thomas Kenny ,  Mark Munch ,  Peng Zhou ,  James Shook ,  Girish Upadhya ,  Kenneth Goodson ,  Dave Corbin

    发明人： Thomas Kenny ,  Mark Munch ,  Peng Zhou ,  James Shook ,  Girish Upadhya ,  Kenneth Goodson ,  Dave Corbin

    IPC分类号： G05D23/00

    CPC分类号： F28F3/048 ,  F28D15/0266 ,  F28F3/12 ,  F28F2260/02 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat exchanger apparatus and method of manufacturing comprising: an interface layer for cooling a heat source and configured to pass fluid therethrough, the interface layer having an appropriate thermal conductivity and a manifold layer for providing fluid to the interface layer, wherein the manifold layer is configured to achieve temperature uniformity in the heat source preferably by cooling interface hot spot regions. A plurality of fluid ports are configured to the heat exchanger such as an inlet port and outlet port, whereby the fluid ports are configured vertically and horizontally. The manifold layer circulates fluid to a predetermined interface hot spot region in the interface layer, wherein the interface hot spot region is associated with the hot spot. The heat exchanger preferably includes an intermediate layer positioned between the interface and manifold layers and optimally channels fluid to the interface hot spot region.

    摘要翻译： 一种热交换器装置和制造方法，包括：用于冷却热源并被配置为使流体通过其中的界面层，所述界面层具有适当的导热性和用于向界面层提供流体的歧管层，其中所述歧管层为 被配置为优选地通过冷却界面热点区域来实现热源中的温度均匀性。 多个流体端口被配置到诸如入口和出口的热交换器，由此流体端口被垂直和水平地配置。 歧管层将流体循环到界面层中的预定界面热点区域，其中界面热点区域与热点相关联。 热交换器优选地包括位于界面和歧管层之间的中间层，并且将流体最佳地通向界面热点区域。

    Semi-compliant joining mechanism for semiconductor cooling applications
    6.
    发明授权
    Semi-compliant joining mechanism for semiconductor cooling applications 有权
    半合规半导体冷却应用的连接机制

    公开(公告)号：US07301773B2

    公开(公告)日：2007-11-27

    申请号：US10945807

    申请日：2004-09-20

    申请人： Richard Grant Brewer ,  Paul Tsao ,  Richard Herms ,  Mark Munch ,  Mark McMaster ,  Dave Corbin

    发明人： Richard Grant Brewer ,  Paul Tsao ,  Richard Herms ,  Mark Munch ,  Mark McMaster ,  Dave Corbin

    IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

    CPC分类号： H01L23/4006 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat collection apparatus is mounted to the heat source using a gimbal plate, which includes a gimbal joint. The gimbal joint enables application of a retaining force to the heat collection apparatus as a single-point load. The retaining force is applied along a vector that is collinear to the face-centered normal vector of the thermal interface of the heat source. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of mating force directed through the gimbal joint to the heat collection device. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.

    摘要翻译： 热收集装置使用包括万向接头的万向板安装在热源上。 万向节接头可以作为单点负载将作用于吸收装置的保持力作为单点负载。 保持力沿着与热源的热界面的面心法线向量共线的矢量施加。 这导致保持力在热界面区域上的平衡和集中应用。 万向节板使用弹簧装置直接安装到电路板上。 弹簧意味着调节通过万向节接头到集热装置的配合力的量。 由于万向节关节是旋转柔性的，构成热界面的两个配合面被强制并联配合。 以这种方式，产生高性能的TIM接口。

    Semi-compliant joining mechanism for semiconductor cooling applications
    7.
    发明申请
    Semi-compliant joining mechanism for semiconductor cooling applications 有权
    半合规半导体冷却应用的连接机制

    公开(公告)号：US20050270742A1

    公开(公告)日：2005-12-08

    申请号：US10945807

    申请日：2004-09-20

    申请人： Richard Brewer ,  Paul Tsao ,  Richard Herms ,  Mark Munch ,  Mark McMaster ,  Dave Corbin

    发明人： Richard Brewer ,  Paul Tsao ,  Richard Herms ,  Mark Munch ,  Mark McMaster ,  Dave Corbin

    IPC分类号： H01L23/40 ,  H01L23/473 ,  H05K7/20

    CPC分类号： H01L23/4006 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat collection apparatus is mounted to the heat source using a gimbal plate, which includes a gimbal joint. The gimbal joint enables application of a retaining force to the heat collection apparatus as a single-point load. The retaining force is applied along a vector that is collinear to the face-centered normal vector of the thermal interface of the heat source. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of mating force directed through the gimbal joint to the heat collection device. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.

    摘要翻译： 热收集装置使用包括万向接头的万向板安装在热源上。 万向节接头可以作为单点负载将作用于吸收装置的保持力作为单点负载。 保持力沿着与热源的热界面的面心法线向量共线的矢量施加。 这导致保持力在热界面区域上的平衡和集中应用。 万向节板使用弹簧装置直接安装到电路板上。 弹簧意味着调节通过万向节接头到集热装置的配合力的量。 由于万向节关节是旋转柔性的，构成热界面的两个配合面被强制并联配合。 以这种方式，产生高性能的TIM接口。