公开(公告)号：US10700166B2

公开(公告)日：2020-06-30

申请号：US13904315

申请日：2013-05-29

Applicant: Tokyo Electron Limited

Inventor： Yoshihiro Kai ,  Shinya Ishikawa ,  Yuji Kamikawa ,  Shuichi Nagamine ,  Naoki Shindo

IPC: B08B9/032 ,  H01L29/16 ,  B05B15/55 ,  B05B15/555 ,  B08B3/10 ,  H01L21/67 ,  H01L29/78 ,  B05B1/36

Abstract: A nozzle cleaning device is capable of uniformly cleaning a nozzle from a front end of the nozzle to an upper part thereof. The nozzle cleaning device includes a storage tank, a liquid discharging portion and an overflow discharging portion. The storage tank has a cylindrical inner peripheral surface and is configured to store therein a cleaning liquid that cleans a nozzle used in a substrate process. The liquid discharging portion is configured to discharge the cleaning liquid into the storage tank toward a position eccentric with respect to a central axis of the cylindrical inner peripheral surface to store the cleaning liquid within the storage tank and configured to form a vortex flow of the cleaning liquid revolving within the storage tank. The overflow discharging portion is configured to discharge the cleaning liquid that overflows the storage tank.

公开(公告)号：US20130319470A1

公开(公告)日：2013-12-05

申请号：US13904315

申请日：2013-05-29

Applicant: Tokyo Electron Limited

Inventor： Yoshihiro Kai ,  Shinya Ishikawa ,  Yuji Kamikawa ,  Shuichi Nagamine ,  Naoki Shindo

IPC: B08B9/032

CPC classification number: H01L29/1608 ,  B05B1/36 ,  B05B15/555 ,  B05B15/557 ,  B08B3/102 ,  B08B9/0321 ,  B08B9/0328 ,  H01L21/67051 ,  H01L29/7813

Abstract: A nozzle cleaning device is capable of uniformly cleaning a nozzle from a front end of the nozzle to an upper part thereof. The nozzle cleaning device includes a storage tank, a liquid discharging portion and an overflow discharging portion. The storage tank has a cylindrical inner peripheral surface and is configured to store therein a cleaning liquid that cleans a nozzle used in a substrate process. The liquid discharging portion is configured to discharge the cleaning liquid into the storage tank toward a position eccentric with respect to a central axis of the cylindrical inner peripheral surface to store the cleaning liquid within the storage tank and configured to form a vortex flow of the cleaning liquid revolving within the storage tank. The overflow discharging portion is configured to discharge the cleaning liquid that overflows the storage tank.

Abstract translation: 喷嘴清洁装置能够从喷嘴的前端到其上部均匀地清洁喷嘴。 喷嘴清洁装置包括储罐，液体排出部分和溢流排放部分。 储罐具有圆筒形的内周面，并且构造成在其中存储清洁基板工艺中使用的喷嘴的清洗液。 液体排出部分被配置成将清洁液体排出到相对于圆筒形内周面的中心轴线偏心的位置，以将清洗液储存在储罐内，并且构造成形成清洁的涡流 液体在储罐内旋转。 溢流排出部被配置为排出溢出储罐的清洗液。

公开(公告)号：US20130125931A1

公开(公告)日：2013-05-23

申请号：US13680426

申请日：2012-11-19

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shuichi Nagamine ,  Yusuke Hashimoto

IPC: B08B3/10

CPC classification number: B08B3/10 ,  B08B3/12 ,  H01L21/67028

Abstract: Disclosed is a liquid processing apparatus capable of performing a liquid processing and a drying processing in a position each having a different height. The liquid processing apparatus includes: a substrate holding unit configured to hold a substrate; a rotation driving unit configured to rotate the substrate holding unit; a substrate holding unit elevating member configured to lift and lower the substrate holding unit; a processing liquid supply unit configured to supply a processing liquid to the substrate; a liquid receiving cup configured to surround the substrate when the processing liquid is being supplied to the substrate; a drying cup located above the substrate and the liquid receiving cup when the processing liquid is being supplied to the substrate. The drying cup surrounds the substrate and located above the liquid receiving cup when the substrate is being dried.

Abstract translation: 公开了一种能够在各自具有不同高度的位置进行液体处理和干燥处理的液体处理装置。 液体处理装置包括：基板保持单元，被配置为保持基板; 旋转驱动单元，其构造成使所述基板保持单元旋转; 基板保持单元升降构件，被配置为升高和降低所述基板保持单元; 处理液供给单元，其构造成将处理液供给到所述基板; 液体容纳杯，其构造成当所述处理液体被供应到所述基底时围绕所述基底; 当处理液体被供给到基底时，位于基底上方的干燥杯和液体接收杯。 当基底被干燥时，干燥杯围绕基底并位于液体接收杯上方。

公开(公告)号：US09346084B2

公开(公告)日：2016-05-24

申请号：US13680426

申请日：2012-11-19

Applicant: Tokyo Electron Limited

Inventor： Shuichi Nagamine ,  Yusuke Hashimoto

IPC: H01L21/67 ,  B08B3/10 ,  B08B3/12

CPC classification number: B08B3/10 ,  B08B3/12 ,  H01L21/67028

Abstract: Disclosed is a liquid processing apparatus capable of performing a liquid processing and a drying processing in a position each having a different height. The liquid processing apparatus includes: a substrate holding unit configured to hold a substrate; a rotation driving unit configured to rotate the substrate holding unit; a substrate holding unit elevating member configured to lift and lower the substrate holding unit; a processing liquid supply unit configured to supply a processing liquid to the substrate; a liquid receiving cup configured to surround the substrate when the processing liquid is being supplied to the substrate; a drying cup located above the substrate and the liquid receiving cup when the processing liquid is being supplied to the substrate. The drying cup surrounds the substrate and located above the liquid receiving cup when the substrate is being dried.

Abstract translation: 公开了一种能够在各自具有不同高度的位置进行液体处理和干燥处理的液体处理装置。 液体处理装置包括：基板保持单元，被配置为保持基板; 旋转驱动单元，其构造成使所述基板保持单元旋转; 基板保持单元升降构件，被配置为升高和降低所述基板保持单元; 处理液供给单元，其构造成将处理液供给到所述基板; 液体容纳杯，其构造成当所述处理液体被供应到所述基底时围绕所述基底; 当处理液体被供给到基底时，位于基底上方的干燥杯和液体接收杯。 当基底被干燥时，干燥杯围绕基底并位于液体接收杯上方。

公开(公告)号：US09275881B2

公开(公告)日：2016-03-01

申请号：US13659996

申请日：2012-10-25

Applicant: Tokyo Electron Limited

Inventor： Shuichi Nagamine ,  Yusuke Hashimoto

IPC: B08B11/00 ,  H01L21/67 ,  H01L21/02

CPC classification number: H01L21/67051 ,  H01L21/02057 ,  H01L21/6715

Abstract: A liquid processing apparatus of the present disclosure includes a rotatable substrate holder that holds a wafer from above, and a top plate nozzle that supplies at least rinse liquid to the wafer and is provided in the rotation center of the substrate holder. The top plate nozzle is movably configured with the substrate holder in the top-bottom direction, and the rinse liquid is supplied to the wafer from the top plate nozzle while the top plate nozzle is spaced from the substrate holder. When the top plate nozzle approaches to the substrate holder, the rinse liquid is supplied to the lower surface of the substrate holder from the top plate nozzle to clean the lower surface of the substrate holder.

Abstract translation: 本公开的液体处理装置包括从上方保持晶片的可旋转衬底保持器和至少将冲洗液体提供给晶片并设置在衬底保持器的旋转中心中的顶板喷嘴。 顶板喷嘴在上下方向上可移动地配置有基板保持器，并且将冲洗液从顶板喷嘴供给到晶片，同时顶板喷嘴与基板保持器间隔开。 当顶板喷嘴靠近基板保持器时，冲洗液体从顶板喷嘴供给到基板保持器的下表面，以清洁基板保持器的下表面。

公开(公告)号：US09266153B2

公开(公告)日：2016-02-23

申请号：US14233496

申请日：2012-10-16

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shuichi Nagamine ,  Yusuke Hashimoto

IPC: B08B3/00 ,  B08B3/04 ,  H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  H01L21/311

CPC classification number: B08B3/04 ,  H01L21/31133 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/67109 ,  H01L21/67748 ,  H01L21/68792

Abstract: A substrate processing apparatus includes: a storage tank configured to store a liquid; a substrate support unit configured to rotatably, horizontally support a substrate; and a plate driving unit configured to move the substrate support unit between an immersion position at which the substrate is immersed into the liquid stored in the storage tank, and a separation position located above the immersion position, at which the substrate is separated from the liquid stored in the storage tank. The substrate processing apparatus also includes a rotary drive unit configured to rotate the substrate supported by the substrate support unit, and liquid supply units configured to supply a liquid to the substrate that is being rotated by the rotary drive unit in the separation position.

Abstract translation: 一种基板处理装置，包括：储存罐，被配置为储存液体; 基板支撑单元，被配置为可旋转地水平地支撑基板; 以及板驱动单元，其构造成将所述基板支撑单元移动到所述基板浸入到所述储存槽中的液体的浸渍位置之间，以及位于所述浸渍位置上方的分离位置，在所述分离位置处所述基板与所述液体分离 储存在储罐中。 基板处理装置还包括：旋转驱动单元，被配置为使由基板支撑单元支撑的基板旋转，以及液体供应单元，其构造成将液体供应到由旋转驱动单元在分离位置旋转的基板。

公开(公告)号：US20140290701A1

公开(公告)日：2014-10-02

申请号：US14233496

申请日：2012-10-16

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shuichi Nagamine ,  Yusuke Hashimoto

IPC: B08B3/04

CPC classification number: B08B3/04 ,  H01L21/31133 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/67109 ,  H01L21/67748 ,  H01L21/68792

Abstract: A substrate processing apparatus includes: a storage tank configured to store a liquid; a substrate support unit 10 configured to rotatably, horizontally support a substrate W; and a plate driving unit 30a configured to move the substrate support unit 10 between an immersion position at which the substrate W is immersed into the liquid stored in the storage tank, and a separation position located above the immersion position, at which the substrate W is separated from the liquid stored in the storage tank. The substrate processing apparatus also includes a rotary drive unit 30M configured to rotate the substrate W supported by the substrate support unit 10, and liquid supply units 10n, 20m and 20n configured to supply a liquid to the substrate W that is being rotated by the rotary drive unit in the separation position.

Abstract translation: 一种基板处理装置，包括：储存罐，被配置为储存液体; 基板支撑单元10，被配置为可旋转地水平地支撑基板W; 以及板驱动单元30a，其被配置为使基板支撑单元10在浸没在基板W浸入到储存槽中的液体的浸入位置与位于浸渍位置上方的分离位置之间移动，基板W 与存储在储罐中的液体分离。 基板处理装置还包括：旋转驱动单元30M，被配置为旋转由基板支撑单元10支撑的基板W;以及液体供应单元10n，20m和20n，其被配置为向旋转的旋转的基板W供应液体 驱动单元处于分离位置。

公开(公告)号：US20130104940A1

公开(公告)日：2013-05-02

申请号：US13659996

申请日：2012-10-25

Applicant: Tokyo Electron Limited

Inventor： Shuichi Nagamine ,  Yusuke Hashimoto

IPC: B08B3/02 ,  B08B3/10

CPC classification number: H01L21/67051 ,  H01L21/02057 ,  H01L21/6715

Abstract: A liquid processing apparatus of the present disclosure includes a rotatable substrate holder that holds a wafer from above, and a top plate nozzle that supplies at least rinse liquid to the wafer and is provided in the rotation center of the substrate holder. The top plate nozzle is movably configured with the substrate holder in the top-bottom direction, and the rinse liquid is supplied to the wafer from the top plate nozzle while the top plate nozzle is spaced from the substrate holder. When the top plate nozzle approaches to the substrate holder, the rinse liquid is supplied to the lower surface of the substrate holder from the top plate nozzle to clean the lower surface of the substrate holder.

Abstract translation: 本公开的液体处理装置包括从上方保持晶片的可旋转衬底保持器和至少将冲洗液体提供给晶片并设置在衬底保持器的旋转中心中的顶板喷嘴。 顶板喷嘴在上下方向上可移动地配置有基板保持器，并且将冲洗液从顶板喷嘴供给到晶片，同时顶板喷嘴与基板保持器间隔开。 当顶板喷嘴靠近基板保持器时，冲洗液体从顶板喷嘴供给到基板保持器的下表面，以清洁基板保持器的下表面。