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公开(公告)号：US06541898B2
公开(公告)日：2003-04-01
申请号：US09822636
申请日：2001-03-30
申请人： Masayuki Kitajima , Yutaka Noda , Seiichi Shimoura , Toru Okada , Masanao Fujii , Kenji Iketaki , Hidehiko Kobayashi , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka
发明人： Masayuki Kitajima , Yutaka Noda , Seiichi Shimoura , Toru Okada , Masanao Fujii , Kenji Iketaki , Hidehiko Kobayashi , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka
IPC分类号： H01L41047
CPC分类号： H01L41/29 , G11B5/5552 , G11B5/5556 , H01L41/0993 , H01L2224/48091 , H01L2224/73265 , H01L2924/01327 , Y10T29/42 , H01L2924/00014 , H01L2924/00
摘要： A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.
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2.发明授权Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method 失效压电元件与电极的接合方法以及使用该接合方法的压电微型致动器公开(公告)号：US06744183B2
公开(公告)日：2004-06-01
申请号：US10347708
申请日：2003-01-21
申请人： Masayuki Kitajima , Yutaka Noda , Seiichi Shimoura , Toru Okada , Masanao Fujii , Kenji Iketaki , Hidehiko Kobayashi , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka
发明人： Masayuki Kitajima , Yutaka Noda , Seiichi Shimoura , Toru Okada , Masanao Fujii , Kenji Iketaki , Hidehiko Kobayashi , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka
IPC分类号： H01L41047
CPC分类号： H01L41/29 , G11B5/5552 , G11B5/5556 , H01L41/0993 , H01L2224/48091 , H01L2224/73265 , H01L2924/01327 , Y10T29/42 , H01L2924/00014 , H01L2924/00
摘要： A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.
摘要翻译： 一种键合压电元件和电极的方法，包括以下步骤：在压电元件的接合表面上形成选自Au，Al，Zn，Cu和Sn的材料的第一涂层，并形成 在电极的接合表面上第二次涂覆选自Au，Al，Zn，Cu和Sn的材料。 第一和第二涂层的材料的组合优选为Au / Au，Au / Al，Zn / Cu或Sn / Cu。 该方法还包括使第一和第二涂层彼此紧密接触并在压力下加热它们以在第一和第二涂层之间形成金属键或金属间化合物，从而结合压电元件和电极的步骤。
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公开(公告)号：US20080296266A1
公开(公告)日：2008-12-04
申请号：US12125602
申请日：2008-05-22
申请人： Toru Okada , Yutaka Noda , Seiichi Shimoura
发明人： Toru Okada , Yutaka Noda , Seiichi Shimoura
CPC分类号： B23K3/027
摘要： A processing head is supported for pivotal movement around a pivot point in a processing apparatus. An urging member applies an urging force to the processing head at the pivot point. The processing apparatus allows establishment of point contact between the urging member and the processing head. When the surface of an object inclines from a predetermined attitude, the processing head is allowed to follow the inclination of the surface. The processing head is allowed to establish a predetermined attitude relative to the surface of the object. The processing head thus reliably enables a predetermined action to the object as desired.
摘要翻译： 处理头被支撑以围绕处理装置中的枢转点枢转运动。 推动构件在枢转点处向加工头施加推动力。 处理装置允许在推动构件和处理头之间建立点接触。 当物体的表面从预定姿态倾斜时，允许处理头跟随表面的倾斜。 允许处理头相对于物体的表面建立预定的姿态。 因此，处理头能够根据需要可靠地实现对物体的预定动作。
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公开(公告)号：US06467141B2
公开(公告)日：2002-10-22
申请号：US09820553
申请日：2001-03-29
申请人： Toru Okada , Kenji Iketaki , Hidehiko Kobayashi , Yutaka Noda , Masayuki Kitajima , Seiichi Shimoura , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka , Masanao Fujii
发明人： Toru Okada , Kenji Iketaki , Hidehiko Kobayashi , Yutaka Noda , Masayuki Kitajima , Seiichi Shimoura , Masakazu Takesue , Keiichi Yamamoto , Hisao Tanaka , Masanao Fujii
IPC分类号： H04R1710
CPC分类号： G11B5/5552 , H01L41/313 , Y10T29/42 , Y10T29/49025 , Y10T29/49055
摘要： A method of assembling a micro-actuator is provided in which a base frame having a plurality of actuator bases is placed on a stage, a first adhesive is applied to each of the actuator bases, and a base electrode frame having a plurality of base electrodes is placed on the first adhesive. The first adhesive is semi-cured by heating and pressing. A second adhesive is applied to each of the base electrodes, and a plurality of piezoelectric elements are placed on the second adhesive. The second adhesive is semi-cured by heating and pressing. A third adhesive is,applied to the piezoelectric elements, and a movable electrode frame having a plurality of movable electrodes is placed on the third adhesive. The third adhesive is semi-cured by heating and pressing. Next, a fourth adhesive is applied to each of the movable electrodes, and a hinge plate frame having a plurality of hinge plates is placed on the fourth adhesive. The fourth adhesive is semi-cured by heating and pressing. Finally, the adhered laminate thus obtained is placed in a heating furnace, and is heated at a predetermined temperature for a predetermined period of time, whereby each of the adhesives is fully cured.
摘要翻译： 提供了一种组装微致动器的方法，其中具有多个致动器基座的基架被放置在台架上，第一粘合剂被施加到每个致动器基座，以及具有多个基极的基极框架 被放置在第一粘合剂上。 第一粘合剂通过加热和压制半固化。 将第二粘合剂施加到每个基底电极上，并且将多个压电元件放置在第二粘合剂上。 第二粘合剂通过加热和压制半固化。 将第三粘合剂施加到压电元件，并且具有多个可移动电极的可动电极框架放置在第三粘合剂上。 第三粘合剂通过加热和压制半固化。 接下来，将第四粘合剂施加到每个可移动电极，并且具有多个铰链板的铰链板框架放置在第四粘合剂上。 第四粘合剂通过加热和加压半固化。 最后，将如此获得的粘合层压材料放置在加热炉中，并在预定温度下加热预定的时间，从而使各种粘合剂完全固化。
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5.发明申请Circuit board, method of forming wiring pattern, and method of manufacturing circuit board 审中-公开电路板，布线图案的形成方法以及电路板的制造方法公开(公告)号：US20090044972A1
公开(公告)日：2009-02-19
申请号：US12155261
申请日：2008-05-30
CPC分类号： H05K1/095 , H05K1/117 , H05K1/118 , H05K3/1283 , H05K3/249 , H05K2201/0129 , H05K2201/035 , H05K2201/2009 , H05K2203/0278 , H05K2203/1105
摘要： When manufacturing a circuit board, a wiring pattern is printed on a substrate with a conductive paste formed of metal powder and thermoplastic resin, and then the conductive paste is subjected to a heating treatment and a pressing treatment.
摘要翻译： 当制造电路板时，使用由金属粉末和热塑性树脂形成的导电膏将基板上印刷布线图案，然后对导电浆进行加热处理和压制处理。
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公开(公告)号：US06848154B2
公开(公告)日：2005-02-01
申请号：US10459955
申请日：2003-06-12
CPC分类号： G11B5/5552 , H01L41/0993 , H01L41/313 , Y10T29/42 , Y10T29/49005 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913
摘要： In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable electrode is placed on the first adhesive. A second adhesive is applied to the movable electrode, and a piezoelectric element is placed on the second adhesive. Next, a third adhesive is applied to an actuator base, a base electrode is placed on the third adhesive, and the third adhesive is semi-cured in the same manner as above. A fourth adhesive is applied to the base electrode, the piezoelectric element is placed on the fourth adhesive, and the fourth adhesive is semi-cured in the same manner as above. Finally, the adhered laminate thus obtained is placed into a heating furnace and heated at a predetermined temperature for a predetermined period of time to thereby fully cure the adhesives.
摘要翻译： 在制造微致动器的方法中，将第一粘合剂施加到可动板上，将可动电极放置在第一粘合剂上。 将第二粘合剂施加到可动电极上，并将压电元件放置在第二粘合剂上。 接下来，将第三粘合剂施加到致动器基座，将基极放置在第三粘合剂上，并且以与上述相同的方式将第三粘合剂半固化。 将第四粘合剂施加到基底电极上，将压电元件放置在第四粘合剂上，并且以与上述相同的方式将第四粘合剂半固化。 最后，将如此得到的粘合层叠体放入加热炉中并在预定温度下加热预定的时间，从而使粘合剂完全固化。
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公开(公告)号：US20050104477A1
公开(公告)日：2005-05-19
申请号：US11006340
申请日：2004-12-07
CPC分类号： G11B5/5552 , H01L41/0993 , H01L41/313 , Y10T29/42 , Y10T29/49005 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913
摘要： In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable, and a movable electrode is placed on the first adhesive. A second adhesive is applied to the movable electrode, and a piezoelectric element is placed on the second adhesive. Next, a third adhesive is applied to an actuator base, a base electrode is placed on the third adhesive, and the third adhesive is semi-cured in the same manner as above. A fourth adhesive is applied to the base electrode, the piezoelectric element is placed on the fourth adhesive, and the fourth adhesive is semi-cured in the same manner as above. Finally, the adhered laminate thus obtained is placed into a heating furnace and heated at a predetermined temperature for a predetermined period of time to thereby fully cure the adhesives.
摘要翻译： 在制造微致动器的方法中，将第一粘合剂施加到可动板上，并且可移动的电极和可动电极被放置在第一粘合剂上。 将第二粘合剂施加到可动电极上，并将压电元件放置在第二粘合剂上。 接下来，将第三粘合剂施加到致动器基座，将基极放置在第三粘合剂上，并且以与上述相同的方式将第三粘合剂半固化。 将第四粘合剂施加到基底电极上，将压电元件放置在第四粘合剂上，并且以与上述相同的方式将第四粘合剂半固化。 最后，将如此得到的粘合层叠体放入加热炉中并在预定温度下加热预定的时间，从而使粘合剂完全固化。
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公开(公告)号：US08153941B2
公开(公告)日：2012-04-10
申请号：US10199850
申请日：2002-07-19
CPC分类号： H01L41/313
摘要： A first plate material is set on a work stage. The first plate material includes first components commonly connected to a first connection member. A second plate material is subsequently set on the work stage. The second plate material includes second components commonly connected to a second connection member. The second components are superposed on the corresponding first components. The first components as well as the second components can be handled as a one-piece component. It leads to an improved productivity. Heat surfaces of a heat block contact the second components. The connection members are prevented from thermal expansion. The constant intervals are reliably maintained between the adjacent first components and the adjacent second components.
摘要翻译： 将第一板材放置在工作台上。 第一板材包括通常连接到第一连接构件的第一部件。 随后将第二板材置于工作台上。 第二板材包括通常连接到第二连接构件的第二部件。 第二组件叠加在相应的第一组件上。 第一组件以及第二组件可以作为单件组件来处理。 它可以提高生产率。 加热块的热表面与第二部件接触。 连接件防止热膨胀。 在相邻的第一部件和相邻的第二部件之间可靠地保持恒定间隔。
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公开(公告)号：US07356894B2
公开(公告)日：2008-04-15
申请号：US11006340
申请日：2004-12-07
CPC分类号： G11B5/5552 , H01L41/0993 , H01L41/313 , Y10T29/42 , Y10T29/49005 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913
摘要： In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable, and a movable electrode is placed on the first adhesive. A second adhesive is applied to the movable electrode, and a piezoelectric element is placed on the second adhesive. Next, a third adhesive is applied to an actuator base, a base electrode is placed on the third adhesive, and the third adhesive is semi-cured in the same manner as above. A fourth adhesive is applied to the base electrode, the piezoelectric element is placed on the fourth adhesive, and the fourth adhesive is semi-cured in the same manner as above. Finally, the adhered laminate thus obtained is placed into a heating furnace and heated at a predetermined temperature for a predetermined period of time to thereby fully cure the adhesives.
摘要翻译： 在制造微致动器的方法中，将第一粘合剂施加到可动板上，并且可移动的电极和可动电极被放置在第一粘合剂上。 将第二粘合剂施加到可动电极上，并将压电元件放置在第二粘合剂上。 接下来，将第三粘合剂施加到致动器基座，将基极放置在第三粘合剂上，并且以与上述相同的方式将第三粘合剂半固化。 将第四粘合剂施加到基底电极上，将压电元件放置在第四粘合剂上，并且以与上述相同的方式将第四粘合剂半固化。 最后，将如此得到的粘合层叠体放入加热炉中并在预定温度下加热预定的时间，从而使粘合剂完全固化。
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公开(公告)号：US06903876B2
公开(公告)日：2005-06-07
申请号：US10309575
申请日：2002-12-04
CPC分类号： G02B27/0172 , G02B2027/0178
摘要： A body has a configuration in which a first ellipse has a first and second focal points and a second ellipse having a third and fourth points are arranged such that the second and third focal points coincide. This body is equivalent to an optical system having an optical path in which light gathered to the first focal point passes through the first focal point, and is reflected by a first concave reflecting surface, being a part of the first ellipse, to go through the second focal point, and then reflected by a second concave reflecting surface, being a part of the second ellipse, to be gathered to the fourth focal point.
摘要翻译： 主体具有其中第一椭圆具有第一和第二焦点的构造，并且具有第三和第四点的第二椭圆被布置成使得第二和第三焦点重合。 本体等效于具有聚光到第一焦点的光通过第一焦点的光路的光学系统，并且被作为第一椭圆的一部分的第一凹面反射面反射，穿过第一椭圆 第二焦点，然后被作为第二椭圆的一部分的第二凹面反射面反射，聚集到第四焦点。
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