摘要:
An RF module includes a multi-layered substrate. A base-band IC, a memory IC, a quartz oscillator and surface-mount components are mounted on the upper surface of the multi-layered substrate. A metallic cap also is attached to the upper surface of the multi-layered substrate. A cavity is formed in the lower surface of the multi-layered substrate substantially at the center thereof. A first RF-IC and a second RF-IC are embedded in the cavity. Wiring patterns for providing connections between the base-band IC and the memory IC, through-holes, RF passive components, and the shield ground electrode pattern are disposed inside of the multi-layered substrate.
摘要:
A transmission output control device comprising: a directional coupler which branches a part of an amplified transmission signal from a high output amplifier; and a detector which detects a part of said branched transmission signal; wherein the directional coupler and the detector are integrated in a laminated body in which a plurality of dielectric layers are laminated.
摘要:
A variable attenuator is provided with a comb line formed of first and second lines electromagnetically coupled at a coupling degree of M, and diodes connected to the first and second lines constituting the comb line. One end of the first line is grounded through a capacitor and also connected to an input terminal through a capacitor. A diode is connected between the ground and the other end of the first line such that its anode is connected to the other end of the first line. The node connecting the other end of the first line and the anode of the diode is connected to a control terminal through a resistor. One end of the second line is grounded through a capacitor and also connected to an output terminal through a capacitor. Another diode is connected between the ground and the other end of the second line such that its anode is connected to the other end of the second line. The node connecting the other end of the second line and the anode of the diode is connected to a control terminal through a resistor.
摘要:
On a mounting surface of a multilayered component as a surface mounting component, an isolated electrode is arranged so as to be isolated from other terminal electrodes on the mounting surface. For solder applied to the isolated electrode, the application range can be securely limited to an area within the isolated electrode.
摘要:
The invention provides a mobile image apparatus (10), comprising: a case unit (11); at least one antenna (12) disposed at least one of within said case unit (11) and outside said case unit (11); wherein said chip antenna (12) comprises; a substrate (1) made of at least one of a dielectric material and a magnetic material; at least one conductor (2) disposed at least one of within said substrate (1) and on a surface of said substrate (1); at least one power feeding terminal (3) disposed on a surface of said substrate (1) and connected to one end of said conductor (2) for applying a voltage to said conductor (2).
摘要:
An antenna adapted for surface mounting has a dielectric substrate on which are attached at least one primary grounding electrode and a connector electrode which together serve as a capacitor, at least one secondary grounding electrode formed adjacent to but insulated from the connector electrode, and a radiative member disposed thereover for emitting electromagnetic radiation. The resonant frequency of this antenna can be adjusted by trimming either its connector electrode or one of the secondary grounding electrode.
摘要:
An antenna apparatus 10 includes a chip antenna 14 provided with a conductor 11, a power-supply electrode 12 to which one end of the conductor 11 is connected, and a terminal electrode 13 to which the other end of the conductor is connected; and a mounting substrate 18 provided with a line-shaped radiative conductor 15 formed by printing an electrically conductive material on a surface, a line-shaped conductive pattern 16, and a substantially rectangular ground electrode 17. The chip antenna 14 is mounted on the mounting substrate 18. The power-supply electrode 12 of the chip antenna 14 is connected through the conductive pattern 16 on the mounting substrate 18 to a power-supply source V. The terminal electrode 13 of the chip antenna 14 is connected to one end of the radiative conductor 15 on the mounting substrate 18.
摘要:
An antenna unit having a substrate and a radiator, including a metal plate, which is mounted on the substrate, the radiator being provided with a feed terminal, a ground terminal and an electrostatic capacitance connecting terminal extending toward the substrate, so that the radiator is fixed to the substrate through the feed terminal, the ground terminal and the electrostatic capacitance connecting terminal, and further a capacitance being connected between the capacitance connecting terminal and a ground potential.
摘要:
A matching circuit and an antenna apparatus which, though small-sized, can be used in a radio apparatus which transmits and receives radio waves having a wide range of frequencies. A matching circuit includes an inductance element formed of a chip inductor connected in series with an antenna body, a first capacitance element formed of a trimmer capacitor, and a second capacitance element formed of a chip capacitor, which capacitance elements are connected between respective ends of the inductance element and a ground terminal, and thus in parallel to the antenna body. One end of the inductance element is connected to the power supply terminal of the antenna body, and the other end is connected to a power source for applying a voltage to the antenna body. The first capacitance element is connected between a ground and the connection point of the power supply terminal of the antenna body and the inductance element. The second capacitance element is connected between a ground and the connection point of the inductance element and the power source.
摘要:
A compact variable attenuator, composite variable attenuator, and mobile communication apparatus capable of variably controlling attenuation continuously. The variable attenuator includes a first comb line comprising first and second lines which are electromagnetically coupled with a coupling coefficient M, a second comb line comprising third and fourth lines which are electromagnetically coupled with a coupling coefficient M, and first and second diodes connected to the third and fourth lines of the second comb line. A first terminal is connected to one end of the first line and a second terminal is connected to one end of the second line. The first and second diodes are connected between one end of each of the third and fourth lines and a ground with their anodes connected to one end of each of the third and fourth lines, respectively. First and second control terminals for turning the first and second diodes on and off are connected at the junction of other end of the first line and the other end of the third line and at the junction of the other end of the second line and the other end of the fourth line via resistors.