公开(公告)号：US20040084319A1

公开(公告)日：2004-05-06

申请号：US10677548

申请日：2003-10-01

申请人： University of Southern California

发明人： Adam L. Cohen

IPC分类号： C25D005/02 ,  C25D005/10

CPC分类号： C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

摘要： An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

公开(公告)号：US20040065554A1

公开(公告)日：2004-04-08

申请号：US10434292

申请日：2003-05-07

申请人： University of Southern California

发明人： Adam L. Cohen

IPC分类号： C25D005/02

CPC分类号： B81C1/00126 ,  B81C1/00246 ,  B81C2201/019 ,  B81C2201/053 ,  B81C2203/0735 ,  C25D1/003 ,  C25D5/022 ,  H01L21/2885 ,  H01L21/76885 ,  H01L24/10 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/00

摘要： Enhanced Electrochemical fabrication processes are provided that can form three-dimensional multi-layer structures using semiconductor based circuitry as a substrate. Electrically functional portions of the structure are formed from structural material (e.g. nickel) that adheres to contact pads of the circuit. Aluminum contact pads and silicon structures are protected from copper diffusion damage by application of appropriate barrier layers.

摘要翻译： 提供了增强的电化学制造工艺，其可以使用基于半导体的电路作为衬底形成三维多层结构。 结构的电功能部分由粘附到电路的接触垫的结构材料（例如镍）形成。 铝接触焊盘和硅结构通过施加适当的阻挡层来保护铜扩散损坏。

公开(公告)号：US20040065552A1

公开(公告)日：2004-04-08

申请号：US10677409

申请日：2003-10-01

申请人： University of Southern California

发明人： Adam L. Cohen

IPC分类号： C25D005/02

CPC分类号： C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

摘要： An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

公开(公告)号：US20030121791A1

公开(公告)日：2003-07-03

申请号：US10272255

申请日：2002-10-15

申请人： University of Southern California

发明人： Adam L. Cohen

IPC分类号： C25D005/02

CPC分类号： B81C1/0038 ,  B33Y10/00 ,  B81C1/00619 ,  B81C2201/0197 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  C25D7/12 ,  C25D17/02 ,  C25D21/14 ,  H01L21/2885 ,  H01L21/76885 ,  H05K3/241

摘要： Various embodiments of the invention present techniques for forming structures (e.g. HARMS-type structures) via an electrochemical extrusion (ELEXnull) process. Preferred embodiments perform the extrusion processes via depositions through anodeless conformable contact masks that are initially pressed against substrates that are then progressively pulled away or separated as the depositions thicken. A pattern of deposition may vary over the course of deposition by including more complex relative motion between the mask and the substrate elements. Such complex motion may include rotational components or translational motions having components that are not parallel to an axis of separation. More complex structures may be formed by combining the ELEXnull process with the selective deposition, blanket deposition, planarization, etching, and multi-layer operations of EFABnull.

摘要翻译： 本发明的各种实施方案提供了用于通过电化学挤出（ELEX TM）方法形成结构（例如HARMS型结构）的技术。 优选的实施方案通过沉积通过无阳极适应的接触掩模进行挤出过程，其最初被压在基底上，然后随着沉积增厚逐渐拉开或分离。 沉积图案可以通过在掩模和衬底元件之间包括更复杂的相对运动而在沉积过程中变化。 这种复杂运动可以包括旋转分量或具有不与分离轴平行的分量的平移运动。 可以通过将ELEX TM工艺与EFAB TM的选择性沉积，覆盖沉积，平坦化，蚀刻和多层操作组合来形成更复杂的结构。

公开(公告)号：US20040129573A1

公开(公告)日：2004-07-08

申请号：US10677546

申请日：2003-10-01

申请人： University of Southern California

发明人： Adam L. Cohen

IPC分类号： C25D005/10

CPC分类号： B81C1/00492 ,  B33Y10/00 ,  C25D1/003 ,  C25D1/08 ,  C25D5/022 ,  C25D5/10 ,  C25D7/12

摘要： Multilayer structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. Selectivity of deposition is obtained via a multi-cell controllable mask. Alternatively, net selective deposition is obtained via a blanket deposition and a selective removal of material via a multi-cell mask. Individual cells of the mask may contain electrodes comprising depositable material or electrodes capable of receiving etched material from a substrate. Alternatively, individual cells may include passages that allow or inhibit ion flow between a substrate and an external electrode and that include electrodes or other control elements that can be used to selectively allow or inhibit ion flow and thus inhibit significant deposition or etching. Single cell masks having a cell size that is smaller or equal to the desired deposition resolution may also be used to form structures.

公开(公告)号：US20040000489A1

公开(公告)日：2004-01-01

申请号：US10434494

申请日：2003-05-07

申请人： University of Southern California

发明人： Gang Zhang ,  Adam L. Cohen

IPC分类号： C25D005/02

CPC分类号： H01L21/2885 ,  B33Y10/00 ,  C25D1/003 ,  H01L21/4857 ,  H01L21/76879 ,  H05K3/241 ,  H05K3/243

摘要： Electrochemical fabrication (e.g. EFAB) processes and apparatus are disclosed that provide monitoring of at least one electrical parameter (e.g. voltage) during selective deposition where the monitored parameter is used to help determine the quality of the deposition that was made. If the monitored parameter indicates that a problem occurred with the deposition, various remedial operations may be undertaken to allow successful formation of the structure to be completed.

摘要翻译： 公开了电化学制造（例如EFAB）方法和装置，其在选择性沉积期间提供至少一个电参数（例如电压）的监测，其中所使用的监测参数用于帮助确定所制备的沉积的质量。 如果所监测的参数表明沉积物发生问题，则可进行各种补救操作以允许成功地形成待完成的结构。

公开(公告)号：US20040065553A1

公开(公告)日：2004-04-08

申请号：US10677549

申请日：2003-10-01

申请人： University of Southern California

发明人： Adam L. Cohen

IPC分类号： C25D005/02

CPC分类号： C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

摘要： An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

摘要翻译： 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。