摘要:
A printed circuit board includes first and second layout layers, first and second components, and a pair of connecting portions. The first layout layer includes a pair of first conducting portions connected to a control chip. The second layout layer includes pairs of second to fourth conducting portions. The connecting portions connect the first and third conducting portions together. When an electronic device is connected to the second conducting portions, and the first and second components are connected to the third and fourth conducting portions to form a first route, signals generated by the control chip are transmitted to the electronic device through the first route. When the electronic device is connected to the fourth conducting portions, and the first and second components are connected to the second and third conducting portions to form a second route, the signals are transmitted to the electronic device through the second route.
摘要:
A printed circuit board includes an insulating board, a pair of differential vias, and a number of wiring layers. A pair of via holes extends through opposite surfaces of the insulating board. The differential vias correspond to the pair of via holes. Each differential via includes a metal plated barrel and two via capture pads. The plated barrel is plated on the inner surface of the respective via hole, and terminates at each of the two opposite surfaces of the insulating board. The via capture pads are formed on the opposite surfaces of the insulating board around the openings of the via hole, and are electrically connected to the plated barrel. The wiring layers are arranged in the insulating board, and each define a clearance hole surrounding all of the via capture pads.
摘要:
A system and method for testing objects using a mechanical arm includes establishing coordinate system based on a work area of the mechanical arm, and obtaining test parameters from a storage system. The method further includes controlling the mechanical arm to get an object and position the object to the position of a test platform according to the test parameters, controlling the mechanical arm to get test tool from a tool shelf and position the test tool to a position of test point on the object to test the object according to the test parameters. The method also includes controlling the mechanical arm to get the object from the test platform and position the object to the location reserved for the object according to the test parameters.
摘要:
Parameters of a radio frequency filter can be changed by changing structure of each component of the filter. Material of each component, diameters of each of magnetic cylinders, density of each of conductive coils, and thickness of each of dielectric layers can be changed. When any component needs to be replaced, the filter can be detached as needed.
摘要:
A system and method for inspecting layout of a printed circuit board (PCB) provides a graphical user interface (GUI). The GUI displays a layout of the PCB. High side pins of a pulse width modulation (PWM) controller and a component connected to a high side pin are found. If the component is a metallic oxide semiconductor field effect transistor (MOSFET), the system calculate absolute a linear distance and a trace distance between a source pin of the MOSFET and a capacitor pin of a coupling capacitor connected to the source pin. If the linear distance, the trace distance and a capacitance of the coupling capacitor accord with a layout standard, the layout of the PCB is determined to be up to standard.
摘要:
A method for testing a characteristic impedance of an electronic component includes sending a positioning command to a control computer through a switch, so as to drive a probe holder of a mechanical arm to position probes of a time domain reflectometer (TDR) on a position of the electronic component. The method further receives measured data collected by the TDR, and compares the measured data with preset standard values to determine if the measured data is acceptable.
摘要:
A printed circuit board coupling includes a first layout layer, a second layout layer, a pair of connecting portions, a first component and a second component. The first layout layer has a pair of first conducting portions which is disposed thereon to couple with a control chip. The second layout layer has a pair of second conducting portions, third conducting portions, and fourth conducting portions all of which are sequentially disposed thereon. The connecting portions are coupled with the first conducting portions and the third conducting portions. In a first coupling mode, an electronic device is coupled with the second conducting portions, and first and second components are coupled with the third and fourth conducting portions. In a second coupling mode, the electronic device is coupled with the fourth conducting portions, and the first and the second components are coupled with the second and third conducting portions.
摘要:
A printed circuit board includes a first to a fifth connector pads, a first to an eighth coupling capacitor pads, a first to a tenth transmission lines, a first via and a second via, a first to a fourth sharing pads, and a voltage converting circuit. The printed circuit board is operable to selectively support different types of connectors.
摘要:
A printed circuit board (PCB) with compound via includes a substrate and a pair of through holes passing through the substrate. The substrate includes a signal layer which is the top layer of the substrate, a first reference layer adjacent to the signal layer, and a second reference layer not adjacent to the signal layer. A first and a second pair of pads are mounted on the signal layer. Each of the through holes extends through the first pair of pads such that the through hole and the first pair of pads jointly form a compound via. A first reserved opening is formed on the first reference layer and corresponds to the first and the second pair of pads and the compound via. A second reserved opening is formed on the second reference layer and surrounds the through hole thereon.
摘要:
An electronic device and method for inspecting electrical rules of circuit boards includes selecting at least two design files that record electrical rules of the circuit boards and searching the electrical rules in the selected design files using preset parameter keywords. Same electrical rules of the selected design files are acquired by comparing the electrical rules in the selected design files. The same electrical rules and corresponding parameter values are input to a comparison table, and the comparison table is output.