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    Method of Forming a Multilayer Substrate Core Structure Using Sequential Microvia Laser Drilling And Substrate Core Structure Formed According to the Method
    5.
    发明申请
    Method of Forming a Multilayer Substrate Core Structure Using Sequential Microvia Laser Drilling And Substrate Core Structure Formed According to the Method 有权
    根据该方法形成使用顺序微孔激光钻孔和基底芯结构的多层基板芯结构的形成方法

    公开(公告)号：US20090001550A1

    公开(公告)日：2009-01-01

    申请号：US11769852

    申请日：2007-06-28

    申请人： Yonggang Li ,  Islam Salama ,  Charan Gurumurthy

    发明人： Yonggang Li ,  Islam Salama ,  Charan Gurumurthy

    IPC分类号： H01L23/14 ,  H05K1/02 ,  H05K3/42

    CPC分类号： H05K3/422 ,  H05K3/0035 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0394 ,  H05K2201/09563 ,  Y10T29/49128 ,  Y10T29/49165

    摘要： A method of fabricating a substrate core structure, and a substrate core structure formed according to the method. The method includes: laser drilling a first set of via openings through a starting insulating layer; filling the first set of via openings with a conductive material to provide a first set of conductive vias; providing first and second patterned conductive layers on opposite sides of the starting insulating layer; providing a supplemental insulating layer onto the first patterned conductive layer; laser drilling a second set of via openings through the supplemental insulating layer; filling the second set of via openings with a conductive material to provide a second set of conductive vias; and providing a supplemental patterned conductive layer onto an exposed side of the supplemental insulating layer, the second set of conductive vias contacting the first patterned conductive layer and the supplemental patterned conductive layer at opposite sides thereof.

    摘要翻译： 一种制造衬底芯结构的方法，以及根据该方法形成的衬底芯结构。 该方法包括：通过起始绝缘层激光钻探第一组通路孔; 用导电材料填充第一组通孔开口以提供第一组导电通孔; 在起始绝缘层的相对侧上提供第一和第二图案化导电层; 在所述第一图案化导电层上提供补充绝缘层; 激光钻穿通过补充绝缘层的第二组通孔; 用导电材料填充第二组通孔开口以提供第二组导电通路; 以及在所述补充绝缘层的暴露侧上提供补充图案化导电层，所述第二组导电通孔在其相对侧与所述第一图案化导电层和所述补充图案化导电层接触。

    METHOD OF FORMING A MULTILAYER SUBSTRATE CORE STRUCTURE USING SEQUENTIAL MICROVIA LASER DRILLING AND SUBSTRATE CORE STRUCTURE FORMED ACCORDING TO THE METHOD
    6.
    发明申请
    METHOD OF FORMING A MULTILAYER SUBSTRATE CORE STRUCTURE USING SEQUENTIAL MICROVIA LASER DRILLING AND SUBSTRATE CORE STRUCTURE FORMED ACCORDING TO THE METHOD 审中-公开
    使用顺序微晶激光钻孔形成多层底层核心结构的方法和根据该方法形成的基底核心结构

    公开(公告)号：US20110058340A1

    公开(公告)日：2011-03-10

    申请号：US12941899

    申请日：2010-11-08

    申请人： Yonggang Li ,  Islam Salama ,  Charan Gurumurthy

    发明人： Yonggang Li ,  Islam Salama ,  Charan Gurumurthy

    IPC分类号： H05K7/00

    CPC分类号： H05K3/422 ,  H05K3/0035 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0394 ,  H05K2201/09563 ,  Y10T29/49128 ,  Y10T29/49165

    摘要： A method of fabricating a substrate core structure, and a substrate core structure formed according to the method. The method includes: laser drilling a first set of via openings through a starting insulating layer; filling the first set of via openings with a conductive material to provide a first set of conductive vias; providing first and second patterned conductive layers on opposite sides of the starting insulating layer; providing a supplemental insulating layer onto the first patterned conductive layer; laser drilling a second set of via openings through the supplemental insulating layer; filling the second set of via openings with a conductive material to provide a second set of conductive vias; and providing a supplemental patterned conductive layer onto an exposed side of the supplemental insulating layer, the second set of conductive vias contacting the first patterned conductive layer and the supplemental patterned conductive layer at opposite sides thereof.

    摘要翻译： 一种制造衬底芯结构的方法，以及根据该方法形成的衬底芯结构。 该方法包括：通过起始绝缘层激光钻探第一组通路孔; 用导电材料填充第一组通孔开口以提供第一组导电通孔; 在起始绝缘层的相对侧上提供第一和第二图案化导电层; 在所述第一图案化导电层上提供补充绝缘层; 激光钻穿通过补充绝缘层的第二组通孔; 用导电材料填充第二组通孔开口以提供第二组导电通路; 以及在所述补充绝缘层的暴露侧上提供补充图案化导电层，所述第二组导电通孔在其相对侧与所述第一图案化导电层和所述补充图案化导电层接触。

    Method of forming a multilayer substrate core structure using sequential microvia laser drilling and substrate core structure formed according to the method
    7.
    发明授权
    Method of forming a multilayer substrate core structure using sequential microvia laser drilling and substrate core structure formed according to the method 有权
    使用顺序微孔激光钻孔和根据该方法形成的基底芯结构形成多层基片芯结构的方法

    公开(公告)号：US08877565B2

    公开(公告)日：2014-11-04

    申请号：US11769852

    申请日：2007-06-28

    申请人： Yonggang Li ,  Islam Salama ,  Charan Gurumurthy

    发明人： Yonggang Li ,  Islam Salama ,  Charan Gurumurthy

    IPC分类号： H01L21/00 ,  H05K3/46 ,  H05K3/42 ,  H05K3/00

    CPC分类号： H05K3/422 ,  H05K3/0035 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0394 ,  H05K2201/09563 ,  Y10T29/49128 ,  Y10T29/49165

    摘要： A method of fabricating a substrate core structure, and a substrate core structure formed according to the method. The method includes: laser drilling a first set of via openings through a starting insulating layer; filling the first set of via openings with a conductive material to provide a first set of conductive vias; providing first and second patterned conductive layers on opposite sides of the starting insulating layer; providing a supplemental insulating layer onto the first patterned conductive layer; laser drilling a second set of via openings through the supplemental insulating layer; filling the second set of via openings with a conductive material to provide a second set of conductive vias; and providing a supplemental patterned conductive layer onto an exposed side of the supplemental insulating layer, the second set of conductive vias contacting the first patterned conductive layer and the supplemental patterned conductive layer at opposite sides thereof.

    摘要翻译： 一种制造衬底芯结构的方法，以及根据该方法形成的衬底芯结构。 该方法包括：通过起始绝缘层激光钻探第一组通路孔; 用导电材料填充第一组通孔开口以提供第一组导电通孔; 在起始绝缘层的相对侧上提供第一和第二图案化导电层; 在所述第一图案化导电层上提供补充绝缘层; 激光钻穿通过补充绝缘层的第二组通孔; 用导电材料填充第二组通孔开口以提供第二组导电通路; 以及在所述补充绝缘层的暴露侧上提供补充图案化导电层，所述第二组导电通孔在其相对侧与所述第一图案化导电层和所述补充图案化导电层接触。

    SUBSTRATES FOR OPTICAL DIE STRUCTURES
    8.
    发明申请
    SUBSTRATES FOR OPTICAL DIE STRUCTURES 有权
    光学结构基板

    公开(公告)号：US20090238516A1

    公开(公告)日：2009-09-24

    申请号：US12052637

    申请日：2008-03-20

    申请人： Omar J. Bchir ,  Islam Salama ,  Charan Gurumurthy ,  Houssam Jomaa ,  Ravi Nalla ,  Yonggang Li

    发明人： Omar J. Bchir ,  Islam Salama ,  Charan Gurumurthy ,  Houssam Jomaa ,  Ravi Nalla ,  Yonggang Li

    IPC分类号： G02B6/40 ,  B29D11/00 ,  B05D5/06

    CPC分类号： G02B6/4201 ,  G02B6/4214 ,  G02B6/4228 ,  G02B6/4249 ,  G02B6/43

    摘要： Package substrates for optical die structures are generally described. In one example, an apparatus includes a package substrate having one or more plated through hole (PTH) structures, an optical waveguide coupled with the package substrate, the optical waveguide having one or more input/output (I/O) optical signal pathways to route I/O signals to and from the package substrate, and one or more optical fibers coupled with the optical waveguide, the one or more optical fibers being disposed in the PTH structures to route I/O signals to and from a motherboard.

    摘要翻译： 通常描述用于光学模具结构的封装衬底。 在一个示例中，设备包括具有一个或多个电镀通孔（PTH）结构的封装衬底，与封装衬底耦合的光波导，光波导具有一个或多个输入/输出（I / O）光信号通路 将I / O信号传送到封装衬底和从封装衬底传输I / O信号，以及与光波导耦合的一个或多个光纤，一个或多个光纤被布置在PTH结构中以将I / O信号传送到母板或从母板传送I / O信号。

    Substrates for optical die structures
    9.
    发明授权
    Substrates for optical die structures 有权
    光学模具结构用基板

    公开(公告)号：US07583871B1

    公开(公告)日：2009-09-01

    申请号：US12052637

    申请日：2008-03-20

    申请人： Omar J. Bchir ,  Islam Salama ,  Charan Gurumurthy ,  Houssam Jomaa ,  Ravi Nalla ,  Yonggang Li

    发明人： Omar J. Bchir ,  Islam Salama ,  Charan Gurumurthy ,  Houssam Jomaa ,  Ravi Nalla ,  Yonggang Li

    IPC分类号： G02B6/12 ,  H01L21/00

    CPC分类号： G02B6/4201 ,  G02B6/4214 ,  G02B6/4228 ,  G02B6/4249 ,  G02B6/43

    摘要： Package substrates for optical die structures are generally described. In one example, an apparatus includes a package substrate having one or more plated through hole (PTH) structures, an optical waveguide coupled with the package substrate, the optical waveguide having one or more input/output (I/O) optical signal pathways to route I/O signals to and from the package substrate, and one or more optical fibers coupled with the optical waveguide, the one or more optical fibers being disposed in the PTH structures to route I/O signals to and from a motherboard.

    摘要翻译： 通常描述用于光学模具结构的封装衬底。 在一个示例中，设备包括具有一个或多个电镀通孔（PTH）结构的封装衬底，与封装衬底耦合的光波导，光波导具有一个或多个输入/输出（I / O）光信号通路 将I / O信号传送到封装衬底和从封装衬底传输I / O信号，以及与光波导耦合的一个或多个光纤，一个或多个光纤被布置在PTH结构中以将I / O信号传送到母板或从母板传送I / O信号。

    Hybrid-core through holes and vias
    10.
    发明授权
    Hybrid-core through holes and vias 有权
    混合核心通孔和通孔

    公开(公告)号：US08552564B2

    公开(公告)日：2013-10-08

    申请号：US12964457

    申请日：2010-12-09

    申请人： Mihir K. Roy ,  Islam Salama ,  Yonggang Li

    发明人： Mihir K. Roy ,  Islam Salama ,  Yonggang Li

    IPC分类号： H01L23/48

    CPC分类号： H05K3/422 ,  G06F1/183 ,  H01L23/492 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2924/0002 ,  Y10T29/49165 ,  H01L2924/00

    摘要： A semiconductor device substrate includes a front section and back section that are laminated cores disposed on a front- and back surfaces of a first core. The first core has a cylindrical plated through hole that has been metal plated and filled with air-core material. The front- and back sections have laser-drilled tapered vias that are filled with conductive material and that are coupled to the plated through hole. The back section includes an integral inductor coil that communicates to the front section. The first core and the laminated-cores form a hybrid-core semiconductor device substrate with an integral inductor coil.

    摘要翻译： 半导体器件基板包括前部和后部，其是设置在第一芯的前表面和后表面上的层叠芯。 第一芯具有圆柱形电镀通孔，其已被金属电镀并填充有空芯材料。 前部和后部具有激光钻孔的锥形通孔，其填充有导电材料并且连接到电镀通孔。 后部包括与前部连通的整体电感线圈。 第一芯和层叠芯形成具有集成电感线圈的混合芯半导体器件衬底。