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    Optical Resin Sheet and Liquid Crystal Cell Substrate Including the Same, Liquid Crystal Display Device, Substrate for an Image Display Device, and Image Display Device
    3.
    发明申请
    Optical Resin Sheet and Liquid Crystal Cell Substrate Including the Same, Liquid Crystal Display Device, Substrate for an Image Display Device, and Image Display Device 有权
    光学树脂片和包括其的液晶电池基板，液晶显示装置，用于图像显示装置的基板和图像显示装置

    公开(公告)号：US20090015781A1

    公开(公告)日：2009-01-15

    申请号：US10576583

    申请日：2004-08-31

    申请人： Kiichi Shimodaira ,  Yoshimasa Sakata ,  Yuuzou Akada ,  Tadaaki Harada

    发明人： Kiichi Shimodaira ,  Yoshimasa Sakata ,  Yuuzou Akada ,  Tadaaki Harada

    IPC分类号： G02F1/1333 ,  B32B5/02

    CPC分类号： C08J5/08 ,  G02F1/133305 ,  Y10T428/249921 ,  Y10T428/249946 ,  Y10T428/24995 ,  Y10T442/2992

    摘要： An optical resin sheet includes a cured resin layer containing glass fiber, wherein the ratio of the elastic modulus of the glass fiber to the elastic modulus of a cured resin material, which forms the cured resin layer, is 25 or more. With the thus arranged optical resin sheet, stress is applied to the glass fiber, thereby reducing the phenomenon of occurrence of birefringence, and when it is applied to a display device, there is achieved a significantly small light leakage in an oblique direction. The optical resin sheet is capable of achieving excellent display quality of an image display device such as a liquid crystal display device, as well as keeping the coefficient of thermal expansion lower and the mechanical strength higher.

    摘要翻译： 光学树脂片包括含玻璃纤维的固化树脂层，其中玻璃纤维的弹性模量与形成固化树脂层的固化树脂材料的弹性模量之比为25以上。 通过这样配置的光学树脂片，对玻璃纤维施加应力，由此减少双折射的发生现象，并且当应用于显示装置时，在倾斜方向上实现明显的小的漏光。 光学树脂片能够实现液晶显示装置等图像显示装置的优异的显示质量，并且保持热膨胀系数更低，机械强度更高。

    Composition of epoxy resin, anhydride and microcapsule accelerator
    8.
    发明授权
    Composition of epoxy resin, anhydride and microcapsule accelerator 失效
    环氧树脂，酸酐和微胶囊加速剂的组成

    公开(公告)号：US06555602B1

    公开(公告)日：2003-04-29

    申请号：US09680531

    申请日：2000-10-06

    申请人： Tadaaki Harada ,  Toshitsugu Hosokawa

    发明人： Tadaaki Harada ,  Toshitsugu Hosokawa

    IPC分类号： C08K718

    CPC分类号： C08L63/00 ,  C08G59/42 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

    摘要： The present invention provides a resin composition for semiconductor encapsulation excellent in reliability in humidity resistance and storage stability as well as in dischargeability and coatability, a semiconductor device encapsulated with the resin composition for semiconductor encapsulation and a process for the production of the semiconductor device. The resin composition for semiconductor encapsulation comprises the following components (A) to (D) and has a viscosity of 700 Pa•s or higher at 25° C. and 500 Pa•s or lower at 80° C.: (A) an epoxy resin; (B) an acid anhydride-based curing agent; (C) a latent curing accelerator; and (D) an inorganic filler.

    摘要翻译： 本发明提供了一种用于半导体封装的树脂组合物，其耐湿性和储存稳定性以及放电性和可涂布性的可靠性优异，用半导体封装用树脂组合物封装的半导体器件和半导体器件的制造方法。 用于半导体封装的树脂组合物包含以下组分（A）至（D），并且在25℃下具有700Pa.s或更高的粘度，在80℃下具有500Pa.s或更低的粘度。（A） 环氧树脂;（B）酸酐类固化剂;（C）潜伏性固化促进剂; 和（D）无机填料。

    Modified alkyl-terminated encapsulant for semiconductor of epoxy resin and polyethylene oxide
    9.
    发明授权
    Modified alkyl-terminated encapsulant for semiconductor of epoxy resin and polyethylene oxide 失效
    用于环氧树脂和聚环氧乙烷半导体的改性烷基封端的密封剂

    公开(公告)号：US6001483A

    公开(公告)日：1999-12-14

    申请号：US669317

    申请日：1996-09-23

    申请人： Tadaaki Harada ,  Shinjirou Uenishi ,  Hirokatsu Kouyama ,  Takahiko Maruhashi ,  Katsumi Shimada ,  Satoshi Tanigawa

    发明人： Tadaaki Harada ,  Shinjirou Uenishi ,  Hirokatsu Kouyama ,  Takahiko Maruhashi ,  Katsumi Shimada ,  Satoshi Tanigawa

    IPC分类号： C08G59/40 ,  C08L63/00 ,  C08L71/02 ,  H01L23/29 ,  H01L23/31 ,  H01L31/0203 ,  B32B27/18 ,  B32B27/26 ,  B32B27/38

    CPC分类号： H01L31/0203 ,  C08L63/00 ,  C08L71/02 ,  H01L23/293 ,  H01L2924/0002 ,  H01L33/56 ,  Y10T428/31511

    摘要： A composition useful as an encapsulating material for photosemiconductor elements such as a photodetector or light emmitor comprises an epoxy resin, a hardener and at least one compound represented by the following general formula (1) or (2):CH.sub.3 CH.sub.2 --(--CH.sub.2 --CH.sub.2 --).sub.x --CH.sub.2 --CH.sub.2 --O--(--CH.sub.2 --CH.sub.2 --O--).sub.n --Y.sub.1 (1)[CH.sub.3 CH.sub.2 --(--CH.sub.2 --CH.sub.2 --).sub.x --CH.sub.2 --CH.sub.2 --O--(--CH.sub.2 --CH.sub.2 --O--).sub.n --RCOO--].sub.m --Y.sub.2(2)wherein Y.sub.1 represents --H, --RCOOH, --COR' or --R'; R' is an alkyl group with not more than 30 carbon atoms; R is a divalent organic group; Y.sub.2 represents a metal atom having a valence of at least one; the mean value for x is from 8-200; and n is set such that the weight ratio of the repeating unit --CH.sub.2 --CH.sub.2 --O-- accounts for from 25-95% by weight based on the whole compound; and m is a positive integer corresponding to the valence of Y.sub.2.

    摘要翻译： PCT No.PCT / JP95 / 02262 Sec。 371日期1996年9月23日 102（e）日期1996年9月23日PCT提交1995年11月7日PCT公布。 WO96 / 15191 PCT出版物 日期1996年5月23日作为光半导体元件如光检测器或发光体的封装材料有用的组合物包含环氧树脂，硬化剂和至少一种由以下通式（1）或（2）表示的化合物：CH 3 CH 2（ -CH 2 -CH 2 - ）x-CH 2 -CH 2 -O - （ - CH 2 -CH 2 -O-）n-Y1（1）[CH 3 CH 2 - （ - CH 2 -CH 2 - ）x -CH 2 -CH 2 -O - （ - CH 2 -CH 2 -O - ）n -RCOO - ] m-Y2（2）其中Y1表示-H，-RCOOH，-COR'或-R'; R'是不大于30个碳原子的烷基; R是二价有机基团; Y2表示具有至少1价的金属原子; x的平均值为8-200; 并且n被设定为使得重复单元-CH 2 -CH 2 -O-的重量比基于整个化合物占25-95重量％ m是与Y2的化合价对应的正整数。

    Photosemiconductor device and epoxy resin composition for use in molding photosemiconductor
    10.
    发明授权
    Photosemiconductor device and epoxy resin composition for use in molding photosemiconductor 失效
    光半导体器件和用于成型光半导体的环氧树脂组合物

    公开(公告)号：US5107327A

    公开(公告)日：1992-04-21

    申请号：US553284

    申请日：1990-07-17

    申请人： Syuuji Nishimori ,  Tadaaki Harada ,  Yasuhiko Yamamoto ,  Nobuyuki Hiromori ,  Yasumori Yoshimura ,  Katsuya Muramatsu ,  Katsumi Shimada

    发明人： Syuuji Nishimori ,  Tadaaki Harada ,  Yasuhiko Yamamoto ,  Nobuyuki Hiromori ,  Yasumori Yoshimura ,  Katsuya Muramatsu ,  Katsumi Shimada

    IPC分类号： C08G59/24 ,  C08G59/42 ,  C08L63/00 ,  H01L31/0203 ,  H01L31/0232

    CPC分类号： H01L31/0232 ,  C08G59/245 ,  C08G59/4215 ,  C08L63/00 ,  H01L31/0203 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265

    摘要： A photosemiconductor device and an epoxy resin composition for use in molding a photosemiconductor used for the photosemiconductor device, the photosemiconductor device comprises a photosemiconductor element molded with a cured transparent epoxy resin composition, the cured transparent epoxy resin composition having a refractive index distribution curve characterized by the following (A), (B), and (C):(A) the refractive index difference X between refractive index values (b) and (c), which respectively are lower and higher than refractive index value (a) corresponding to the maximum peak of the refractive index distribution curve and respectively correspond to those points on the refractive index distribution curve which have a relative height of 20 with the height of the maximum peak being taken as 100, is 0.0018 or less;(B) the refractive index difference Y, which is the larger one of the difference between the refractive index values (a) and (b) and the difference between the refractive index values (a) and (c), is 0.0012 or less; and(C) in the case where the refractive index distribution curve has other peak or peaks than the maximum peak corresponding to the refractive index value (a), the refractive index difference Z, which is the largest one of the differences between the refractive index value (a) and refractive index values (d, . . . d.sub.n) corresponding to the other peak or peaks, is 0.0010 or less.

    摘要翻译： 一种光半导体装置和用于模制用于光半导体装置的光半导体的环氧树脂组合物，该光半导体装置包括用固化的透明环氧树脂组合物模制的光半导体元件，该固化的透明环氧树脂组合物具有折射率分布曲线，其特征在于 （A），（B）和（C）：（A）折射率值（b）和（c）之间的折射率差X分别低于和高于对应于 折射率分布曲线的最大峰值分别对应于折射率分布曲线上具有相对高度为20，最大峰值的高度为100的那些点为0.0018或更小; （B）折射率值（a）和（b）之差大于折射率值（a）和（c）之差的折射率差Y为0.0012以下; 和（C）在折射率分布曲线具有与折射率值（a）对应的最大峰值以外的其它峰值或峰值的情况下，折射率差Z是折射率 对应于其他峰或峰的值（a）和折射率值（d，...，dn）为0.0010以下。