SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

    公开(公告)号:US20250038016A1

    公开(公告)日:2025-01-30

    申请号:US18707165

    申请日:2022-09-28

    Abstract: The present inventive concept relates to a substrate processing apparatus and a substrate processing method, which can accurately measure temperature in even a low-temperature region, thus making it possible to efficiently manage heat. The substrate processing apparatus comprises: a chamber for providing a processing space in which a substrate is processed; a substrate support provided in the processing space of the chamber in order to support the substrate; a heater provided with a plurality of semiconductor laser modules that emit light toward a first surface of the substrate; and a pyrometer which is provided on the side of a second surface of the substrate facing the first surface and detects light emitted from the substrate to measure the temperature of the substrate. The main light-emitting wavelength of the plurality of semiconductor laser modules may be shorter than the measurement wavelength of the pyrometer.

    Thin film manufacturing apparatus

    公开(公告)号:US11967492B2

    公开(公告)日:2024-04-23

    申请号:US17495796

    申请日:2021-10-06

    CPC classification number: H01J37/32899 C23C16/5096 H01J37/3244 H01J37/32568

    Abstract: The present disclosure relates to a thin film manufacturing apparatus including a chamber having an inner process space of a substrate, a substrate support unit connected to the chamber to support the substrate in the chamber, a heat source unit connected to the chamber and disposed opposite to the substrate support unit, a plasma generation unit connected to one side of the chamber to supply radicals between the substrate support unit and the heat source unit, and a baffle connected to the chamber and including a movement passage of the radicals therein and a plurality of first exhaust holes communicating with the movement passage, which are formed in a top surface thereof. The thin film manufacturing apparatus may improve uniformity of the thin film formed on the substrate.

    THIN FILM MANUFACTURING APPARATUS

    公开(公告)号:US20220122824A1

    公开(公告)日:2022-04-21

    申请号:US17495796

    申请日:2021-10-06

    Abstract: The present disclosure relates to a thin film manufacturing apparatus including a chamber having an inner process space of a substrate, a substrate support unit connected to the chamber to support the substrate in the chamber, a heat source unit connected to the chamber and disposed opposite to the substrate support unit, a plasma generation unit connected to one side of the chamber to supply radicals between the substrate support unit and the heat source unit, and a baffle connected to the chamber and including a movement passage of the radicals therein and a plurality of first exhaust holes communicating with the movement passage, which are formed in a top surface thereof. The thin film manufacturing apparatus may improve uniformity of the thin film formed on the substrate.

    Apparatus for manufacturing semiconductor device and method for manufacturing semiconductor device using same

    公开(公告)号:US10106914B2

    公开(公告)日:2018-10-23

    申请号:US15081836

    申请日:2016-03-25

    Abstract: The present disclosure controls the heat source unit such that a to-be-processed object in which a hydrogen-containing to-be-processed layer is formed is irradiated with light in two stages, and thus the electrical characteristics of a semiconductor device may be suppressed and prevented from being deteriorated due to hydrogen. That is, ultraviolet light (UV) which is firstly radiated may induce a chemical reaction for separating Si—H bonds in the to-be-processed layer, and infrared light (IR) which is secondly radiated may induce a thermal reaction for vaporizing the separated hydrogen from the Si—H bonds. As such, both a chemical reaction for separating bonds of hydrogen and other ions in the to-be-processed layer and a thermal reaction for vaporizing hydrogen are performed, and thus hydrogen may be more easily removed than a temperature at which hydrogen is vaporized from the to-be-processed layer by only a thermal reaction.

    Apparatus and method for cleaning photomask
    7.
    发明授权
    Apparatus and method for cleaning photomask 有权
    用于清洁光掩模的设备和方法

    公开(公告)号:US09400425B2

    公开(公告)日:2016-07-26

    申请号:US14255557

    申请日:2014-04-17

    CPC classification number: G03F1/82 B08B7/0042

    Abstract: This invention relates to an apparatus and method for cleaning a photomask. This apparatus, suitable for use in removing an adhesive residue from a photomask, includes a photomask disposed such that a surface thereof on which an adhesive residue is left behind is directed downwards, a metal plate formed adjacent to the adhesive residue, and a laser generator for irradiating a laser onto the metal plate so that the adhesive residue is removed by heat generated from the metal plate.

    Abstract translation: 本发明涉及一种清洁光掩模的装置和方法。 适用于从光掩模中去除粘合剂残留物的该装置包括光掩模,该光掩模被设置为使得其上残留有粘合剂残留物的表面向下指向,邻近粘合残渣形成的金属板,以及激光发生器 用于将激光照射到金属板上,使得通过从金属板产生的热量去除粘合剂残留物。

    Heater block for a rapid thermal processing apparatus
    8.
    发明授权
    Heater block for a rapid thermal processing apparatus 有权
    加热器块用于快速热处理设备

    公开(公告)号:US08913884B2

    公开(公告)日:2014-12-16

    申请号:US13391410

    申请日:2010-08-04

    CPC classification number: H05B3/744

    Abstract: The present invention relates to a heater block for a rapid thermal processing apparatus, and more particularly, to a heater block in which heating lamps are densely arranged in a tessellation. The tessellation has a structure such that the plurality of heating lamps are arranged at right angles to form a zigzag line, and the thus-formed zigzagged line is repeated such that the zigzagged line is combined with the adjacent zigzagged line. According to the present invention, a temperature gradient caused by a void between heating lamps is prevented, and heating lamps are densely arranged to increase heat density for a heat radiation area as opposed to conventional heater blocks, thus achieving improved heat treatment efficiency using less energy. In addition, fully uniform temperature control is enabled, in terms of sector allocated temperature control, even when the area to be independently controlled is enlarged as opposed to conventional heater blocks, thereby simplifying the configuration of a temperature control circuit.

    Abstract translation: 本发明涉及一种用于快速热处理装置的加热器块,更具体地说,涉及一种加热块,其中加热灯密集地布置成镶嵌。 该细分具有这样的结构,使得多个加热灯以直角排列以形成之字形线,并且重复如此形成的之字形线,使得之字形线与相邻之字形线组合。 根据本发明,防止了由加热灯之间的空隙引起的温度梯度,与传统的加热器块相比,加热灯密集地布置成增加了散热面积的热密度,从而使用更少的能量来实现提高的热处理效率 。 此外,就扇区分配的温度控制而言,即使独立控制的区域与常规的加热器块相反,也能够进行完全均匀的温度控制,从而简化了温度控制电路的结构。

    HEATER BLOCK FOR A RAPID THERMAL PROCESSING APPARATUS IN WHICH A COOLING WATER FLOW IS DIVIDED INTO AN UPPER LAYER AND A LOWER LAYER
    9.
    发明申请
    HEATER BLOCK FOR A RAPID THERMAL PROCESSING APPARATUS IN WHICH A COOLING WATER FLOW IS DIVIDED INTO AN UPPER LAYER AND A LOWER LAYER 审中-公开
    用于快速热处理装置的加热器块,其中冷却水流分为上层和下层

    公开(公告)号:US20120213499A1

    公开(公告)日:2012-08-23

    申请号:US13391431

    申请日:2010-08-04

    CPC classification number: H01L21/67109 F27B17/0025 H01L21/67115

    Abstract: The present invention relates to a heater block for a rapid thermal processing apparatus, wherein a plurality of lamp pockets (21) for accommodating heating lamps are arranged, and cooling water inlet ports (111a, 111b) and cooling water outlet ports (112a, 112b) are arranged such that the lamp pockets (21) are cooled by the flow of the cooling water fed via the cooling water inlet ports (111a, 111b) and discharged via the cooling water outlet ports (112a, 112b). In detail, the cooling water inlet ports (111a, 111b) and the cooling water outlet ports (112a, 112b) are separately arranged into an upper layer and a lower layer, such that the flow of the cooling water fed via the cooling water inlet ports (111a, 111b) and discharged via the cooling water outlet ports (112a, 112b) is divided into an upper layer and a lower layer. Preferably, cooling water dispersion means (140) are installed at entries of the cooling water inlet ports (111a, 111b) so as to disperse the cooling water in a lateral direction. According to the present invention, the cooling water flows separately in the upper layer and the lower layer to improve cooling efficiency, and particularly, lower portions of the lamp pockets, in which heat discharged by the heating lamps is concentrated, can be maximally cooled. In addition, the cooling water dispersion means prevents the formation of a dead zone, thereby uniformly cooling the entirety of the heater block.

    Abstract translation: 本发明涉及一种用于快速热处理设备的加热器块,其中布置有多个用于容纳加热灯的灯泡(21),冷却水入口(111a,111b)和冷却水出口(112a,112b) )被布置成使得灯泡(21)通过经由冷却水入口(111a,111b)供给的冷却水的流动被冷却,并经由冷却水出口(112a,112b)排出。 详细地说,冷却水入口(111a,111b)和冷却水出口(112a,112b)分别设置在上层和下层中,使得经由冷却水入口 经由冷却水出口(112a,112b)排出的端口(111a,111b)分为上层和下层。 优选地,冷却水分散装置(140)安装在冷却水入口(111a,111b)的入口处,以便沿横向分散冷却水。 根据本发明,冷却水分别在上层和下层中流动,以提高冷却效率,特别是可以最大限度地冷却由加热灯排出的热量的灯泡的下部。 此外,冷却水分散装置防止形成死区,从而均匀地冷却整个加热器块。

    HEATER BLOCK FOR A RAPID THERMAL PROCESSING APPARATUS
    10.
    发明申请
    HEATER BLOCK FOR A RAPID THERMAL PROCESSING APPARATUS 有权
    用于快速热处理装置的加热器块

    公开(公告)号:US20120207456A1

    公开(公告)日:2012-08-16

    申请号:US13391410

    申请日:2010-08-04

    CPC classification number: H05B3/744

    Abstract: The present invention relates to a heater block for a rapid thermal processing apparatus, and more particularly, to a heater block in which heating lamps are densely arranged in a tessellation. The tessellation has a structure such that the plurality of heating lamps are arranged at right angles to form a zigzag line, and the thus-formed zigzagged line is repeated such that the zigzagged line is combined with the adjacent zigzagged line. According to the present invention, a temperature gradient caused by a void between heating lamps is prevented, and heating lamps are densely arranged to increase heat density for a heat radiation area as opposed to conventional heater blocks, thus achieving improved heat treatment efficiency using less energy. In addition, fully uniform temperature control is enabled, in terms of sector allocated temperature control, even when the area to be independently controlled is enlarged as opposed to conventional heater blocks, thereby simplifying the configuration of a temperature control circuit.

    Abstract translation: 本发明涉及一种用于快速热处理装置的加热器块,更具体地说,涉及一种加热块,其中加热灯密集地布置成镶嵌。 该细分具有这样的结构,使得多个加热灯以直角排列以形成之字形线,并且重复如此形成的之字形线,使得之字形线与相邻之字形线组合。 根据本发明,防止了由加热灯之间的空隙引起的温度梯度,与传统的加热器块相比,加热灯密集地布置成增加了散热面积的热密度,从而使用更少的能量来实现提高的热处理效率 。 此外,就扇区分配的温度控制而言,即使独立控制的区域与常规的加热器块相反,也能够进行完全均匀的温度控制,从而简化了温度控制电路的结构。

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