公开(公告)号：US12106949B2

公开(公告)日：2024-10-01

申请号：US17598473

申请日：2019-09-20

申请人： JX Nippon Mining & Metals Corporation

发明人： Yuki Furuya

IPC分类号： H01J37/34 ,  B22F3/10 ,  C22C5/04 ,  C22C19/07 ,  C22C30/00 ,  C22C32/00 ,  C23C14/34

CPC分类号： H01J37/3429 ,  B22F3/10 ,  C22C5/04 ,  C22C19/07 ,  C22C30/00 ,  C22C32/0015 ,  C23C14/3414 ,  B22F2301/15 ,  B22F2301/25 ,  C22C2202/02

摘要： Provided is a sputtering target capable of reducing generation of particles, and a method for producing the same. The sputtering target includes: 10 mol % or more and 85 mol % or less of Co, 0 mol % or more and 47 mol % or less of Pt, and 0 mol % or more and 47 mol % or less of Cr, as metal components; and at least B6O as an oxide component.

公开(公告)号：US12090518B2

公开(公告)日：2024-09-17

申请号：US17599236

申请日：2020-03-27

申请人： JX ADVANCED METALS CORPORATION

发明人： Katsushi Aoki ,  Hidetoshi Sasaoka

IPC分类号： B09B3/35 ,  B02C23/20 ,  B07B4/02 ,  B07B4/08 ,  B07B9/00 ,  B09B101/17

CPC分类号： B07B4/02 ,  B02C23/20 ,  B07B4/08 ,  B07B9/00 ,  B09B3/35 ,  B09B2101/17

摘要： Provided is a method for processing electronic and electrical device component scrap, which can improve an efficiency of sorting of raw materials fed to the smelting step from electronic and electrical device component scrap, and reduce losses of valuable metals. A method for processing electronic and electrical device component scrap which includes sorting electronic and electrical device component scrap by wind powder sorting to remove plate-shaped materials containing valuable metals included in the electronic and electrical device component scrap, and then sorting the resulting sorted objects by magnetic sorting.

公开(公告)号：US12132289B2

公开(公告)日：2024-10-29

申请号：US17288403

申请日：2020-01-06

申请人： JX Advanced Metals Corporation

发明人： Masahiro Takahata ,  Hideaki Fukuyo ,  Toru Imori ,  Koichi Takemoto

IPC分类号： H01S3/038 ,  C22F1/08 ,  H01S3/225

CPC分类号： H01S3/0388 ,  C22F1/08 ,  H01S3/2251 ,  H01S3/2256

摘要： A copper electrode material comprising Cu and unavoidable impurities, wherein the content of the unavoidable impurities is 1 ppm by mass or less and the average crystal grain diameter is 100 μm or less. A copper-containing electrode material having improved corrosion resistance is provided by the copper electrode material.

公开(公告)号：US12129529B2

公开(公告)日：2024-10-29

申请号：US17287205

申请日：2020-02-27

申请人： JX Nippon Mining & Metals Corporation

发明人： Takahiro Uchida ,  Toru Imori ,  Koichi Takemoto ,  Shiro Tsukamoto

IPC分类号： C22C13/00 ,  B65D81/20

CPC分类号： C22C13/00 ,  B65D81/2007

摘要： In the present invention, a high-purity metallic tin suitable for use in an EUV exposure device is provided through use of an oxidation-resistant metallic tin, the oxidation-resistant metallic tin containing 99.995 mass % or more of tin, and unavoidable impurities, and the thickness of an oxide film being 2.0 nm or less when the surface of a cut face of the oxidation-resistant metallic tin is measured by AES.

公开(公告)号：US12091743B2

公开(公告)日：2024-09-17

申请号：US18016812

申请日：2021-07-28

申请人： JX Nippon Mining & Metals Corporation

发明人： Yasuyuki Iwabuchi

IPC分类号： C23C14/34 ,  C04B35/58 ,  C04B35/64 ,  C23C14/06 ,  G11B5/851 ,  H01J37/34

CPC分类号： C23C14/3414 ,  C04B35/58014 ,  C04B35/58021 ,  C04B35/64 ,  C23C14/0652 ,  G11B5/851 ,  H01J37/3429 ,  H01J37/3491 ,  C04B2235/3206 ,  C04B2235/3826 ,  C04B2235/3856 ,  C04B2235/3873 ,  C04B2235/3886 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/656 ,  H01J2237/332

摘要： A sputtering target containing silicon nitride (Si3N4) with reduced specific resistance of is provided. A sputtering target including Si3N4, SiC, MgO and TiCN, wherein a specific resistance of the sputtering target is 10 mΩ·cm or less.

公开(公告)号：US12108583B2

公开(公告)日：2024-10-01

申请号：US18265771

申请日：2021-09-28

申请人： JX Nippon Mining & Metals Corporation

发明人： Yukito Yamamoto

IPC分类号： H05K9/00

CPC分类号： H05K9/0084

摘要： An electromagnetic wave shielding material includes a metal layer for ground connection provided as an outermost layer of a laminate; wherein only one surface of the metal layer for ground connection is laminated on the insulating layer via the adhesive layer, and assuming d1 is a thickness and ε1 is a Young's modulus of the adhesive layer on the one surface, d2 is a thickness and ε2 is a Young's modulus of the metal layer for ground connection, and ε3 is a composite Young's modulus of the adhesive layer on the one surface and the metal layer for ground connection, the following relational expression is satisfied: ε3/ε2>0.60; in which, ε3=ε1 (d1/(d1+d2))+ε2 (d2 (d1+d2)).

公开(公告)号：US12054822B2

公开(公告)日：2024-08-06

申请号：US17425386

申请日：2020-01-15

申请人： JX Nippon Mining & Metals Corporation

发明人： Kengo Kaminaga ,  Keijiro Sugimoto ,  Yuki Yamada ,  Shuhei Murata

IPC分类号： H01J37/34 ,  C23C14/34

CPC分类号： C23C14/3414 ,  H01J37/3423

摘要： The disclosure is related to reducing the cost of sputtering target products. Provided is a sputtering target product wherein: the sputtering target product includes a target, a backing plate or backing tube, and insert material layer; at least a part of the non-sputtering side of the target is profiled so as to have protrusions and recesses that have plane symmetry; the insert material layer is formed so as to adhere closely to the profiled side, and the insert material is made of metal with specific gravity that is at least less than those of the metal constituting the target.

公开(公告)号：US12107378B2

公开(公告)日：2024-10-01

申请号：US17286863

申请日：2019-10-28

申请人： JX Nippon Mining & Metals Corporation

发明人： Yoshiki Yamazaki ,  Makoto Mikami

IPC分类号： H01S5/00 ,  H01S3/06 ,  C03C4/08 ,  H01S3/16 ,  H01S3/17

CPC分类号： H01S3/0625 ,  H01S3/0612 ,  H01S3/0617 ,  C03C4/08 ,  H01S3/16 ,  H01S3/1643 ,  H01S3/17 ,  H01S2301/02

摘要： A light absorbing layer which is bonded to a laser medium to configure a bonded body, wherein the light absorbing layer is formed from a glass material and, in an oscillation wavelength (wavelength of 650 nm or more and less than 1400 nm) of the laser medium, an absorption coefficient is 0.1 to 10.0 cm−1, a difference in refractive index between the light absorbing layer and the laser medium is within ±0.1, and a difference in linear thermal expansion coefficient between the light absorbing layer and the laser medium is within ±1 ppm/K. The present invention relates to a light absorbing layer for preventing parasitic oscillation, and aims to provide a material capable of suppressing the manufacturing cost and which can be easily processed for preparing a bonded body.

公开(公告)号：US12037160B2

公开(公告)日：2024-07-16

申请号：US17795955

申请日：2021-01-22

申请人： JX Nippon Mining & Metals Corporation

发明人： Akira Sako ,  Yasunobu Miyata ,  Kazuhiko Kikuchi

IPC分类号： B65D19/00 ,  B65D5/44 ,  B65D5/50 ,  B65D5/68 ,  B65D19/20 ,  B65D19/36 ,  B65D19/44 ,  B65D85/66 ,  B65D85/672

CPC分类号： B65D19/0024 ,  B65D5/445 ,  B65D5/5021 ,  B65D5/68 ,  B65D19/20 ,  B65D19/36 ,  B65D19/44 ,  B65D85/66 ,  B65D85/672 ,  B65D2519/00019 ,  B65D2519/00054 ,  B65D2519/00124 ,  B65D2519/00159 ,  B65D2519/00194 ,  B65D2519/00273 ,  B65D2519/00288 ,  B65D2519/00293 ,  B65D2519/00323 ,  B65D2519/00333 ,  B65D2519/00437 ,  B65D2519/00452 ,  B65D2519/00502 ,  B65D2519/00562 ,  B65D2519/00582 ,  B65D2519/00621 ,  B65D2519/00641 ,  B65D2519/00711 ,  B65D2519/0082 ,  B65D2519/0094

摘要： Provided are a packaging container, a packaging method, and a method for carrying metal foil, which can suppress damage and deformation of the packaging container and enable stable carrying even if the packaging container is carried while suspending it in the midair. A packaging container made of corrugated cardboard includes: a pallet 2 having leg portions 21; a body frame 3 arranged on the pallet 2, the body frame 3 having bearing grooves 31 at end wall portions 32 opposing to each other; and a lid portion 4 provided on the body frame 3, wherein each of the leg portions 21 is arranged on an inner side than each of the end wall portions 23 of the pallet 2.