Abstract:
A semiconductor device is formed on a substrate having an ESD region and an internal region. A protective layer is formed over a portion of the ESD region to be protected from formation of silicide and suicide is formed on portions of the Internal and ESD region which remain unprotected by the protective layer. A portion of the protective layer is removed to form the remaining portions of the protective layer into sidewall spacers adjacent to a gate electrode included in the ESD region.
Abstract:
A micro vacuum tube includes a disk (7) having an axis and formed of successive planar layers of a first conductive layer (2), a first dielectric layer (3), a second conductive layer (4), and a second dielectric layer(5), a hole along the axis of the cylinder extends through the first dielectric layer (3), the second conductive layer (4), and the second dielectric layer (5), a cusp shaped microtip (62) centrally located over, and extending into, the hole is separated from and supported by, a pole (75) that rests on the second dielectric layer, and a cap (82) seals the microtip, the pole (75) and the hole in a permanent vacuum environment.
Abstract:
In a virtual ground semiconductor memory device such as an EPROM or a Flash EPROM, a program disturb inhibited unit is operatively connected to a memory array. The memory array includes a plurality of metal virtual ground and bit lines, with at least two bit line selection transistors connected to each of the metal lines. The program disturb inhibited is connected to each virtual ground line and each bit line. In this structure, one metal pitch is connected to two buried diffusion lines. The program inhibited unit includes a plurality of program disturb inhibited transistors, wherein each transistor is connected between a virtual ground and a bit line. A DWL and a DWR dummy line are connected to control the plurality of program disturb inhibited transistors. By combining the program disturb inhibit unit with the memory array, a conventional array structure which has only been suitable for MROM applications can be applied to an EPROM or a Flash EEPROM, allowing the cell size to be reduced.
Abstract:
A micro vacuum tube is described. The process for manufacturing it begins with the deposition of two layers of polysilicon or metal, separated by dielectric layers, topping them with a layer of silicon nitride, and forming these into the shape of a disk. A hole is etched in the silicon nitride and then lined with a spacer, causing the width of the hole to decrease from top to bottom. When the hole is partially filled with a sacrificial layer the latter has a depression at its center which may be used as a mold for a microtip. To allow for easy removal of the sacrificial layer, pole holes are etched in it. These become support poles after the microtip material has been deposited over the sacrificial layer (which gets removed in its entirety). As an alternative to a microtip, a micro razor edge may be used for the cold emitter. A cap deposited over the structure while it is in vacuo serves to keep it under permanent vacuum.
Abstract:
A mask read-only-memory cell structure without ROM code implantation is presented. By using double polysilicon technology, ROM code cells which store data "0" can be replaced by cells with double polysilicon layers and an insulating layer between them. Normal cells with double polysilicon layers but without an insulating layer between them form normal cells store data "1". According to the invention, further scaling of mask ROM is possible and operating condition can be released because of high junction breakdown voltage. Furthermore, the double polysilicon technology makes redundancy circuit more easily to implement.
Abstract:
A memory cell having an asymmetric source and drain connection to buried bit-lines providing a Fowler-Nordheim tunneling region and a non-tunneling region defined by a bird's beak encroachment on each of the cells. A nonvolatile semiconductor memory device comprising row and column arrangement of the cells in which adjacent columns of cells share a single bit-line. The method for manufacturing a memory cell having asymmetric source and drain regions and comprising the steps of: (1) forming a dielectric covering a semiconductor substrate of a first conductivity type; (2) forming a column of floating gates on the dielectric; (3) forming an inhibit mask adjacent a first side of the column of floating gates; (4) implanting a dopant adjacent the first side and a second side of the column of floating gates, the first dopant having a second conductivity type opposite the first conductivity type; (5) forming a thermal oxide adjacent the first and second side of the column of floating gates such that the dopant adjacent the first side of the column is separated from the floating gates by the dielectric and the dopant adjacent the second side of the column is separated from the floating gates by a bird's beak encroachment of the thermal oxide formation; and (6) completing formation of control gate dielectric and control gates.
Abstract:
The protection device of an electronic circuit is an electronic AC circuit protection device. The protection device has the characteristic of over-voltage protection, over-current protection, electronic switch, and soft start. Devices of the protection circuit are electronic box, electronic devices box, and power factor regulator that is designed in the structure of L.C. in parallel on the source side of the protection circuit. The protection circuit can be applied in switching power supply, electronic ballast, etc., electronic circuit devices. The main electrical electronic devices include Triac Thyristor, Silicon Controlled Rectifier, Phototriac Coupler and Photothyistor Coupler etc. The protection device has characteristic of standing surge current that solving the problem of life and reliability of electronic devices in now a day. The invention is a necessary protection device for electrical industrial.
Abstract:
A battery charging device capable of charging any variety of rechargeable batteries and capable of being powered by either a 110 volt or a 220 volt A.C. power source. The battery charging device comprises an integrator circuit having a D.C. power source; a voltage comparator; a solid state relay; a D.C. output circuit; a positive voltage feedback circuit; and a negative voltage feedback circuit. The integrator circuit receives A.C. power from an A.C. power source and provides an output to the voltage comparator. The voltage comparator, in turn, is connected so as to provide an output to the solid state relay. The solid state relay preferably includes a zero voltage closing circuit and provides an output to the D.C. output circuit. The D.C. output circuit is connected to a battery-to-be-charged and provides an output D.C. voltage thereto. The D.C. output circuit is also connected to and provides outputs to the negative and positive feedback circuits which, in turn, provide feedback to the voltage comparator. Preferably, optical coupling devices connect the output from the voltage comparator to the solid state relay, as well as the positive and negative feedback circuits to the voltage comparator.
Abstract:
A solid state relay having an input circuit and a triac Darlington circuit coupled by a phototriac circuit. The input circuit having a bipolar indicator lamp for identifying the polarity and presence of an input voltage. The phototriac circuit and the triac Darlington circuit each having bipolar indicator lamps to indicate ON/OFF operation of respective triacs therein.
Abstract:
A new computer controller is disclosed for controlling the output voltage of a SCR controller to a load. The computer controller includes a computer unit comprising a first pulse generator, a central processing unit, a first voltage comparator and a digital analog converter, and a control unit controlled by the computer unit and connected to the load through the SCR controller and consisting of a second pulse generator, an integrator circuit, a second voltage comparator, a turn-on circuit and a turn-off circuit.