Abstract:
A method for manufacturing a flash memory device includes: a) forming a stack gate pattern composed of a tunnel oxide layer, a floating gate, ONO layers, and a control gate on a semiconductor substrate; b) conformably forming a first sidewall oxide layer made of a silicon oxide layer along both sidewalls of the stack gate pattern; c) performing a plasma nitride process for forming a nitride barrier layer in the first sidewall oxide layer; d) forming a sidewall nitride layer on the first sidewall oxide layer; e) conformably forming a second sidewall oxide layer on the sidewall nitride layer; and f) performing an etching process for forming a spacer which includes the first sidewall oxide layer, the nitride barrier layer, the sidewall nitride layer, and the second sidewall oxide layer. The flash memory device prevents data from being lost via the spacer equipped with a nitride barrier layer, resulting in increased reliability of a desired flash memory device.
Abstract:
The present invention relates to an organic light emitting element and an organic light emitting device including the same. An impurity layer close to an electrode is doped with a small amount, and an impurity layer for a p-n junction is doped with a large amount, such that a high current may flow under a low voltage.
Abstract:
A display includes a substrate, a plurality of first and second signal lines formed on the substrate and insulated from each other, a plurality of driving voltage lines formed with a same layer as the first signal lines, at least one driving voltage connection formed with a same layer as the second signal lines, at least one connecting member electrically connecting the driving voltage lines and the driving voltage connection, at least one first thin film transistor connected to the first and second signal lines, at least one second thin film transistor connected to the first thin film transistor and the driving voltage lines, at least one first electrode connected to the second thin film transistors, at least one second electrode opposing the first electrode, at least one organic light emitting member formed between the first electrode and the second electrode, and at least one assistant member formed between the connecting member and the second electrode.
Abstract:
A phase shifting mask (PSM) for manufacturing a semiconductor device and a method of fabricating the same includes a transparent substrate, a main pattern formed on the transparent substrate and comprising a first phase shifting layer having a first optical transmittance greater than 0, and at least one assistant pattern formed on the transparent substrate proximal to the main pattern for phase-shifting by the same degree as the main pattern and having a second optical transmittance, which is less than the first optical transmittance.
Abstract:
Disclosed herein is a continuous electrolytic refining device for metal uranium, the device comprising a cathode section fixed to the lower side of the heat radiation plate, and having a plurality of graphite cathodes; an anode section encompassing the cathode section to face the cathode section, rotatably fixed to the lower side of the heat radiation plate, and receiving the used nuclear fuel; an electrolytic cell receiving the cathode section and the anode section and filled with electrolytes so as to sink the cathode section and the anode section; an uranium collecting section collecting metal uranium deposited on and detached from the graphite cathode in the lower side of the cathode section inside the electrolytic cell and withdrawing the collected metal uranium to the outside of the electrolytic cell; and a transition metal collecting section coupled with the lower side of the electrolytic cell to withdraw the transition metal particles released from the anode section and collected in the lower side of the electrolytic cell, in order to collect high pure uranium deposits and metal transition elements created in an electrolysis process without stopping an electrolysis process, not including a scrapping process.
Abstract:
In an optical member holder and a projection exposure apparatus having the same, a light beam radiated from a light source may be formed into light having a desired shape by selecting one of a plurality of optical elements. An optical element holder may include a support member to support the plurality of optical elements, a first driving section to move or rotate the support member to select one of the optical elements, and a second driving section to rotate the selected optical element to adjust an arrangement direction thereof. The light formed by the selected optical element may be directed through a reticle.
Abstract:
An evaporation apparatus that is capable of determining the amount of organic material that is used for deposition of an organic layer (e.g. in an OLED) is presented. The apparatus evaporates an organic material through multiple stages and and includes: an evaporation source that evaporates the organic material and includes a heat source, a substrate supporter that supports a substrate, a sensor that senses a degree of evaporation of the organic material, a controller that calculates a deposition thickness of the organic material that is deposited during the stabilization stage, the deposition stage and the cooling stage by using the degree of evaporation sensed by the sensor, and a usage amount calculator that calculates a usage amount of the organic material by using a conversion factor between the deposition thickness of the organic material and the usage amount of the organic material, and the deposition thickness calculated by the controller.
Abstract:
Apparatus and a method for forming a thin film including a vacuum chamber, a substrate holder located on the inner upper side of the vacuum chamber to secure a substrate, an evaporation source located on the inner lower side of the vacuum chamber to evaporate a deposition material, an evaporation source shutter substantially confining the deposition material evaporated to the evaporation source, a sensor located within the vacuum chamber to detect the thickness of the deposition material deposited on itself, and a calculation portion calculating the thickness of the deposition material deposited on the evaporation source shutter using data detected by the sensor.
Abstract:
Provided are an apparatus and method for moving a list on a picture plane. The apparatus for moving a list on a picture plane includes a centripetal acceleration control module providing acceleration in the direction in which an image moves, with respect to an amount of movement of the center of the image relative to the center of a picture plane of a digital device, a movement resistance control module calculating a resistance corresponding to the provided acceleration, and applying the resistance to the image, a picture plane movement parameter control module calculating the movement speed of the image displayed on the picture plane and the distance moved by the center of the image, based on at least one of a current input tilt angle, the acceleration value, and the resistance value, thereby updating the movement speed and the distance moved by the center of the image.
Abstract:
Disclosed is a method for forming salicide in a semiconductor device. The method comprises the steps of: forming a first and a second gate oxide film and in a non-salicide region and a salicide region, the first gate oxide film being thicker than the second gate oxide film; forming a conductive layer and a nitride based hard mask layer, and then selectively removing the conductive layer, the hard mask layer, the first gate oxide film, and the second gate oxide film, thereby forming gate electrodes and simultaneously exposing an active region of the salicide region; forming a spacer oxide film on an upper surface, except for the hard mask layer, of a second resultant structure; selectively removing the spacer oxide film, thereby forming a spacer and simultaneously exposing the active region of the salicide region; removing the hard mask layer; and forming a salicide film on the upper surfaces of the gate electrodes and on the surface of the active region in the salicide region. Therefore, a non-salicide region and a salicide region can be formed selectively and simultaneously in a one-chip semiconductor device, so that the number of steps for a salicide forming process can be reduced.